JPH0442748U - - Google Patents
Info
- Publication number
- JPH0442748U JPH0442748U JP1990083131U JP8313190U JPH0442748U JP H0442748 U JPH0442748 U JP H0442748U JP 1990083131 U JP1990083131 U JP 1990083131U JP 8313190 U JP8313190 U JP 8313190U JP H0442748 U JPH0442748 U JP H0442748U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- utility
- semiconductor chip
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Description
第１図は本考案の第１の実施例の構成図、第２
図は第１図のヒートパイプ部の拡大図、第３図は
従来の第１の構成例、第４図は従来の第２の構成
例、第５図は本考案の第２の実施例の構成図であ
る。
３……半導体チツプ、１２……ヒートパイプ、
１３……作動液、１４……ウイツク。
Figure 1 is a configuration diagram of the first embodiment of the present invention;
The figure is an enlarged view of the heat pipe section in Figure 1, Figure 3 is the first conventional configuration example, Figure 4 is the conventional second configuration example, and Figure 5 is the second embodiment of the present invention. FIG. 3...Semiconductor chip, 12...Heat pipe,
13... Hydraulic fluid, 14... Wick.
Claims (1)
イパツド部にヒートパイプを一体として設けたこ
とを特徴とする半導体装置。 A semiconductor device characterized in that a heat pipe is integrally provided in a die pad portion on which a semiconductor chip is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083131U JPH0442748U (en) | 1990-08-07 | 1990-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083131U JPH0442748U (en) | 1990-08-07 | 1990-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442748U true JPH0442748U (en) | 1992-04-10 |
Family
ID=31630545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083131U Pending JPH0442748U (en) | 1990-08-07 | 1990-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442748U (en) |
-
1990
- 1990-08-07 JP JP1990083131U patent/JPH0442748U/ja active Pending