JPH0442791A - electrostatic chuck board - Google Patents
electrostatic chuck boardInfo
- Publication number
- JPH0442791A JPH0442791A JP2145295A JP14529590A JPH0442791A JP H0442791 A JPH0442791 A JP H0442791A JP 2145295 A JP2145295 A JP 2145295A JP 14529590 A JP14529590 A JP 14529590A JP H0442791 A JPH0442791 A JP H0442791A
- Authority
- JP
- Japan
- Prior art keywords
- base
- attracting
- electrostatic chuck
- edge parts
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、対象物を吸着させた状態で移動させる静電
チャック基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrostatic chuck substrate that moves an object while holding it therein.
[従来の技術]
一般に、ある対象物を被対象物に取り付ける場合、その
対象物を被対象物に当接させ、接着等の方法によって固
定する。但し、次々に対象物を変換するような場合は着
脱時間の短い真空吸着等の手段によっている。ところが
この方法は空気中では問題ないが、真空中では使用でき
ないため、この場合は電界による吸引力を利用した静電
チャックが使用されている。[Prior Art] Generally, when attaching a certain object to a target object, the target object is brought into contact with the target object and fixed by a method such as adhesion. However, when converting objects one after another, a means such as vacuum suction, which requires a short attachment and detachment time, is used. However, although this method has no problems in air, it cannot be used in a vacuum, so in this case an electrostatic chuck that utilizes the attractive force of an electric field is used.
静電チャックは第6図に示すように基台2上の電極1を
絶縁膜3で覆ったもので、この絶縁膜は経済性等の理由
からスピンコートによって形成される。そして、電極に
供給した電圧子E、−Eによって電界が発生するので、
その電界によって対象物4に吸引力を与えるようになっ
ている。As shown in FIG. 6, the electrostatic chuck has an electrode 1 on a base 2 covered with an insulating film 3, and this insulating film is formed by spin coating for reasons such as economic efficiency. Then, an electric field is generated by the voltage elements E and -E supplied to the electrodes, so
The electric field applies an attractive force to the object 4.
[発明が解決しようとする課M]
しかしながら絶縁膜は液状の絶縁物を電極面に付着させ
た後に凝固させたものであるから、実際の絶縁物は第6
図のように理想的な形状に形成することはできず、第7
図に示すように周縁部に盛り上がり31ができ、この盛
り上がり31のために対象物を吸着させたときその対象
物とこの静電チャックの平面の間に距離dの隙間ができ
、このため電極から対象物までの距離が遠くなり、吸着
力が低下するという課題があった。例えば、絶縁コート
剤としてポリイミドを用い20μmの絶縁膜を作る場合
、外側端の盛り上がりは6μm程度になり、隙間のない
場合に比べて25パーセントの力しか対象物に及ばない
ことになる。[Problem M to be solved by the invention] However, since the insulating film is made by adhering a liquid insulator to the electrode surface and then solidifying it, the actual insulator is
It cannot be formed into the ideal shape as shown in the figure, and the seventh
As shown in the figure, a bulge 31 is formed on the peripheral edge, and due to this bulge 31, when an object is attracted, a gap of distance d is created between the object and the plane of the electrostatic chuck, and therefore, the electrode is separated from the electrode. There was a problem in that the distance to the object became longer and the adsorption force decreased. For example, when making an insulating film of 20 μm using polyimide as an insulating coating agent, the protrusion at the outer edge will be about 6 μm, and only 25% of the force will be applied to the object compared to when there is no gap.
[課題を解決するための手段]
この課題を解決するためにこの発明は、吸着面の周縁部
が吸着面よりも基台側に位置するように形成したもので
ある。[Means for Solving the Problem] In order to solve this problem, the present invention is configured such that the peripheral edge of the suction surface is located closer to the base than the suction surface.
[作用]
対象物と吸着面との隙間がなくなり、対象物に吸引力が
無駄なく、確実に作用するようになる。[Operation] There is no gap between the object and the suction surface, and the suction force is reliably applied to the object without wasting it.
[実施例]
第1図はこの発明の一実施例であり、基台2、電極1、
絶縁膜3で構成され、対象物の着脱のため、−例として
中央部に穴の開いたものを使用している。このように構
成された第1図の、A−A矢視断面図で説明すると、例
えば第2図に示すように、基台2の端部にテーパ部2□
を設け、基台の平面部に電極1を蒸着等の方法で形成し
た後、絶縁膜3をスピンコート等の方法で形成する。こ
のようにすると、従来通り端部に盛り上がりができるが
、この盛り上がりの頂部は吸着面よりも基台側に位置す
るようになるので、対象物は周縁部の盛り上がり3□に
当接することがなく、吸着面に密着するので、必要な吸
着力が確保される。[Example] FIG. 1 shows an example of the present invention, in which a base 2, an electrode 1,
It is composed of an insulating film 3 and has a hole in the center for attaching and detaching the object. To explain this structure using a cross-sectional view taken along the line A-A in FIG. 1, for example, as shown in FIG.
After forming the electrode 1 on the flat surface of the base by a method such as vapor deposition, the insulating film 3 is formed by a method such as spin coating. By doing this, a bulge will be created at the end as before, but the top of this bulge will be located closer to the base than the suction surface, so the object will not come into contact with the bulge 3□ on the peripheral edge. Since it comes into close contact with the suction surface, the necessary suction force is ensured.
第3図は他の実施例であり、基台2は絶縁性を有し電極
1にテーパ部11を設けている。この例では電極は板状
の材料を用い、その端部を削るなどして形成することが
できるので、製作が容易であるという特徴がある。FIG. 3 shows another embodiment, in which the base 2 has an insulating property and the electrode 1 is provided with a tapered portion 11. In this example, the electrodes are made of a plate-like material and can be formed by cutting the ends of the material, so it is easy to manufacture.
第3図は他の実施例であって、基台2上の端部をテーパ
状に形成し、その基台上に銀ペースト等の導電性コート
剤をスピンコートして電極1を形成し、絶縁性コート剤
をスピンコートし、絶縁膜3を形成する。この方法は電
極、絶縁膜ともにスピンコートで製作するので、製作が
容易でかつ厚みの薄いものが容易に形成できる。FIG. 3 shows another embodiment in which the end of the base 2 is formed into a tapered shape, and the electrode 1 is formed by spin coating a conductive coating agent such as silver paste on the base. An insulating film 3 is formed by spin coating an insulating coating agent. In this method, both the electrode and the insulating film are manufactured by spin coating, so that they are easy to manufacture and can easily be formed with a small thickness.
第5図は他の実施例を示す平面図であり、ハ・ツチング
しである部分を傾斜部としている。FIG. 5 is a plan view showing another embodiment, in which the hatched portion is an inclined portion.
なお、以上の実施例は外側の膜に絶縁膜を使用している
が、絶縁膜の代わりに導電性または半導体の膜をコート
することによってジョンソンラーベック効果を利用した
静電チャック基板を形成しても良い、また、テーバの形
状は単純な直線状のテーバの代わりに、曲線上のテーバ
(R)を設けても良い。Although the above examples use an insulating film as the outer film, an electrostatic chuck substrate utilizing the Johnson-Rahbek effect can be formed by coating a conductive or semiconductor film instead of the insulating film. Also, the shape of the taber may be a curved taber (R) instead of a simple linear taber.
[発明の効果]
以上のようにこの発明は吸着面の周縁部を吸着面より基
台側に位置するようにしたので、吸着面と対象物との密
着性が良くなり、必要な吸着力を確実に確保することが
できるという効果を有する。[Effects of the Invention] As described above, in this invention, the peripheral edge of the suction surface is located closer to the base than the suction surface, so the adhesion between the suction surface and the object is improved, and the necessary suction force can be achieved. This has the effect that it can be ensured.
第1図はこの発明の一実施例を示す斜視図、第2図から
第4図はそれぞれ異なった応用例を示したものでそれぞ
れ第1図のA−A矢視断面図、第5図は他の実施例を示
す平面図、第6図および第7図は従来の一例を示す断面
図である。
1・・・−電極、2・・・・基台、3・・・・絶縁膜4
・・・・対象物。Fig. 1 is a perspective view showing one embodiment of the present invention, Figs. 2 to 4 show different application examples, and Fig. 5 is a sectional view taken along the line A-A in Fig. 1. A plan view showing another embodiment, and FIGS. 6 and 7 are cross-sectional views showing a conventional example. 1...-electrode, 2...-base, 3...-insulating film 4
····Object.
Claims (1)
成した静電チャック基板において、吸着面の周縁部の少
なくとも一部が吸着面よりも基台側に位置するように形
成したことを特徴とする静電チャック基板。In an electrostatic chuck substrate in which a film serving as an attraction surface is formed on the top surface of the base using a spin coating method, at least a part of the peripheral edge of the attraction surface is formed to be located closer to the base than the attraction surface. Characteristic electrostatic chuck substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2145295A JP2979425B2 (en) | 1990-06-05 | 1990-06-05 | Electrostatic chuck substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2145295A JP2979425B2 (en) | 1990-06-05 | 1990-06-05 | Electrostatic chuck substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442791A true JPH0442791A (en) | 1992-02-13 |
| JP2979425B2 JP2979425B2 (en) | 1999-11-15 |
Family
ID=15381842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2145295A Expired - Lifetime JP2979425B2 (en) | 1990-06-05 | 1990-06-05 | Electrostatic chuck substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2979425B2 (en) |
-
1990
- 1990-06-05 JP JP2145295A patent/JP2979425B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2979425B2 (en) | 1999-11-15 |
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