JPH0442886B2 - - Google Patents
Info
- Publication number
- JPH0442886B2 JPH0442886B2 JP58072497A JP7249783A JPH0442886B2 JP H0442886 B2 JPH0442886 B2 JP H0442886B2 JP 58072497 A JP58072497 A JP 58072497A JP 7249783 A JP7249783 A JP 7249783A JP H0442886 B2 JPH0442886 B2 JP H0442886B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductive
- heat
- reinforcing layer
- shrinkable tube
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 21
- 229920003023 plastic Polymers 0.000 claims description 20
- 239000004033 plastic Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920003020 cross-linked polyethylene Polymers 0.000 description 4
- 239000004703 cross-linked polyethylene Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Processing Of Terminals (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、架橋ゴム・プラスチツクからなる絶
縁補強層の外周に半導性熱収縮チユーブを用いて
外部半導電層を形成するケーブル接続部の形成方
法に関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to the formation of a cable connection portion in which an external semiconductive layer is formed using a semiconductive heat-shrinkable tube on the outer periphery of an insulating reinforcing layer made of crosslinked rubber/plastic. Regarding the method.
［発明の技術的背景］
従来から、架橋ゴム・プラスチツク絶縁ケーブ
ル接続部における外部半導電層を形成する方法と
して、架橋ゴム・プラスチツクからなる絶縁補強
層の外周に架橋ゴム・プラスチツクをベースとす
る半導電性熱収縮チユーブを被嵌して加熱収縮さ
せる方法が行われている。[Technical Background of the Invention] Conventionally, as a method for forming an external semiconducting layer in a crosslinked rubber/plastic insulated cable connection section, a semiconducting layer based on crosslinked rubber/plastic is applied to the outer periphery of an insulating reinforcing layer made of crosslinked rubber/plastic. A method is used in which a conductive heat-shrinkable tube is inserted and heat-shrinked.
［背景技術の問題点］
しかしながら、このような方法で形成された外
部半導電層は、絶縁補強層と半導電性熱収縮チユ
ーブのいずれも架橋されているため絶縁補強層に
対する十分な密着が得られず、電気特性が不十分
になるという難点があつた。[Problems with the Background Art] However, in the external semiconductive layer formed by such a method, sufficient adhesion to the insulating reinforcing layer cannot be achieved because both the insulating reinforcing layer and the semiconducting heat-shrinkable tube are cross-linked. However, the problem was that the electrical characteristics were insufficient.
［発明の目的］
本発明はこのような欠点を解決すべくなされた
もので、絶縁補強層と外部半導電層との十分な密
着が得られ、電気特性の向上したケーブル接続部
を容易に得ることのできるケーブル接続部の形成
方法を提供しようとするものである。[Object of the Invention] The present invention has been made to solve these drawbacks, and it is possible to easily obtain a cable connection portion with improved electrical characteristics by obtaining sufficient adhesion between the insulating reinforcing layer and the outer semiconducting layer. It is an object of the present invention to provide a method for forming a cable connection part that can be made easily.
［発明の概要］
すなわち本発明のケーブル接続部の形成方法
は、ケーブルの導体接続部上に形成された架橋ゴ
ム・プラスチツクからなる絶縁補強層の外周に、
円筒状に突出する樹脂圧入口を設けた架橋された
ゴム・プラスチツクをベースとする半導電性熱収
縮チユーブを装着して加熱収縮させ、その外周
に、モールドすべきケーブル接続部の形状に対応
するキヤビテイを有する割り金型を、この割り金
型の樹脂圧入口に前記半導電性熱収縮チユーブの
樹脂圧入口を挿入させて被嵌した後、前記半導電
性熱収縮チユーブの樹脂圧入口から前記半導電性
熱収縮チユーブと絶縁補強層との間に加熱溶融さ
れた半導電性ゴム・プラスチツク組成物を圧入
し、この半導電性ゴム・プラスチツク組成物を介
して前記半導電性熱収縮チユーブと前記絶縁補強
層とを一体に融着させることを特徴としている。[Summary of the Invention] That is, the method for forming a cable connection portion of the present invention includes forming a layer on the outer periphery of an insulating reinforcing layer made of crosslinked rubber/plastic formed on a conductor connection portion of a cable.
A semiconductive heat-shrinkable tube based on cross-linked rubber/plastic with a cylindrical resin injection port is attached and heat-shrinked, and its outer periphery corresponds to the shape of the cable connection to be molded. After a split mold having a cavity is fitted by inserting the resin press port of the semiconductive heat shrink tube into the resin press port of the split mold, the resin press port of the semiconductive heat shrink tube is inserted into the split mold. A heated and melted semiconductive rubber/plastic composition is press-fitted between the semiconductive heat-shrinkable tube and the insulating reinforcing layer, and the semiconductive heat-shrinkable tube is bonded to the semiconductive heat-shrinkable tube through the semiconductive rubber/plastic composition. It is characterized in that the insulation reinforcing layer and the insulation reinforcing layer are fused together.
［発明の実施例］
以下本発明の詳細を図面に示す一実施例につい
て説明する。[Embodiment of the Invention] The details of the present invention will be described below with reference to an embodiment shown in the drawings.
図面は本発明方法の一実施例により形成する過
程にある架橋ポリエチレン絶縁ケーブル接続部の
縦断面図である。 The drawing is a longitudinal cross-sectional view of a crosslinked polyethylene insulated cable connection in the process of being formed according to one embodiment of the method of the present invention.
図において、本発明では、まず段剥して接続さ
れた架橋ゴム・プラスチツク絶縁ケーブル、例え
ば架橋ポリエチレンケーブル１，１のケーブル導
体２，２が常法、例えば接続スリーブ３を用いた
圧縮接続方法により接続され、次いでその外周に
テープ巻きモールド法またはインジエクシヨンモ
ールド法により、架橋ポリエチレンからなる絶縁
補強層４がモールド成型される。しかる後その外
周に外部半導電層が形成されるがその際、本発明
においては、この外部半導電層が、中央部に円筒
状の樹脂圧入口５ａを突設した架橋されたゴム・
プラスチツクベースの半導電性熱収縮チユーブ５
を用いて次のようにして成型される。 In the figure, in the present invention, cable conductors 2, 2 of cross-linked rubber/plastic insulated cables, such as cross-linked polyethylene cables 1, 1, which are connected by peeling off the steps, are connected by a conventional method, for example, a compression connection method using a connection sleeve 3. Then, an insulating reinforcing layer 4 made of crosslinked polyethylene is molded around its outer periphery by a tape wrapping molding method or an injection molding method. Thereafter, an external semiconductive layer is formed on the outer periphery of the external semiconductive layer. At this time, in the present invention, this external semiconductive layer is made of a cross-linked rubber layer with a cylindrical resin injection port 5a protruding from its center.
Plastic-based semiconductive heat shrink tube 5
It is molded using the following method.
なお、この半導電性熱収縮チユーブ５は、例え
ば未架橋状態で大径円筒状ゴム・プラスチツクチ
ユーブのほぼ中央部に樹脂圧入口となる小径円筒
状のゴム・プラスチツクチユーブからなる枝管を
接続した後、全体を架橋させ、さらに大径円筒部
のみに膨張加工を施すことにより得ることができ
る。 The semiconductive heat-shrinkable tube 5 is, for example, a large-diameter cylindrical rubber/plastic tube in an uncrosslinked state, and a branch pipe made of a small-diameter cylindrical rubber/plastic tube that serves as a resin injection inlet is connected to approximately the center of the large-diameter cylindrical rubber/plastic tube. After that, the entire structure is crosslinked, and only the large-diameter cylindrical portion is subjected to expansion processing.
まず半導電性熱収縮チユーブ５を常法により絶
縁補強層４上に被嵌して加熱収縮させ、この部分
を図示するようにヒータ（図示せず）により加熱
された割り金型６内にセツトする。 First, the semiconductive heat-shrinkable tube 5 is fitted onto the insulating reinforcing layer 4 using a conventional method, and the tube is heated and shrunk, and this part is set in the split mold 6 heated by a heater (not shown) as shown in the figure. do.
このとき半導電性熱収縮チユーブ５の樹脂圧入
口５ａの縁部を割り金型６の樹脂圧入口６ａの上
部で拡開して固定し、ここへ押出機の樹脂射出口
Ｅを当接させて加熱溶融された半導電ゴム・プラ
スチツク組成物・例えばカーボンブラツクを配合
した非架橋又は架橋剤を配合した架橋可能な半導
電ポリエチレン組成物７を圧入する。圧入された
半導電性ポリエチレン組成物は、半導電性熱収縮
チユーブ５と絶縁補強層４間の間隙を進行して半
導電性熱収縮チユーブ５を割り金型６の内面に押
圧しつつ隅々まで充填される。 At this time, the edge of the resin injection port 5a of the semiconductive heat-shrinkable tube 5 is expanded and fixed at the upper part of the resin injection port 6a of the split mold 6, and the resin injection port E of the extruder is brought into contact therewith. A non-crosslinkable semiconductive polyethylene composition 7 containing a heat-melted semiconductive rubber/plastic composition such as carbon black or a crosslinkable semiconductive polyethylene composition containing a crosslinking agent is then press-fitted. The press-fitted semiconductive polyethylene composition advances through the gap between the semiconductive heat-shrinkable tube 5 and the insulation reinforcing layer 4, pressing the semiconductive heat-shrinkable tube 5 against the inner surface of the split mold 6 and touching every corner. Filled up to.
この後、半導電性ポリエチレン組成物７を架橋
させる場合には必要な時間加熱を続け、しかる後
割り金型の加熱を停止して放冷し、所定温度まで
下がつたところで割り金型６を取り外す。 After that, when crosslinking the semiconductive polyethylene composition 7, heating is continued for the necessary time, and then the heating of the split mold is stopped and allowed to cool. When the temperature drops to a predetermined temperature, the split mold 6 is removed. Remove.
このようにして形成された接続部の外部半導層
には樹脂圧入口５ａに対応する突出部が形成され
ているので、これを切除し、外径仕上げ加工によ
り半導電性熱収縮チユーブ５の樹脂圧入口５ａや
割り金型１の合せ目等に形成されたバリを除去し
て架橋ポリオレフインケーブル接続部が完成す
る。 Since a protrusion corresponding to the resin injection port 5a is formed on the outer semiconductor layer of the connection part thus formed, this is cut out and the semiconductive heat-shrinkable tube 5 is formed by finishing the outer diameter. The crosslinked polyolefin cable connection section is completed by removing burrs formed at the resin press inlet 5a, the seams of the split mold 1, and the like.
なお、絶縁補強層をインジエクシヨンモールド
法により成形した場合は、絶縁体モールド部と金
型内面との間に冷却による収縮のために空隙を生
じるので、絶縁体モールド成形用の金型をそのま
ま本発明に使用することも可能である。 Note that when the insulation reinforcing layer is molded using the injection molding method, a void is created between the insulation mold part and the inner surface of the mold due to shrinkage due to cooling, so the mold for molding the insulation mold may be used as is. It is also possible to use it in the present invention.
［発明の効果］
以上説明したように本発明によれば、架橋ゴ
ム・プラスチツクからなる絶縁補強層上に半導電
性熱収縮チユーブを被着し両者間に溶融した半導
電性ゴム・プラスチツク組成物を圧入したので絶
縁補強層と半導電層とは完全に密着し、また半導
電性熱収縮チユーブの表面は金型により平滑化さ
れるので電気特性の優れたケーブル接続部を得る
ことができる。[Effects of the Invention] As explained above, according to the present invention, a semiconductive rubber/plastic composition is produced in which a semiconductive heat-shrinkable tube is adhered to an insulating reinforcing layer made of crosslinked rubber/plastic and melted between the two. Since the insulation reinforcing layer and the semiconductive layer are press-fitted, the insulating reinforcing layer and the semiconductive layer are in complete contact with each other, and the surface of the semiconductive heat-shrinkable tube is smoothed by the mold, making it possible to obtain a cable connection portion with excellent electrical properties.
図面は本発明の一実施例を説明するための縦断
面図である。
１……架橋ポリエチレンケーブル、２……ケー
ブル導体、３……接続スリーブ、４……絶縁補強
層、５……半導電性熱収縮チユーブ、６……割り
金型、７……半導電性ポリエチレン組成物。
The drawings are longitudinal sectional views for explaining one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Crosslinked polyethylene cable, 2...Cable conductor, 3...Connection sleeve, 4...Insulating reinforcing layer, 5...Semiconductive heat shrinkable tube, 6...Split mold, 7...Semiconductive polyethylene Composition.
Claims (1)
ム・プラスチツクからなる絶縁補強層の外周に、
円筒状に突出する樹脂圧入口を設けた架橋された
ゴム・プラスチツクをベースとする半導電性熱収
縮チユーブを装着して加熱収縮させ、その外周
に、モールドすべきケーブル接続部の形状に対応
するキヤビテイを有する割り金型を、この割り金
型の樹脂圧入口に前記半導電性熱収縮チユーブの
樹脂圧入口を挿入させて被嵌した後、前記半導電
性熱収縮チユーブの樹脂圧入口から前記半導電性
熱収縮チユーブと絶縁補強層との間に加熱溶融さ
れた半導電性ゴム・プラスチツク組成物を圧入
し、この半導電性ゴム・プラスチツク組成物を介
して前記半導電性熱収縮チユーブと前記絶縁補強
層とを一体に融着させることを特徴とするケーブ
ル接続部の形成方法。1. On the outer periphery of the insulation reinforcing layer made of cross-linked rubber/plastic formed on the conductor connection part of the cable,
A semiconductive heat-shrinkable tube based on cross-linked rubber/plastic with a cylindrical resin injection port is attached and heat-shrinked, and its outer periphery corresponds to the shape of the cable connection to be molded. After a split mold having a cavity is fitted by inserting the resin press port of the semiconductive heat shrink tube into the resin press port of the split mold, the resin press port of the semiconductive heat shrink tube is inserted into the split mold. A heated and melted semiconductive rubber/plastic composition is press-fitted between the semiconductive heat-shrinkable tube and the insulating reinforcing layer, and the semiconductive heat-shrinkable tube is bonded to the semiconductive heat-shrinkable tube through the semiconductive rubber/plastic composition. A method for forming a cable connection portion, characterized in that the insulation reinforcing layer and the insulation reinforcing layer are fused together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072497A JPS59198816A (en) | 1983-04-25 | 1983-04-25 | Method of forming cable connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072497A JPS59198816A (en) | 1983-04-25 | 1983-04-25 | Method of forming cable connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59198816A JPS59198816A (en) | 1984-11-10 |
| JPH0442886B2 true JPH0442886B2 (en) | 1992-07-14 |
Family
ID=13491021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58072497A Granted JPS59198816A (en) | 1983-04-25 | 1983-04-25 | Method of forming cable connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59198816A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60246578A (en) * | 1984-05-19 | 1985-12-06 | 株式会社フジクラ | Method of connecting crosslinked polyethylene cable |
| JPS6260427A (en) * | 1985-09-10 | 1987-03-17 | 株式会社フジクラ | Connecting method for rubber, plastic cable |
-
1983
- 1983-04-25 JP JP58072497A patent/JPS59198816A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59198816A (en) | 1984-11-10 |
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