JPH0442923Y2 - - Google Patents
Info
- Publication number
- JPH0442923Y2 JPH0442923Y2 JP1986034475U JP3447586U JPH0442923Y2 JP H0442923 Y2 JPH0442923 Y2 JP H0442923Y2 JP 1986034475 U JP1986034475 U JP 1986034475U JP 3447586 U JP3447586 U JP 3447586U JP H0442923 Y2 JPH0442923 Y2 JP H0442923Y2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- module
- leaf spring
- back surface
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Optical Communication System (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は光送受信モジユール関し、特にその
ICユニツトの固定手段に関するものである。[Detailed explanation of the invention] [Industrial application field] This invention relates to optical transceiver modules, and is particularly applicable to optical transceiver modules.
This relates to a means for fixing an IC unit.
従来の光送受信モジユールにおけるICユニツ
トの固定手段は、第４図に示すように、モジユー
ル本体２１の内部にICユニツト２２を挿入し、
その挿入部分の間〓にエポキシ樹脂２３を充填す
ることにより固定するもの、また第５図に示すよ
うに、嵌合蓋２４に取付けたゴム２５によつて
ICユニツト２２を押し付けて固定するものがあ
つた。
As shown in FIG. 4, the means for fixing the IC unit in the conventional optical transceiver module is to insert the IC unit 22 inside the module main body 21,
It can be fixed by filling the space between the inserted parts with epoxy resin 23, or it can be fixed by rubber 25 attached to the fitting lid 24, as shown in FIG.
There was something to press and fix the IC unit 22.
上記のモジユール本体２１は遮蔽効果を得るた
めに導電性樹脂にて成形されており、グランドピ
ン２６はモジユール本体２１に設けられ、これを
プリント基板にハンダ付けすることにより接地す
る構造になつている。 The module main body 21 described above is molded from conductive resin in order to obtain a shielding effect, and a ground pin 26 is provided on the module main body 21, and is configured to be grounded by soldering it to a printed circuit board. .
ICユニツト２２の固定手段としてエポキシ樹
脂２３を充填するものは、溶融状態にあるエポキ
シ樹脂２３を充填する際の熱により、ICユニツ
ト２２の特性を劣化させる悪影響を与えることが
あるとともに、製造工程が多くなる問題があつ
た。
If the epoxy resin 23 is filled as a fixing means for the IC unit 22, the heat generated when filling the molten epoxy resin 23 may have an adverse effect of deteriorating the characteristics of the IC unit 22, and the manufacturing process may be delayed. There were many problems.
また、ゴム２５の弾力によつて固定するもの
は、部品点数が増えるとともに、ゴム２５の弾力
が零囲気温度の高低に影響され一定しない問題が
あつた。 In addition, in the case of fixing by the elasticity of the rubber 25, there is a problem that the number of parts increases and the elasticity of the rubber 25 is affected by the level of ambient air temperature and is not constant.
また、従来のモジユール本体２１は導電性樹脂
で形成されるが、導電性樹脂は特性上脆弱である
ので、モジユール本体２１に取付穴を設けタツピ
ングネジによつてプリント基板に取付けようとす
ると、欠損が生じ易い。そのためグランドピン２
６をハンダ付けによつて固定しているが、強度が
十分でなく、ICユニツト２２のハンダ部に応力
がかかる等の問題があつた。 Furthermore, the conventional module main body 21 is made of conductive resin, but conductive resin is fragile due to its characteristics, so if mounting holes are provided in the module main body 21 and an attempt is made to attach it to a printed circuit board with tapping screws, damage may occur. Easy to occur. Therefore, ground pin 2
6 is fixed by soldering, but the strength is not sufficient and there are problems such as stress being applied to the soldered portion of the IC unit 22.
そこで、この考案はICユニツトの固定手段に
ついての上記問題点を解決することを目的とす
る。 SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to solve the above problems regarding the fixing means for IC units.
上記の目的を達成するための手段として、この
考案はICユニツトの固定手段をICユニツト背面
と収容部内面との間に介在した板バネにより構成
し、その板バネの一部をICユニツト背面下部に
取付けたグランドピンに接触せしめた構成とした
ものである。
As a means to achieve the above object, this invention consists of a plate spring interposed between the back surface of the IC unit and the inner surface of the accommodating part as a fixing means for the IC unit, and a part of the plate spring is attached to the lower part of the back surface of the IC unit. The structure is such that it makes contact with the ground pin attached to the ground pin.
この考案の実施例に係る光送受信モジユール
は、第１図に示すように、モジユール本体１の内
部にICユニツト２の収容部３を設け、その収容
部３の底面に設けた開口部４からICユニツト２
を挿入し、光送受信部５をモジユール本体１に設
けた窓孔６に臨ませる。
As shown in FIG. 1, the optical transmitting/receiving module according to the embodiment of this invention has a accommodating part 3 for an IC unit 2 inside a module body 1, and an opening 4 provided at the bottom of the accommodating part 3 for inserting the IC. unit 2
is inserted so that the optical transmitting/receiving section 5 faces the window hole 6 provided in the module main body 1.
ICユニツト２は、第２図に示すようにその背
面下部に複数のリードピン７の中間に２本のグラ
ンドピン８を取付けたものである。 As shown in FIG. 2, the IC unit 2 has two ground pins 8 attached between a plurality of lead pins 7 at the lower part of its back surface.
ICユニツト２の背面と収容部３の内面との間
には、板ばね９が介在させる。この板バネ９は第
１図及び第３図に示すように全体として下向きコ
の字形に屈曲され、その対向両面にそれぞれ屈曲
部１０，１１を設け、これらの屈曲部１０，１１
をそれぞれICユニツト２の背面と収容部３の内
面に当て、ICユニツト２を押圧するバネ力を発
生するようになつている。また、ICユニツト２
側の屈曲部１０の下辺中央部には、グランドピン
８を押圧するための小屈曲部１２が突設されてい
る。 A leaf spring 9 is interposed between the back surface of the IC unit 2 and the inner surface of the accommodating portion 3. As shown in FIGS. 1 and 3, the leaf spring 9 is bent in a downward U-shape as a whole, and has bent portions 10 and 11 on opposite surfaces thereof, respectively.
are applied to the back surface of the IC unit 2 and the inner surface of the accommodating portion 3, respectively, to generate a spring force that presses the IC unit 2. Also, IC unit 2
A small bent portion 12 for pressing the ground pin 8 is provided in a protruding manner at the center of the lower side of the side bent portion 10 .
上記の板バネ９を収容部３に挿入すると、屈曲
部１０はリードピン７に接触することがないが、
小屈曲部１２はグランドピン８に接触し、板バネ
９と同電位となる。したがつて、グランドピン８
を接地すると、板バネ９はシールド効果を発揮す
る。 When the above-mentioned leaf spring 9 is inserted into the housing part 3, the bent part 10 does not come into contact with the lead pin 7, but
The small bent portion 12 contacts the ground pin 8 and has the same potential as the leaf spring 9. Therefore, ground pin 8
When grounded, the leaf spring 9 exhibits a shielding effect.
また、モジユール本体１は、例えばPBT樹脂
のごとき絶縁性樹脂により成形され、その両側部
に取付穴１３が設けられる。プリント基板への取
付けは、その基付穴１３を利用しタツピングネジ
により固定される。 Further, the module main body 1 is molded from an insulating resin such as PBT resin, and mounting holes 13 are provided on both sides thereof. The mounting on the printed circuit board is done by using the base hole 13 and fixing with tapping screws.
この考案は上記のように、板バネをICユニツ
トの背面に挿入するだけでICユニツトの固定が
行われるので、製造工程が非常に簡単になるとと
もに、ICユニツトの特性に悪影響を及ぼすこと
がない。
As mentioned above, this idea fixes the IC unit by simply inserting a leaf spring into the back of the IC unit, which simplifies the manufacturing process and does not adversely affect the characteristics of the IC unit. .
また、板バネをグランドピンに押圧することに
より、板バネ自体にシールド効果を発揮させるこ
とができる。 Furthermore, by pressing the leaf spring against the ground pin, the leaf spring itself can exhibit a shielding effect.
また、板バネにシールド効果をもたせることが
できるので、モジユール本体を導電性樹脂で成形
する必要がなく、強度的に問題のない絶縁性樹脂
を使用することができる。その結果取付穴を設
け、タツピングネジにより強固に固定することが
でき、ハンダ部に作用する応力を極力小さくする
ことができる。 Furthermore, since the leaf spring can have a shielding effect, there is no need to mold the module main body with a conductive resin, and an insulating resin with no problem in strength can be used. As a result, it is possible to provide a mounting hole and securely fix it with a tapping screw, and the stress acting on the solder portion can be minimized.
第１図は実施例の断面図、第２図は第１図の
−線の断面図、第３図は板バネの斜視図、第４
図および第５図はそれぞれ従来例の断面図であ
る。
１……モジユール本体、２……ICユニツト、
３……収容部、４……開口部、７……リードピ
ン、８……グランドピン、９……板バネ、１０，
１１……屈曲部、１２……小屈曲部、１３……取
付穴。
Fig. 1 is a sectional view of the embodiment, Fig. 2 is a sectional view taken along the - line in Fig. 1, Fig. 3 is a perspective view of the leaf spring, and Fig. 4 is a sectional view of the embodiment.
5 and 5 are sectional views of conventional examples, respectively. 1...Module body, 2...IC unit,
3...accommodating part, 4...opening, 7...lead pin, 8...ground pin, 9...plate spring, 10,
11...Bent part, 12...Small bend part, 13...Mounting hole.
Claims (1)
その収容部底面に設けた開口部からICユニツ
トを挿入し、上記ICユニツトの背面に固定手
段を設けてなる光送受信モジユールにおいて、
上記の固定手段をICユニツト背面と収容部内
面との間に介在した板バネにより構成し、その
板バネの一部をICユニツト背面下部に取付け
たグランドピンに接触せしめたことを特徴とす
る光送受信モジユール。 (2) 上記の板バネをICユニツト背面の幅方向に
ほぼ等しい幅を有するように形成し、その下辺
にグランドピン押圧部を突設したことを特徴と
する実用新案登録請求の範囲第１項に記載の光
送受信モジユール。 (3) 上記のモジユール本体を絶縁性樹脂により成
形し、その一部に取付穴を設けたことを特徴と
する実用新案登録請求の範囲第１項に記載の光
送受信モジユール。[Scope of claims for utility model registration] (1) An IC unit storage section is provided in the module body,
An optical transceiver module in which an IC unit is inserted through an opening provided at the bottom of the accommodating part, and a fixing means is provided on the back of the IC unit,
An optical device characterized in that the above-mentioned fixing means is constituted by a leaf spring interposed between the back surface of the IC unit and the inner surface of the accommodating part, and a part of the leaf spring is brought into contact with a ground pin attached to the lower part of the back surface of the IC unit. Transmit/receive module. (2) Claim 1 of the Utility Model Registration Claim, characterized in that the above-mentioned leaf spring is formed to have approximately the same width in the width direction of the back surface of the IC unit, and a ground pin pressing portion is provided protrudingly from the lower side thereof. Optical transceiver module described in . (3) The optical transmitting/receiving module according to claim 1, which is a utility model registration, characterized in that the module main body is molded from an insulating resin, and a mounting hole is provided in a part of the module main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986034475U JPH0442923Y2 (en) | 1986-03-08 | 1986-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986034475U JPH0442923Y2 (en) | 1986-03-08 | 1986-03-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145339U JPS62145339U (en) | 1987-09-12 |
| JPH0442923Y2 true JPH0442923Y2 (en) | 1992-10-12 |
Family
ID=30843064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986034475U Expired JPH0442923Y2 (en) | 1986-03-08 | 1986-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442923Y2 (en) |
-
1986
- 1986-03-08 JP JP1986034475U patent/JPH0442923Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62145339U (en) | 1987-09-12 |
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