JPH0442946Y2 - - Google Patents
Info
- Publication number
- JPH0442946Y2 JPH0442946Y2 JP1983064655U JP6465583U JPH0442946Y2 JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2 JP 1983064655 U JP1983064655 U JP 1983064655U JP 6465583 U JP6465583 U JP 6465583U JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead
- lead wire
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
【考案の詳細な説明】
イ 産業上の利用分野
本考案は特にリード線の堅牢な自動挿入用発光
ダイオードランプに関する。[Detailed Description of the Invention] A. Field of Industrial Application The present invention particularly relates to a light emitting diode lamp with a robust lead wire for automatic insertion.
ロ 従来技術
発光ダイオードランプは一般に第１図に示すよ
うに橋絡線１０，１０により支持されたリード線
１１，１１を用いて製造され、橋絡線１０，１０
を切断して利用される。ところがプリント基板等
に発光ダイオードランプを装着する時には省力化
により自動挿入機を利用する考えがあるが、発光
ダイオードランプのリード線は集積回路用のリー
ドフレームの厚手のものと同等であるし、ランプ
としてはコンデンサや抵抗と同等の電子部品であ
り、規格があわないとして自動挿入用部品として
対策が遅れていた。B. Prior Art A light emitting diode lamp is generally manufactured using lead wires 11, 11 supported by bridge wires 10, 10 as shown in FIG.
It is used by cutting. However, when attaching light emitting diode lamps to printed circuit boards, etc., there is an idea of using an automatic insertion machine to save labor, but the lead wires of light emitting diode lamps are equivalent to the thick ones of lead frames for integrated circuits, Since it is an electronic component similar to a capacitor or resistor, countermeasures for automatic insertion were delayed because it did not meet the standards.
ハ 考案の目的
本考案は発光ダイオードランプを、先行するコ
ンデンサ等の電子部品と同等の自動挿入用部品と
して提供するものである。C. Purpose of the invention The present invention provides a light emitting diode lamp as an automatic insertion part equivalent to the preceding electronic parts such as capacitors.
ニ 考案の構成
リード線の形状や太さは自動挿入機のハンガの
巾を広くしたり、基板に設ける透孔の直径を大き
くすることで容易に対応できる。ところが、発光
ダイオードランプ用のリード線はフレーム用板材
から打抜等によつて得られた銅、鉄等を芯材とす
るものなので、コンデンサ等のリード線と比較し
てリード線間隔が狭く、またやわらかく弾力性も
劣る。そこで本考案はリード線の橋絡線切断部分
が巾広になる事に着目してその切断部に折曲げ加
工する事で加工によるリード線の脆弱化を防ぎ、
かつ加工後のリード線の緩衝部とするものであ
る。以下本考案を実施例に基づいて詳細に説明す
る。D. Structure of the invention The shape and thickness of the lead wire can be easily adjusted by increasing the width of the hanger of the automatic insertion machine or by increasing the diameter of the through hole provided in the board. However, lead wires for light emitting diode lamps have a core material of copper, iron, etc. obtained by punching from a frame plate material, so the lead wire spacing is narrower than that of lead wires for capacitors, etc. It is also soft and has poor elasticity. Therefore, this invention focuses on the fact that the bridge wire cut part of the lead wire becomes wider, and by bending the cut part, it prevents the lead wire from weakening due to processing.
It also serves as a buffer for the lead wire after processing. The present invention will be described in detail below based on examples.
ホ 実施例
第２図は本考案実施例の発光ダイオードランプ
の正面図である。発光ダイオードランプは前述し
たようにリード線１，１……を橋絡線１０，１０
で支持し、その頂部にGaP等の発光ダイオード２
を載置固着し、配線したあと、透光性樹脂３，３
で発光ダイオード２を含むリード線１，１……先
端部を被覆し、橋絡線１０，１０を切断する。こ
のような発光ダイオードランプのリード線間隔は
例えば2.54mmであるが、本考案では橋絡線切断跡
４，４部分に折曲加工してリード線を〓状にす
る。橋絡線１０，１０は元来チツプマウントやワ
イヤボンドあるいはヘツダ加工といつたリード線
１，１の先端に加える加圧処理の補強のために主
として設けてあるから、リード線１，１の上方
の、いわば腰にあたる所に設けられているので、
この橋絡線切断跡４，４を段差的に加工するとリ
ード線１，１の緩衝部となり、見かけ上リード線
１，１に弾力性が備わる。また橋絡線１０，１０
の切断においては、リード線１，１にくい込むよ
うな切断はできないので必ずわずか乍ら巾広とな
る。従つて２つの直角部を形成するような折曲加
工であつても、加工によりリード線１，１の脆弱
化は防ぐことができる。５，５は送り穴６，６を
有した搬送テープであるが、リード線１，１を搬
送テープ５，５で固着支持する時、あるいは挿入
機でリード線１，１を搬送テープ５，５から剥離
し基板等に挿入する時に上記リード線１，１の弾
力性により、リード線１，１は広いリード線間隔
を略一定に保つことができる。E. Embodiment FIG. 2 is a front view of a light emitting diode lamp according to an embodiment of the present invention. As mentioned above, in the light emitting diode lamp, the lead wires 1, 1... are connected to the bridging wires 10, 10.
A light emitting diode 2 such as GaP is mounted on top of the support.
After placing and fixing and wiring, transparent resin 3, 3
The tips of the lead wires 1, 1, . . . including the light emitting diode 2 are covered, and the bridge wires 10, 10 are cut. The lead wire spacing of such a light emitting diode lamp is, for example, 2.54 mm, but in the present invention, the lead wires are bent at portions 4 and 4 where the bridge wires were cut to make the lead wires curved. The bridging wires 10, 10 are originally provided mainly for reinforcement of pressure treatment applied to the tips of the lead wires 1, 1 by chip mount, wire bonding, or header processing, so they are located above the lead wires 1, 1. It is located at the waist, so to speak.
When the bridging wire cutting traces 4, 4 are processed into steps, they become buffer parts for the lead wires 1, 1, and the lead wires 1, 1 are apparently provided with elasticity. Also, bridge lines 10, 10
When cutting, it is not possible to cut the lead wires 1, 1 into the cut, so the width is always slightly wider. Therefore, even if the bending process is performed to form two right-angled parts, the lead wires 1, 1 can be prevented from becoming weakened by the process. Reference numerals 5 and 5 denote conveyor tapes having feed holes 6 and 6, and when the lead wires 1 and 1 are fixedly supported by the conveyor tapes 5 and 5, or when the lead wires 1 and 1 are inserted into the conveyor tapes 5 and 5 using an insertion machine. Due to the elasticity of the lead wires 1, 1, when the lead wires 1, 1 are peeled off from the substrate and inserted into a substrate or the like, a wide distance between the lead wires 1, 1 can be kept substantially constant.
ヘ 考案の効果
以上の如く本考案は、橋絡線により支持された
リード線上に載置された発光ダイオードと、発光
ダイオードを含むリード線先端部を被覆した透光
性樹脂とからなる発光ダイオードランプのリード
線の橋絡線切断跡部分を折り曲げ加工しリード線
を搬送テープで固着支持した自動挿入用発光ダイ
オードランプであるからリード線間隔を広くして
かつ弾力性をもたせ、従来のコンデンサ用等の自
動挿入機に適用できる。F. Effects of the Invention As described above, the present invention provides a light-emitting diode lamp consisting of a light-emitting diode placed on a lead wire supported by a bridge wire, and a transparent resin covering the tip of the lead wire containing the light-emitting diode. This light-emitting diode lamp for automatic insertion is made by bending the bridge wire cut portion of the lead wire and firmly supporting the lead wire with a carrier tape, so the lead wire spacing is widened and elasticity is provided, making it similar to conventional capacitors, etc. Applicable to automatic insertion machines.
第１図は製造中の発光ダイオードランプの正面
図、第２図は本考案実施例の発光ダイオードラン
プの正面図である。
１，１……リード線、２……発光ダイオード、
３，３……透光性樹脂、４，４……橋絡線切断
跡、５……搬送テープ。
FIG. 1 is a front view of a light emitting diode lamp under manufacture, and FIG. 2 is a front view of a light emitting diode lamp according to an embodiment of the present invention. 1, 1... Lead wire, 2... Light emitting diode,
3, 3...Transparent resin, 4, 4...Bridging wire cutting trace, 5...Transporting tape.
Claims (1)
的に折り曲げられたリード線と、該リード線に載
置された発光ダイオードと、発光ダイオードを含
む前記リード線先端部を被覆した透光性樹脂と、
前記リード線を固着支持してなる搬送テープとを
具備してなる自動挿入用発光ダイオードランプ。 Lead wires arranged substantially parallel to each other and bent substantially stepwise at the portion where the bridge wire is cut, a light emitting diode placed on the lead wire, and a transparent light covering the tip of the lead wire including the light emitting diode. sexual resin,
A light emitting diode lamp for automatic insertion, comprising a carrier tape firmly supporting the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983064655U JPS59171360U (en) | 1983-04-28 | 1983-04-28 | Light emitting diode lamp for automatic injection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983064655U JPS59171360U (en) | 1983-04-28 | 1983-04-28 | Light emitting diode lamp for automatic injection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59171360U JPS59171360U (en) | 1984-11-16 |
| JPH0442946Y2 true JPH0442946Y2 (en) | 1992-10-12 |
Family
ID=30194840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983064655U Granted JPS59171360U (en) | 1983-04-28 | 1983-04-28 | Light emitting diode lamp for automatic injection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171360U (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5163952U (en) * | 1974-11-14 | 1976-05-20 | ||
| JPS56137466U (en) * | 1980-03-18 | 1981-10-17 |
-
1983
- 1983-04-28 JP JP1983064655U patent/JPS59171360U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59171360U (en) | 1984-11-16 |
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