JPH0443016A - Injection molding die and its temperature control method - Google Patents
Injection molding die and its temperature control methodInfo
- Publication number
- JPH0443016A JPH0443016A JP15088190A JP15088190A JPH0443016A JP H0443016 A JPH0443016 A JP H0443016A JP 15088190 A JP15088190 A JP 15088190A JP 15088190 A JP15088190 A JP 15088190A JP H0443016 A JPH0443016 A JP H0443016A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- temperature
- side mold
- temperature control
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000001746 injection moulding Methods 0.000 title claims description 11
- 230000013011 mating Effects 0.000 claims abstract description 5
- 230000001105 regulatory effect Effects 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 7
- 230000001276 controlling effect Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、射出成形用金型を一定温度に保つ射出成形用
金型およびその温調方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an injection mold for maintaining an injection mold at a constant temperature and a method for controlling the temperature thereof.
従来、射出成形用金型の温度制御は固定側金型と可動側
金型とにそれぞれ温調穴を形成し、該温調穴に温調媒体
を供給して温度制御を行っていた。Conventionally, temperature control of injection molding molds has been carried out by forming temperature control holes in each of a stationary mold and a movable mold, and supplying a temperature control medium to the temperature adjustment holes.
例えば、特開平1−278322号公報記載の発明にお
いては、高精度な平面性が要求されるディスク基板を成
形する金型として、固定側金型と可動側金型とに複数個
の温調穴を形成する発明が提案されている。For example, in the invention described in JP-A-1-278322, a fixed mold and a movable mold have a plurality of temperature control holes as a mold for molding a disk substrate that requires highly accurate flatness. An invention has been proposed to form a.
〔発明が解決しようとする諜B] しかるに、前記従来技術には以下の樟な欠点がある。[Intelligence B that the invention attempts to solve] However, the prior art has the following serious drawbacks.
すなわち、固定側金型と可動側金型との温調穴にそれぞ
れ別ルートで温調媒体を供給して温度制御を行うため、
固定側金型と可動側金型とに温度差が生してしまう、因
って、成形品にソリが生ずる。In other words, temperature control is performed by supplying temperature control medium to the temperature control holes of the stationary mold and the movable mold through separate routes, respectively.
A temperature difference occurs between the stationary mold and the movable mold, which causes warpage in the molded product.
第15図a、 bに示す40wX33s+aX1.5m
sの成形品を用いて、固定側金型と可動側金型の温度差
(°C)と長手方向のソリ量Δ(μ謡)の実験結果を第
16図に示す。40wX33s+aX1.5m shown in Figure 15 a and b
FIG. 16 shows the experimental results of the temperature difference (°C) between the stationary mold and the movable mold and the amount of warpage Δ (μ) in the longitudinal direction using the molded product No. s.
また、成形品の外周形状に温調穴の形状を合わせて形成
することは困難である。Further, it is difficult to form the temperature control hole so that the shape of the temperature control hole matches the outer peripheral shape of the molded product.
さらに、金型と温調媒体との熱交換を良くするには何本
もの温調穴を形成する必要がある。Furthermore, in order to improve heat exchange between the mold and the temperature regulating medium, it is necessary to form a number of temperature regulating holes.
本発明は、上記従来技術における欠点に鑑みて開発され
たもので、固定側金型と可動側金型との温度差をきわめ
て小さくすることにより、成形品のソリを小さくするこ
とのできる射出成形用金型およびその温調方法の提供を
目的とする。The present invention was developed in view of the above-mentioned shortcomings in the conventional technology, and is an injection molding method that can reduce warpage of molded products by extremely reducing the temperature difference between the fixed side mold and the movable side mold. The purpose of the present invention is to provide a mold for use and a method for controlling its temperature.
本発明は、固定側金型と可動側金型とを有する射出成形
用金型において、各金型における合わせ面の少なくとも
一方の合わせ面に温調媒体貫通用の溝を形成したもので
ある。また、この射出成形用金型を用い、型締後に温調
媒体を前記溝に供給して成形を行った後、線溝にガスを
供給して温調媒体を除去する温調方法である。The present invention is an injection mold having a fixed side mold and a movable side mold, in which a groove for passing a temperature regulating medium is formed in at least one of the mating surfaces of each mold. Moreover, this is a temperature control method in which this injection mold is used, and after mold clamping, a temperature control medium is supplied to the grooves to perform molding, and then gas is supplied to the wire grooves to remove the temperature control medium.
本発明は、固定側金型と可動側金型とを共通の温調媒体
により同時に温度制御することで、固定側金型と可動側
金型とから同一条件にて熱をうばうことができる結果、
固定側金型と可動側金型との温度差をきわめて小さくす
ることができる。The present invention enables heat to be transferred from the stationary mold and the movable mold under the same conditions by controlling the temperature of the fixed mold and the movable mold at the same time using a common temperature control medium. ,
The temperature difference between the stationary mold and the movable mold can be made extremely small.
(実施例)
以下、本発明に係る射出成形用金型およびその温調方法
の実施例について図面を参照しながら説明する。(Example) Hereinafter, an example of an injection molding die and a temperature control method thereof according to the present invention will be described with reference to the drawings.
(第1実施例)
第1図〜第3図は本発明に係る第1実施例の温調方法に
用いる射出成形用金型を示し、第1図は概略構成を示す
斜視図、第2図は部分拡大断面図、第3図は温調機の縦
断面図、第4図〜第10図は本実施例の変形例を示し、
第4図aは縦断面図、第4図すおよびCは部分拡大断面
図、第5図aは平面図、第5図すは正面図、第6図は縦
断面図、第7図は平面図、第8図は部分拡大断面図、第
9図は縦断面図、第10図は平面図である。(First Embodiment) FIGS. 1 to 3 show an injection mold used in the temperature control method of the first embodiment of the present invention, FIG. 1 is a perspective view showing a schematic configuration, and FIG. 2 is a partially enlarged cross-sectional view, FIG. 3 is a longitudinal cross-sectional view of the temperature controller, and FIGS. 4 to 10 show modifications of this embodiment.
Figure 4a is a longitudinal sectional view, Figures 4 and C are partially enlarged sectional views, Figure 5a is a plan view, Figure 5 is a front view, Figure 6 is a longitudinal sectional view, and Figure 7 is a plan view. 8 is a partially enlarged sectional view, FIG. 9 is a longitudinal sectional view, and FIG. 10 is a plan view.
lは固定側金型で、この固定側金型1の合わせ面(以下
、パーティング面という)2には中央にスプール3が形
成されている。スプール3の周囲には半円状の溝4が形
成されている。Reference numeral 1 denotes a fixed mold, and a spool 3 is formed in the center of a mating surface (hereinafter referred to as parting surface) 2 of the fixed mold 1. A semicircular groove 4 is formed around the spool 3.
可動側金型5の可動側型板6のパーティング面7には中
央にキャビティ部8が形成されている。A cavity portion 8 is formed in the center of the parting surface 7 of the movable mold plate 6 of the movable mold 5.
キャビティ部8の周囲には前記固定側金型1のキャビテ
イ面2の溝4と対応する位置に半円状の溝9が形成され
ている。溝9の両端部9a、9bは可動側型板6の側面
部10からパーティング面7に穿設された孔11a、l
lbと接続している。A semicircular groove 9 is formed around the cavity portion 8 at a position corresponding to the groove 4 of the cavity surface 2 of the stationary mold 1. Both ends 9a, 9b of the groove 9 are holes 11a, 1 bored from the side surface 10 of the movable template 6 to the parting surface 7.
It is connected to lb.
孔11a、11bの側面部10側端部にはホース12a
、12bが接続され、ホース12a、12bは可動側金
型5近傍に設けられた温UAl113に接続されている
。温調機13は射出成形機14と線15にて結線され、
射出成形機14からの型締信号を受信できるように構成
されている(第1図および第2図参照)。A hose 12a is provided at the end of the side surface 10 of the holes 11a and 11b.
, 12b are connected, and the hoses 12a and 12b are connected to a warm UAl 113 provided near the movable mold 5. The temperature controller 13 is connected to the injection molding machine 14 by a wire 15.
It is configured to be able to receive a mold clamping signal from the injection molding machine 14 (see FIGS. 1 and 2).
温調113の内部には温調媒体16の貯蔵槽17が設置
され、貯蔵槽17にはヒーター18が内設されている。A storage tank 17 for the temperature control medium 16 is installed inside the temperature controller 113, and a heater 18 is installed inside the storage tank 17.
ホース12a、12bの端部は貯蔵1a17の温調媒体
16内に位置するように設けられている。温v4111
3内のホース12a上部には切り替え弁19が端部近傍
にはポンプ20が取着されており、ホース12b中間部
にはパイプ21のエアーと切り替えるt磁弁22が取着
されている(第3図参照)。The ends of the hoses 12a, 12b are provided so as to be located within the temperature regulating medium 16 of the storage 1a17. warm v4111
A switching valve 19 is attached to the upper part of the hose 12a in the hose 12a, and a pump 20 is attached to the vicinity of the end. (See Figure 3).
以上の構成から成る射出成形用金型を用いての温調方法
は、まず固定側金型1と可動側型F1.6とのそれぞれ
のパーティング面2および7を接合し、固定側金型lと
可動側金型5とを型締めする。温調機13は射出成形機
14がらの型締信号を受けてポンプ20を作動させる。The temperature control method using the injection mold having the above configuration is as follows: First, the parting surfaces 2 and 7 of the stationary side mold 1 and the movable side mold F1.6 are joined, and then the fixed side mold 1 and the movable mold 5 are clamped together. The temperature controller 13 operates the pump 20 in response to a mold clamping signal from the injection molding machine 14 .
このポンプ2oの作動によりホース12bを介して温調
媒体16を金型1,5内に吸引方式で送り込む。温調媒
体16は孔11bを通り、パーティング面2.7に形成
された溝4,9により形成される管状の空間内を通り、
孔11aとホース12aとを経由して再び温調[113
に戻る。この時、固定側金型1と可動側金型5とは温調
媒体16により均一に温度制御される。温度制御された
後に樹脂を射出して成形が行われる。成形終了後、を磁
弁22を作動させて温調媒体16の代わりに吸引方式に
てエアーを送り(エアーの温度は温調媒体16と同程度
の温度が良い)、金型1,5内の温調媒体16を抜きと
る。その後、エアーの送りを停止して金型1゜5を開き
、成形品を取り出す。The operation of the pump 2o causes the temperature regulating medium 16 to be sucked into the molds 1 and 5 through the hose 12b. The temperature regulating medium 16 passes through the hole 11b, passes through the tubular space formed by the grooves 4 and 9 formed on the parting surface 2.7,
The temperature is controlled again via the hole 11a and the hose 12a [113
Return to At this time, the temperatures of the stationary mold 1 and the movable mold 5 are uniformly controlled by the temperature control medium 16. After temperature control, resin is injected and molded. After the molding is completed, operate the magnetic valve 22 to send air by suction instead of the temperature control medium 16 (the temperature of the air should be about the same temperature as the temperature control medium 16), and inside the molds 1 and 5. The temperature control medium 16 is removed. Thereafter, the air supply is stopped, the mold 1°5 is opened, and the molded product is taken out.
本実施例によれば、パーティング面2.7に温調媒体1
6を通すことにより、固定側金型1と可動側金型5とを
共通の温度媒体16にて同時に温度制御することができ
、固定側金型1と可動側金型5との温度差をきわめて少
なくすることができる。その結果、キャビティ内の溶融
樹脂は固定側金型1と可動側金型5とから均一に冷却さ
れ、ソリのきわめて少ない状態で冷却される。According to this embodiment, the temperature control medium 1 is placed on the parting surface 2.7.
6, it is possible to simultaneously control the temperature of the fixed mold 1 and the movable mold 5 using a common temperature medium 16, and to reduce the temperature difference between the fixed mold 1 and the movable mold 5. It can be made extremely small. As a result, the molten resin in the cavity is cooled uniformly from the fixed mold 1 and the movable mold 5, and is cooled with very little warpage.
尚、本実施例では吸引タイプの温調機13を用いたため
、温調媒体16は常に負の圧力にて作動し、溝4.9に
より形成された管状の空間内から温調媒体16かにじみ
出ることはない、正圧の温調機を用いる場合は、溝4.
9の周囲に収納溝23を設け、この収容溝23に弾性部
材24(0リング等)を収納してシールを行う(第4図
a、b。In addition, since the suction type temperature controller 13 is used in this embodiment, the temperature regulating medium 16 is always operated under negative pressure, and the temperature regulating medium 16 oozes out from within the tubular space formed by the groove 4.9. When using a positive pressure temperature controller, groove 4.
A storage groove 23 is provided around the housing groove 9, and an elastic member 24 (such as an O-ring) is stored in the storage groove 23 for sealing (FIGS. 4a and 4b).
C参照)。(see C).
また、本実施例では四角形の平板の成形であるが、円形
平板のディスクの成形でも同様な効果が得られる(第5
図a、b参照)。Furthermore, in this example, a rectangular flat plate is molded, but the same effect can be obtained by molding a circular flat disc (No. 5
(See figures a and b).
さらに、キャビティ形状が周辺部で厚い凹レンズ成形の
場合、厚肉部分の近傍に温調媒体16を通すことができ
、均一な冷却が可能となり、高精度な面精度を有するプ
ラスチックレンズの成形ができる(第6図参照)。Furthermore, in the case of molding a concave lens where the cavity shape is thick at the periphery, the temperature control medium 16 can be passed near the thick part, making uniform cooling possible and making it possible to mold a plastic lens with high surface accuracy. (See Figure 6).
また、多数個取りの場合においても、複雑な溝4.9を
容易に形成することができ、キャビティ8を均一に冷却
できるとともに、ランナ一部25に溝4,9を近づける
ことができるため、ランナ一部25の冷却をはやめるこ
とが可能となり、サイクルタイムの短縮が図れる(第7
図参照)。In addition, even in the case of multiple cavities, complex grooves 4.9 can be easily formed, the cavity 8 can be uniformly cooled, and the grooves 4, 9 can be brought close to the runner part 25. It becomes possible to stop cooling the runner part 25, which shortens the cycle time (7th
(see figure).
さらに、溝4,9は半円形状の限定するものではなく四
角形状でもよい(第8図参照)。Furthermore, the grooves 4 and 9 are not limited to a semicircular shape, but may be square shaped (see FIG. 8).
また、本実施例では固定側金型1および可動側金型5の
両方に溝4,9を形成したが、どちらか一方の金型に溝
を形成してもよい、この場合、キャビティを形成した金
型に溝を形成する方が有効である(第9図参照)。Further, in this embodiment, the grooves 4 and 9 were formed in both the fixed mold 1 and the movable mold 5, but the grooves may be formed in either one of the molds. It is more effective to form grooves in a mold that has been molded (see Figure 9).
さらに、パーティング面2.7に溝4.9を幅広く形成
し、より短時間で金型の温度を安定させることもできる
(第10図参照)。Furthermore, the temperature of the mold can be stabilized in a shorter time by forming a wide groove 4.9 on the parting surface 2.7 (see FIG. 10).
(第2実施例)
第11図〜第13図は本発明に係る第2実施例の温調方
法に用いる射出成形用金型に形成された溝を示す部分拡
大断面図である。(Second Embodiment) FIGS. 11 to 13 are partially enlarged cross-sectional views showing grooves formed in an injection mold used in a temperature control method according to a second embodiment of the present invention.
本実施例は、前記第1実施例における溝4,9の断面形
状をアンダー形状(パーティング面に対してその開口部
が幅狭な形状)とした溝26.27.28で構成した点
が異なり、他の構成は同一の構成から成るもので、同一
構成部分の説明は省略する。The present embodiment has the advantage that the grooves 26, 27, and 28 of the first embodiment have an under-shaped cross-sectional shape (the opening thereof is narrow with respect to the parting surface). However, the other configurations are the same, and a description of the same components will be omitted.
前記第1実施例においては、エアーを送り温調媒体16
を除去して型開きを行う、この時、温調媒体16が完全
に除去されていないと、型開きした際に温調媒体16が
パーティング面2.7に流れ出して成形品を汚す可能性
がある。In the first embodiment, air is sent to the temperature regulating medium 16.
At this time, if the temperature regulating medium 16 is not completely removed, the temperature regulating medium 16 may flow out onto the parting surface 2.7 and stain the molded product when the mold is opened. There is.
本実施例によれば、溝26,27.28の断面をアンダ
ー形状にすることにより、温調媒体16の流れ出しを防
止することができる。According to the present embodiment, by making the cross sections of the grooves 26, 27, and 28 under-shaped, it is possible to prevent the temperature regulating medium 16 from flowing out.
(第3実施例)
第14図aおよびbは本発明に係る第3実施例の温調方
法に用いる射出成形用金型に形成された溝を示し、第1
4図aは部分拡大断面図、第14図すは部分拡大斜視図
である。(Third Embodiment) Figures 14a and 14b show grooves formed in an injection mold used in the temperature control method of the third embodiment of the present invention.
4a is a partially enlarged sectional view, and FIG. 14 is a partially enlarged perspective view.
本実施例は、前記第1実施例における溝4,9の底部を
凹凸形状に形成した溝29で構成した点が異なり、他の
構成は同一の構成から成るもので、同一構成部分の説明
は省略する。This embodiment differs from the first embodiment in that the bottoms of the grooves 4 and 9 are constructed with a groove 29 formed into an uneven shape, and the other configurations are the same, and the explanation of the same components will be given below. Omitted.
本実施例では溝29の底部が凹凸形状に形成されている
。因って、温調媒体の流れは常に乱流状態となり、温調
媒体と金型との熱交換を高めることができる。In this embodiment, the bottom of the groove 29 is formed in an uneven shape. Therefore, the flow of the temperature regulating medium is always in a turbulent state, and heat exchange between the temperature regulating medium and the mold can be enhanced.
〔発明の効果]
固定側金型と可動側金型との少なくとも一方の合わせ面
(パーティング面)に、固定側金型と可動側金型とに共
通な温調用の溝を形成し、固定側金型と可動側金型とを
同時に温調することで、固定側金型と可動側金型との温
度差を極めて小さくすることが可能となり、成形品のソ
リを小さくすることができた。[Effect of the invention] A groove for temperature control common to the stationary side mold and the movable side mold is formed on at least one mating surface (parting surface) of the stationary side mold and the movable side mold, and the fixed side mold and the movable side mold are fixed. By controlling the temperature of the side mold and the movable mold at the same time, it is possible to minimize the temperature difference between the fixed mold and the movable mold, thereby reducing warpage of the molded product. .
第1図〜第3図は本発明に係る射出成形用金型およびそ
の温調方法の第1実施例の温調方法に用いる射出成形用
金型を示し、第1図は概略構成を示す斜視図、第2図は
部分拡大断面図、第3図は温調機の縦断面図、第4図〜
第10図は同第1実施例の変形例を示し、第4図aは縦
断面図、第4図すおよびCは部分拡大断面図、第5図a
は平面図、第5図すは正面図、第6図は縦断面図、第7
図は平面図、第8図は部分拡大断面図、第9図は縦断面
図、第10図は平面図、第11図〜第13図は同第2実
施例の温調方法に用いる射出成形用金型に形成された溝
を示す部分拡大断面図、第14図aおよびbは同第3実
施例の温調方法に用いる射出成形用金型に形成された溝
を示し、第14図aは部分拡大断面図、第14図すは部
分断面斜視図、第15図〜第16図は従来例を示し、第
15図aは成形時の平面図、第15図すは成形品の断面
図、第16図は固定側金型と可動側金型の温度差(’C
)と成形品の長手方向のソリ量Δ(μ■)の実験結果を
示すグラフである。
l・・・固定側金型
2.7・・・パーティング面
3・・・スプール
4.9.26.27.28゜
5・・・可動側金型
6・・・可動側型板
8・・・キャビティ部
10・・・側面部
11・・・孔
12・・・ホース
13・・・温調機
14・・・射出成形機
15・・・線
16・・・温調媒体
17・・・貯蔵槽
18・・・ヒーター
19・・・切り替え弁
20・・・ポンプ
29・・・溝
21・・・パイプ
22・・・電磁弁
23・・・収納溝
24・・・弾性部材
25・・・ランナ一部
第21 to 3 show an injection mold used in a temperature control method according to a first embodiment of the injection mold and its temperature control method according to the present invention, and FIG. 1 is a perspective view showing a schematic configuration. Figure 2 is a partially enlarged cross-sectional view, Figure 3 is a longitudinal cross-sectional view of the temperature controller, Figures 4-
10 shows a modification of the first embodiment, FIG. 4a is a longitudinal sectional view, FIGS. 4A and 4C are partially enlarged sectional views, and FIG.
Figure 5 is a plan view, Figure 5 is a front view, Figure 6 is a vertical sectional view, Figure 7 is a longitudinal sectional view, and Figure 7 is a front view.
The figure is a plan view, FIG. 8 is a partially enlarged sectional view, FIG. 9 is a longitudinal sectional view, FIG. 10 is a plan view, and FIGS. 11 to 13 are injection molding used in the temperature control method of the second embodiment. FIGS. 14a and 14b are partially enlarged cross-sectional views showing grooves formed in a mold for injection molding, and FIGS. 14 is a partially enlarged sectional view, FIG. 14 is a partially sectional perspective view, FIGS. 15 to 16 show a conventional example, FIG. 15a is a plan view during molding, and FIG. 15 is a sectional view of the molded product. , Figure 16 shows the temperature difference ('C) between the fixed mold and the movable mold.
) and the warpage amount Δ(μ■) of the molded product in the longitudinal direction. l...Fixed side mold 2.7...Parting surface 3...Spool 4.9.26.27.28゜5...Movable side mold 6...Movable side mold plate 8. ... Cavity part 10 ... Side part 11 ... Hole 12 ... Hose 13 ... Temperature controller 14 ... Injection molding machine 15 ... Wire 16 ... Temperature control medium 17 ... Storage tank 18... Heater 19... Switching valve 20... Pump 29... Groove 21... Pipe 22... Solenoid valve 23... Storage groove 24... Elastic member 25... Runner part 2
Claims (2)
型において、各金型における合わせ面の少なくとも一方
の合わせ面に温調媒体貫通用の溝を形成したことを特徴
とする射出成形用金型。(1) An injection mold having a fixed side mold and a movable side mold, characterized in that a groove for passing through a temperature regulating medium is formed in at least one of the mating surfaces of each mold. Mold for injection molding.
温調媒体を前記溝に供給して成形を行った後、該溝にガ
スを供給して温調媒体を除去することを特徴とする射出
成形用金型の温調方法。(2) Using the injection mold according to claim 1, after mold clamping, supplying a temperature regulating medium to the groove to perform molding, and then supplying gas to the groove to remove the temperature regulating medium. A method for controlling the temperature of an injection mold, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15088190A JPH0443016A (en) | 1990-06-08 | 1990-06-08 | Injection molding die and its temperature control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15088190A JPH0443016A (en) | 1990-06-08 | 1990-06-08 | Injection molding die and its temperature control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0443016A true JPH0443016A (en) | 1992-02-13 |
Family
ID=15506424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15088190A Pending JPH0443016A (en) | 1990-06-08 | 1990-06-08 | Injection molding die and its temperature control method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443016A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6111479A (en) * | 1997-03-03 | 2000-08-29 | Nec Corporation | Laminate printed circuit board with a magnetic layer |
-
1990
- 1990-06-08 JP JP15088190A patent/JPH0443016A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6111479A (en) * | 1997-03-03 | 2000-08-29 | Nec Corporation | Laminate printed circuit board with a magnetic layer |
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