JPH0443086A - Metal mask - Google Patents

Metal mask

Info

Publication number
JPH0443086A
JPH0443086A JP2150657A JP15065790A JPH0443086A JP H0443086 A JPH0443086 A JP H0443086A JP 2150657 A JP2150657 A JP 2150657A JP 15065790 A JP15065790 A JP 15065790A JP H0443086 A JPH0443086 A JP H0443086A
Authority
JP
Japan
Prior art keywords
openings
metal mask
solder paste
squeegee
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2150657A
Other languages
Japanese (ja)
Inventor
Terumi Nakahara
中原　照己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2150657A priority Critical patent/JPH0443086A/en
Publication of JPH0443086A publication Critical patent/JPH0443086A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

PURPOSE:To certainly and easily apply a highly viscous substance containing minute particles of solder paste or the like by inclining the side edges of the openings of a metal mask with respect to the moving direction of a squeegee and widening the widths of the openings in the moving direction of the squeegee. CONSTITUTION:Each of openings 10 is formed into a trapezoidal shape whose height direction is set to the longitudinal direction of a lead 1 and the openings 10 are arranged so that the bottom side 11 and top side 12 of the trapezoidal shape become alternate and gaps each having constant width are provided between the adjacent openings 10. Each of the gaps must be set to 0.1mm or more from an aspect preventing the short-circuit due to molten solder. When the openings 10 of a metal mask are formed so as to have a trapezoidal shape and arranged alternately, the width on the bottom 11 side of each opening especially becomes wider than that of a conventional rectangular opening and, when solder paste is applied to a printed wiring board by a squeegee in such a state that the metal mask is in close contact with said board, the solder paste can be easily introduced into the openings 10.

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） この発明は、はんだペーストなどの高粘性物の塗布に用
いられるメタルマスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a metal mask used for applying a highly viscous substance such as solder paste.

（従来の技術） 一般に混成集積回路の製造は、所定の配線パターンが形
成された印刷配線板に予備はんだを施し、その所要部分
に回路部品を搭載し、予備はんたを溶融してはんだ付け
される。(Prior art) Generally, hybrid integrated circuits are manufactured by pre-soldering a printed wiring board on which a predetermined wiring pattern is formed, mounting circuit components on the required parts, and then melting the pre-solder and soldering. be done.

しかし、フラットパッケージＩＣ（以下ＦＩＣ）などの
ように並列した多数のリードを備えるいわゆる多足回路
部品については、予備はんだによね正確にはんだ付けす
ることが困難であるため、このような回路部品について
は、はんだペーストを塗布し、その塗布されたはんだペ
ースト上に回路部品を位置決めしたのち、はんだペース
トを溶融してはんだ付けされる。そのはんだペーストの
塗布にメタルマスクか用いられる。However, for so-called multi-legged circuit components such as flat package ICs (hereinafter referred to as FICs), which have a large number of parallel leads, it is difficult to accurately solder them with preliminary solder. After applying solder paste and positioning circuit components on the applied solder paste, the solder paste is melted and soldered. A metal mask is used to apply the solder paste.

第４図に従来のはんだペースト塗布用メタルマスクを示
す。このメタルマスクは、金属薄板に第５図に示すＦＩ
Ｃの並列したり−ド（１）に対応したスリット状の開孔
（２）が形成され、その各開孔（２）は、リード（１）
の方向を長平方向とする矩形状に形成されている。たと
えばリード（１）の配列ピッチが０．５ｍｍのＰＩＣを
はんだ付けするためのメタルマスクでは、リード（１）
の配列ピッチと同一ピッチで幅Ｗが０．２５　＊＋ｎの
開孔（２）が並列して形成されている。FIG. 4 shows a conventional metal mask for applying solder paste. This metal mask is made of FI shown in Fig. 5 on a thin metal plate.
Slit-shaped openings (2) corresponding to the parallel leads (1) of C are formed, and each opening (2) is connected to a lead (1).
It is formed into a rectangular shape with the elongated direction in the direction of. For example, in a metal mask for soldering a PIC with leads (1) arranged at a pitch of 0.5 mm, the leads (1)
Apertures (2) having a width W of 0.25*+n are formed in parallel at the same pitch as the array pitch.

はんだペーストの塗布は、第６図に示すように、印刷配
線板（３）に上記メタルマスク（４）を密着し、このメ
タルマスク（４）上にはんだペーストを供給し、スキー
ジ（５）を矢印（６）方向に往動または往復動すること
によりおこなわれる。To apply the solder paste, as shown in Figure 6, the metal mask (4) is brought into close contact with the printed wiring board (3), the solder paste is supplied onto the metal mask (4), and the squeegee (5) is applied. This is done by moving forward or reciprocating in the direction of arrow (6).

しかし、このような方法によりはんだペーストを塗布す
ると、はんだペーストは、はんだ微粒子とバインダーを
主成分とする高粘性物であるため、特に第６図に（２ａ
）で示すようにスキージ（５）の移動方向を幅とする開
孔にはんだペーストが入りにくく、塗りむらができ、は
んだ付は不良やはんだ付けの信頼性の低下をまねく。However, when solder paste is applied by such a method, the solder paste is a highly viscous substance whose main components are solder particles and a binder, so it is particularly difficult to apply the solder paste as shown in Figure 6 (2a).
), it is difficult for the solder paste to enter the opening whose width is the direction of movement of the squeegee (5), resulting in uneven coating, leading to poor soldering and reduced soldering reliability.

（発明が解決しようとする課題） 上記のように、ＦＩＣなどの多足回路部品のはんだ付け
は、そのリードと同一配列のスリット状開孔の形成され
たメタルマスクを用い、スキージによりはんだペースト
を塗布し、その塗布されたはんだペースト上に回路部品
を位置決めしたのち、はんだペーストを溶融することに
よりおこなわれている。しかし、従来のメタルマスクは
、開孔がリード方向を長手方向とする幅の狭い矩形状に
形成されており、一方、はんだペーストは、はんだ微粒
子とバインダーを主成分とする高粘性物であるため、ス
キージの移動方向を幅とする開孔にはんだペーストか入
りに＜＜、塗りむらができ、はんだ付は不良やはんだ付
けの信頼性の低下をまねくなどの問題がある。(Problem to be Solved by the Invention) As mentioned above, when soldering a multi-legged circuit component such as an FIC, a metal mask with slit-like openings in the same arrangement as the leads is used, and solder paste is applied with a squeegee. This is done by applying the solder paste, positioning the circuit components on the applied solder paste, and then melting the solder paste. However, in conventional metal masks, the openings are formed in a narrow rectangular shape with the lead direction as the longitudinal direction, and on the other hand, solder paste is a highly viscous material whose main components are solder particles and a binder. If the solder paste enters the opening whose width is in the direction of movement of the squeegee, uneven coating may occur, resulting in poor soldering and reduced soldering reliability.

この発明は、上記問題点を解決するためになされたもの
であり、はんだペーストなどの微粒子を含有する高粘性
物を確実かつ容易に塗布できる開孔形状のメタルマスク
を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a metal mask having an opening shape that can reliably and easily apply a highly viscous material containing fine particles such as solder paste.

［発明の構成コ （課題を解決するための手段） スキージにより高粘性物を塗布するためのスリット状開
孔を有するメタルマスクにおいて、その開孔の側縁をス
キージの移動方向に対し傾斜させ、スキージの移動方向
の開孔幅を広げた。[Structure of the Invention (Means for Solving the Problems) In a metal mask having slit-like openings for applying a highly viscous substance with a squeegee, the side edges of the openings are inclined with respect to the direction of movement of the squeegee, The opening width in the direction of squeegee movement has been widened.

（作用） 上記のように、スキージの移動方向に対して開孔の側縁
を傾斜させ、スキージの移動方向の開孔幅を広げると、
その幅の広い部分から開孔に高粘性物が入りやすくなり
、かつスキージの移動方向に対する側縁の傾斜により、
高粘性物をスキージの移動方向と直交する方向に押し出
す力が作用し、開孔に高粘性物を確実かつ容易に入れる
ことができる。(Function) As mentioned above, if the side edge of the hole is inclined with respect to the direction of movement of the squeegee and the width of the hole is widened in the direction of movement of the squeegee,
Highly viscous substances can easily enter the opening from the wide part, and the slope of the side edge with respect to the direction of movement of the squeegee
A force is applied to push out the highly viscous material in a direction perpendicular to the direction of movement of the squeegee, and the highly viscous material can be reliably and easily put into the opening.

（実施例） 以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.

第１図にその一実施例であるはんだペースト塗布用メタ
ルマスクの開孔パターンを示す。このメタルマスクは、
印刷配線板にＦＩＣをはんだ付けするためのメタルマス
クであり、板厚が１５０〜２００μ厘のステンレス製薄
板にＦＩＣの複数個のリードに対応して、そのリードの
配列ピッチと同一配列ピッチｐで複数個のスリット状の
開孔（１０）が並列形成されている。その各開孔（１０
）は、第２図に拡大して示すように、リード（１）の長
手方向を高さ方向とする台形状に形成され、その台形の
底辺（１１）と頂辺（１２）とが交互になるように配置
され、かつ隣接開孔（１０）間に一定幅の間隙が設けら
れている。この間隙は、溶融はんだによる短絡防止上、
０．１＋１１１以上必要である。FIG. 1 shows an opening pattern of a metal mask for applying solder paste, which is one example. This metal mask is
This is a metal mask for soldering FIC to a printed wiring board, and it is made of a thin stainless steel plate with a thickness of 150 to 200 μm, and is made of a thin stainless steel plate with a pitch p that is the same as that of the leads, corresponding to multiple leads of the FIC. A plurality of slit-shaped openings (10) are formed in parallel. Each opening (10
) is formed into a trapezoid shape with the height direction being the longitudinal direction of the lead (1), and the base (11) and top side (12) of the trapezoid are arranged alternately. A gap of a constant width is provided between adjacent apertures (10). This gap is designed to prevent short circuits caused by molten solder.
0.1+111 or more is required.

より具体的には、リードの配列ピッチか０．５ｍｍであ
るＰＩＣに対しては、従来の矩形状開孔の場合は、幅が
０．２５　ｍｍ、隣接開孔（１０）間の間隙が０．２５
　＋ｕであるのに対し、この例のメタルマスクでは、た
とえば隣接開孔（１０）間の間隙を０．２５　ｍｍとし
て、開孔（１０）は、頂辺（１２）が（１，１１１１１
１％底辺（１１）が０．７ｍｍの台形状に形成されてい
る。More specifically, for PIC where the lead arrangement pitch is 0.5 mm, in the case of conventional rectangular holes, the width is 0.25 mm and the gap between adjacent holes (10) is 0. .25
+u, whereas in the metal mask of this example, the gap between adjacent apertures (10) is set to 0.25 mm, and the apertures (10) have a top side (12) of (1,11111
It is formed into a trapezoid shape with a 1% base (11) of 0.7 mm.

ところで、上記のようにメタルマスクの開孔（１０）を
台形状としてこの台形状の開孔（１０）を交互に並列す
ると、特に各開孔（１０）の底辺（１１）側の幅が従来
の矩形状の開孔より広くなり、このメタルマスクを印刷
配線板に密着して、スキージによりはんだペーストを塗
布するとき、はんだペーストを開孔（１０）内に容易に
入れることができる。しかも、台形状の開孔（１０）の
側縁がスキージの移動方向に対して傾斜しているため、
スキージの移動によりはんだペーストをスキージの移動
方向と直交する方向に移動させる力を与えることができ
、はんだペーストを開孔（１０）内に確実かつ容易に押
込むことができる。さらに、塗布されたはんだペースト
は、各開孔（■０）の底辺（１１）側の幅広部で印刷配
線板に強固に接着するため、塗布後、メタルマスクを取
外すとき、その塗布形状の損傷を防止でき、メタルマス
クの開孔（１０）形状に対応した所要の塗布パターンが
得られる。By the way, when the apertures (10) of the metal mask are made trapezoidal and the trapezoidal apertures (10) are arranged in an alternating manner as described above, the width of the base (11) side of each aperture (10) is smaller than that of the conventional one. When applying solder paste with a squeegee while this metal mask is in close contact with a printed wiring board, the solder paste can be easily inserted into the opening (10). Moreover, since the side edge of the trapezoidal opening (10) is inclined with respect to the direction of movement of the squeegee,
By moving the squeegee, a force can be applied to move the solder paste in a direction perpendicular to the direction of movement of the squeegee, and the solder paste can be reliably and easily pushed into the opening (10). Furthermore, since the applied solder paste firmly adheres to the printed wiring board at the wide part on the bottom (11) side of each opening (■0), when the metal mask is removed after application, the applied shape may be damaged. This makes it possible to obtain a desired coating pattern corresponding to the shape of the opening (10) of the metal mask.

すなわち、通常、はんだペーストは、直径４５〜５０μ
膳のはんだ微粒子を８０〜９０％含有する粘度が約２０
０．０００ｃｐｓ　（スパイラル式粘度計）の高粘性物
であるため、従来のように幅が０．２５■ｍ程度の狭幅
の矩形状開孔では、開孔内にはんだペーストが入りにく
く、かつ印刷配線板との接着力も十分でないために所定
の塗布パターンが得難く、かつ塗布後のメタルマスクの
取外しも慎重を要したが、この例のメタルマスクでは、
それらを容易に解決できる。That is, the solder paste usually has a diameter of 45 to 50μ.
The viscosity containing 80 to 90% of solder particles is approximately 20
Since the material has a high viscosity of 0.000 cps (spiral viscometer), it is difficult for solder paste to enter the hole with a narrow rectangular hole with a width of about 0.25 μm as in the past. Because the adhesion to the printed circuit board was not sufficient, it was difficult to obtain the desired coating pattern, and removal of the metal mask after coating also required caution.
You can easily solve them.

つぎに、他の開孔形状について説明する。Next, other hole shapes will be explained.

第３図（ａ）は、開孔（１０）を三角形状とし、これを
底辺（１４）とその底辺（１４）と対向する頂点（１５
）とが交互になるように並列した例である。開孔（１０
）をこのように三角形状にすると、隣接開孔（１０）間
の間隙を同一にした場合、前記実施例の台形状にくらべ
底辺（１４）の幅を大きく、かつスキージの移動方向に
対する開孔側縁の傾斜を大きくすることができ、はんだ
ペーストの開孔（１０）内への押込みを容易にすること
ができる。In FIG. 3(a), the aperture (10) has a triangular shape, and has a base (14) and an apex (15) opposite to the base (14).
) are arranged in parallel in an alternating manner. Open hole (10
) into a triangular shape in this way, when the gaps between adjacent holes (10) are the same, the width of the base (14) is wider than the trapezoid shape of the previous embodiment, and the width of the holes in the direction of movement of the squeegee is larger. The slope of the side edges can be increased, making it easier to push the solder paste into the opening (10).

第３図（ｂ）は、開孔（１０）をくの字状に形成し、同
−向きに並列した例である。また、同（Ｃ）は開孔（１
０）を２字状に、同（ｄ）は円弧状に、同（ｅ）は蛇行
状に形成し、同−向きに並列した例であり、前記実施例
と同様の効果が得られる。FIG. 3(b) shows an example in which the openings (10) are formed in a dogleg shape and are arranged in parallel in the same direction. In addition, the same (C) is a hole (1
0) is formed in a two-character shape, (d) is formed in an arc shape, and (e) is formed in a meandering shape, and these are arranged in parallel in the same direction, and the same effect as in the previous embodiment can be obtained.

なお、上記実施例は、はんだペースト塗布用のメタルマ
スクについて述べたが、この発明は、はんだペースト以
外の高粘性物の塗布にも使用できる。Although the above embodiments have been described with respect to a metal mask for applying solder paste, the present invention can also be used for applying highly viscous materials other than solder paste.

［発明の効果〕 高粘性物を塗布するためのメタルマスクの開孔側縁をス
キージの移動方向に対し傾斜させ、スキージの移動方向
の開孔幅を広げると、その幅の広い部分から開孔に高粘
性物が入りやすくなり、かつスキージの移動方向に対す
る側縁の傾斜により、高粘性物をスキージの移動方向と
直交する方向に移動する力が作用し、開孔に高粘性物を
確実かつ容易に入れることができ、所定の塗布パターン
が容易に得られる。[Effect of the invention] When the side edge of the opening of a metal mask for applying a highly viscous material is inclined with respect to the direction of movement of the squeegee and the width of the opening is widened in the direction of movement of the squeegee, the opening starts from the wide part. Highly viscous materials can easily enter the holes, and the slope of the side edges relative to the direction of movement of the squeegee creates a force that moves the highly viscous materials in a direction perpendicular to the direction of movement of the squeegee. It can be easily applied and a predetermined coating pattern can be easily obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図はこの発明の詳細な説明図で、第１
図はその一実施例であるＦＩＣをはんた付けするための
はんだペースト塗布用メタルマスクの開孔パターンを示
す図、第２図はその開孔形状を拡大して示す図、第３図
（ａ）ないしくｅ）はそれぞれ異なる開孔形状を拡大し
て示す図、第４図は従来のＦＩＣをはんだ付けするため
のはんだペースト塗布用メタルマスクの開孔形状を拡大
して示す図、第５図（ａ）および（ｂ）はそれぞれＦＩ
Ｃの形状を示す平面図およご側面図、第６図ははんだペ
ーストの塗布方法を説明するための図である。 １・・・　Ｆ１１１５のリード、　　１０・・・開孔。Figures 1 to 3 are detailed explanatory diagrams of this invention.
The figure shows the hole pattern of a metal mask for applying solder paste for soldering FIC, which is one example of the method, Figure 2 is an enlarged view of the shape of the hole, and Figure 3 ( a) to e) are enlarged views of different hole shapes; FIG. 4 is an enlarged view of the hole shapes of a metal mask for applying solder paste for soldering conventional FICs; Figures 5 (a) and (b) are FI
A plan view and a side view showing the shape of C, and FIG. 6 are diagrams for explaining the method of applying solder paste. 1... F1115 lead, 10... Hole opening.

Claims (1)

【特許請求の範囲】 金属薄板に所定ピッチで複数個のスリット状開孔が並列
形成され、スキージにより上記開孔を介して高粘性物を
塗布するためのメタルマスクにおいて、 上記ストック状開孔の側縁を上記スキージの移動方向に
対し傾斜させ、上記スキージの移動方向に対する開孔幅
を広げたことを特徴とするメタルマスク。[Scope of Claims] A metal mask for applying a highly viscous material through the openings with a squeegee, in which a plurality of slit-like openings are formed in parallel at a predetermined pitch in a thin metal plate, A metal mask characterized in that the side edges are inclined with respect to the direction of movement of the squeegee, and the width of the opening is widened in the direction of movement of the squeegee.
JP2150657A 1990-06-08 1990-06-08 Metal mask Pending JPH0443086A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2150657A JPH0443086A (en) 1990-06-08 1990-06-08 Metal mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2150657A JPH0443086A (en) 1990-06-08 1990-06-08 Metal mask

Publications (1)

Publication Number Publication Date
JPH0443086A true JPH0443086A (en) 1992-02-13

Family

ID=15501643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2150657A Pending JPH0443086A (en) 1990-06-08 1990-06-08 Metal mask

Country Status (1)

Country Link
JP (1) JPH0443086A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007278561A (en) * 2006-04-04 2007-10-25 Tomoe Shokai:Kk Communication device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007278561A (en) * 2006-04-04 2007-10-25 Tomoe Shokai:Kk Communication device

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