JPH0443347U - - Google Patents
Info
- Publication number
- JPH0443347U JPH0443347U JP8621290U JP8621290U JPH0443347U JP H0443347 U JPH0443347 U JP H0443347U JP 8621290 U JP8621290 U JP 8621290U JP 8621290 U JP8621290 U JP 8621290U JP H0443347 U JPH0443347 U JP H0443347U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- switching system
- communication
- overvoltage
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000001012 protector Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Emergency Protection Circuit Devices (AREA)
Description
第１図は本考案の一実施例における半導体過電
圧保護素子の斜視図、第２図は第１図の保護素子
を通信用保安器に適用した場合の斜視図、第３図
は従来の半導体過電圧保護素子の一例を示す斜視
図である。
１，１１……半導体チツプ、２……絶縁性基板
、２ａ，２ｂ……パツド、３……アルミニウム線
、４……中空ケース、５，１４……プリント基板
、６……ハウジング、１０……半導体素子組立、
１２ａ，１２ｂ……一対の接続子、１３……エポ
キシ樹脂。
Fig. 1 is a perspective view of a semiconductor overvoltage protection element according to an embodiment of the present invention, Fig. 2 is a perspective view of the protection element of Fig. 1 applied to a communication protector, and Fig. 3 is a perspective view of a conventional semiconductor overvoltage protection element. It is a perspective view showing an example of a protection element. 1, 11... Semiconductor chip, 2... Insulating substrate, 2a, 2b... Pad, 3... Aluminum wire, 4... Hollow case, 5, 14... Printed circuit board, 6... Housing, 10... semiconductor element assembly,
12a, 12b...a pair of connectors, 13...epoxy resin.
Claims (1)
圧及び過電流から該交換システムを保護する通信
用保安器において、絶縁性基板に固着された過電
圧保護用の半導体チツプの一方をワイヤボンデイ
ングした後、前記絶縁性基板を中空ケースにて覆
つたことを特徴とする通信用保安器。 In a communication protector installed between a communication line and a switching system to protect the switching system from overvoltage and overcurrent, after wire bonding one side of the overvoltage protection semiconductor chip fixed to the insulating substrate, A communication protector characterized in that the insulating substrate is covered with a hollow case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8621290U JPH0443347U (en) | 1990-08-16 | 1990-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8621290U JPH0443347U (en) | 1990-08-16 | 1990-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0443347U true JPH0443347U (en) | 1992-04-13 |
Family
ID=31635684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8621290U Pending JPH0443347U (en) | 1990-08-16 | 1990-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443347U (en) |
-
1990
- 1990-08-16 JP JP8621290U patent/JPH0443347U/ja active Pending
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