JPH0480088U - - Google Patents

Info

Publication number
JPH0480088U
JPH0480088U JP12460090U JP12460090U JPH0480088U JP H0480088 U JPH0480088 U JP H0480088U JP 12460090 U JP12460090 U JP 12460090U JP 12460090 U JP12460090 U JP 12460090U JP H0480088 U JPH0480088 U JP H0480088U
Authority
JP
Japan
Prior art keywords
resin
case
sealed
grommet
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12460090U
Other languages
Japanese (ja)
Other versions
JP2509672Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990124600U priority Critical patent/JP2509672Y2/en
Publication of JPH0480088U publication Critical patent/JPH0480088U/ja
Application granted granted Critical
Publication of JP2509672Y2 publication Critical patent/JP2509672Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Insulating Bodies (AREA)
  • Connection Or Junction Boxes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂ，ｃ，ｄは従来の構造図、第２図
ａ，ｂ，ｃ，ｄ及び第３図は本考案の一実施例構
造図である。図中１はケース、２はグロメツト、
３は電子部品を搭載したプリント基板、４は従来
ケースのグロメツト嵌合用溝、５はリード線、６
は封止用樹脂、７はハーネス部、８はケースの外
へ流出した樹脂（樹脂ダレ）、９は樹脂ダレを吸
収する溝構、１０は本考案として追加したグロメ
ツト嵌合用溝、１１は本考案のケース本体、１２
はカプラを示す。 Figures 1a, b, c, and d are structural diagrams of a conventional device, and Figures 2a, b, c, and d, and 3 are structural diagrams of an embodiment of the present invention. In the figure, 1 is the case, 2 is the grommet,
3 is a printed circuit board with electronic components mounted on it, 4 is a grommet fitting groove of a conventional case, 5 is a lead wire, and 6
7 is the sealing resin, 7 is the harness part, 8 is the resin that has flowed out of the case (resin sag), 9 is the groove structure that absorbs the resin sag, 10 is the grommet fitting groove added as a part of the present invention, 11 is the main part Invented case body, 12
indicates a coupler.

Claims (1)

【実用新案登録請求の範囲】 (1) 電子部品と外部接続用のリード線を搭載し
たプリント基板を樹脂製のケース或いは金属製の
ケースに収納し、前記プリント基板を樹脂封止す
る際、リード線に装備されているグロメツトとケ
ース溝部の間より封止用樹脂が流出しないように
複数の嵌合溝（切りかき部）をケースの側面に設
けたことを特徴とする樹脂封止型電子回路装置。 (2) グロメツトに変わりダイレクトカプラを用
いたことを特徴とする実用新案登録請求の範囲第
(1)項記載の樹脂封止型電子回路装置。[Scope of Claim for Utility Model Registration] (1) A printed circuit board equipped with electronic components and lead wires for external connection is housed in a resin case or a metal case, and when the printed circuit board is sealed with resin, A resin-sealed electronic circuit characterized in that a plurality of fitting grooves (notches) are provided on the side of the case to prevent sealing resin from flowing out between the grommet installed in the wire and the case groove. Device. (2) Utility model registration claim No. 1 characterized in that a direct coupler is used instead of a grommet.
The resin-sealed electronic circuit device described in (1).
JP1990124600U 1990-11-27 1990-11-27 Resin-sealed electronic circuit device Expired - Lifetime JP2509672Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990124600U JP2509672Y2 (en) 1990-11-27 1990-11-27 Resin-sealed electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990124600U JP2509672Y2 (en) 1990-11-27 1990-11-27 Resin-sealed electronic circuit device

Publications (2)

Publication Number Publication Date
JPH0480088U true JPH0480088U (en) 1992-07-13
JP2509672Y2 JP2509672Y2 (en) 1996-09-04

Family

ID=31872241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990124600U Expired - Lifetime JP2509672Y2 (en) 1990-11-27 1990-11-27 Resin-sealed electronic circuit device

Country Status (1)

Country Link
JP (1) JP2509672Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103177A (en) * 1997-09-25 1999-04-13 Matsushita Electric Ind Co Ltd Electronic device housing and method of assembling the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276514U (en) * 1985-11-01 1987-05-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276514U (en) * 1985-11-01 1987-05-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103177A (en) * 1997-09-25 1999-04-13 Matsushita Electric Ind Co Ltd Electronic device housing and method of assembling the same

Also Published As

Publication number Publication date
JP2509672Y2 (en) 1996-09-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term