JPH0443397B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a modular connector, in particular:
Regarding modular jacks.

Conventional technology Conventionally, this type of modular connector was
Electrical receptacle connectors such as those disclosed in Japanese Utility Model Application Publication No. 59-31783 have been developed and used. This electrical receptacle connector includes an insulating housing and a contact disposed in the insulating housing. It has a termination portion disposed end portion for installation in a protruding manner, and the contacts extend from the termination portion through the termination portion placement end portion into the insulating housing and are exposed within the coupling cavity. It has an extension that provides a connection.

Problems to be Solved by the Invention However, since such conventional modular connectors are composed of only an insulating housing and a contact, no measures against electromagnetic waves have been taken as a connector. Furthermore, as a countermeasure against electromagnetic waves in ordinary connectors, it is known to insert a capacitor as disclosed in Japanese Utility Model Application Publication No. 171789/1989 and Publication No. 6629/1988. However, the arrangement pitch of the contacts in modular connectors is usually as small as 1 mm, and it has been difficult to apply the capacitor insertion technology used in regular connectors to modular connectors. .

An object of the present invention is to provide a modular jack containing a condenser that eliminates the above-mentioned conventional problems.

Means for Solving the Problems According to the present invention, the present invention includes an insulating housing and a contact disposed in the insulating housing, and the insulating housing has a coupling cavity into which a mating plug is fitted, and a contactor disposed in the insulating housing. The contact has a connecting part disposed end for disposing the connecting part of the contact so as to protrude outward, and the contact passes through the connecting part disposed end from the connecting part to the insulation. a modular jack having an extension extending into the housing and exposed within the coupling cavity to provide a connection, the insulating housing having a hollow section formed at the termination disposed end; A ground plate and a dielectric plate are disposed in the hollow portion, and the ground plate is integrally formed with a conductive material having a spring property and has a U-shaped cross section. The legs on both sides are formed with locking tongues that protrude outward, and the flat surface of the ground plate between the legs is provided with locking tongues that protrude outward.
An opening is formed in the dielectric plate, and a through hole is formed in the dielectric plate through which the connection portion of the contact is inserted, and a peripheral portion of the through hole is formed in one surface of the dielectric plate. A grounding/condenser electrode layer is provided over almost the entire front surface of the dielectric plate except for a grounding/condenser electrode layer, and a separate capacitor electrode layer is provided on the other surface of the dielectric plate around the through hole. The body plate is
The through hole is located in the opening with respect to the flat part of the grounding plate, and the peripheral part of the grounding/condenser electrode layer is electrically and electrically connected to the peripheral part of the opening in the flat part of the grounding plate. The connection portion of the contact is inserted into the through hole of the dielectric plate and electrically and mechanically connected to the separation capacitor electrode layer, and the connection portion of the contact is electrically and mechanically connected to the separation capacitor electrode layer. A capacitor is formed by the capacitor electrode layer, the dielectric plate, and the separated capacitor electrode layer, and when the ground plate is inserted into the cavity, a capacitor is formed on both inner walls of the cavity of the insulating housing. Locking step portions are provided for engaging with the locking tongue portions of the legs on both sides of the ground plate to fix the ground plate to the insulating housing.

Embodiments Next, the present invention will be described in more detail with reference to embodiments of the present invention based on the accompanying drawings.

FIG. 1 is a longitudinal sectional view of a modular jack containing a condenser as an embodiment of the present invention, FIG. 2 is a bottom view of the modular jack containing a condenser shown in FIG. 1, and FIG. FIG. 2 is a side view for explaining the relationship between the modular jack of FIG. 1 and a printed circuit board. As best shown in FIG. 1, the modular jack of this embodiment is
For example, an insulating housing 100 made of an insulating material such as plastic, and this insulating housing 1
00, a plurality of contacts 200, six in this embodiment, are provided. The insulating housing 100 includes a coupling cavity 110 for receiving and fitting a mating plug (not shown), and a grounding plate formed at the end of the connection section opposite to the coupling cavity 110, which will be described later. 400 is placed. Furthermore, in this embodiment, the end of the insulating housing 100 where the connection portion is disposed is provided with a lock for engaging with a fixing hole of the printed circuit board 10 (see FIG. 3) and fixing the modular jack. A protruding tongue piece 130 is formed. This locking protrusion tongue piece 130 is provided with a locking claw 131 . On the other hand, the contactor 200 includes a connection part 210 which is arranged at the connection part disposed end of the insulating housing 100 so as to protrude outward from the insulating housing 100, and a connection part disposed end from the connection part 210. and an extension extending through the insulating housing 100 and exposed into the coupling cavity 110 to provide a connection 211 .

A dielectric plate 300 and a ground plate 400 are arranged in the cavity 120 of the insulating housing 100.
00 is shown in detail in FIGS. 4 to 9.

FIG. 4 is a plan view showing the front surface of the dielectric plate 300, and FIG. 5 is a view showing the back surface of the dielectric plate 300. As shown in these drawings, the dielectric plate 300 is made of a dielectric material such as ceramic, and has through holes 301 formed in accordance with the arrangement pitch of the contacts 200. Then, on the surface of this dielectric plate 300, a ground/capacitor electrode layer 302 is formed with a solder plating layer over almost the entire surface of the dielectric plate 300, except for the peripheral area of the through hole 301. There is a through hole 3 on the back side of the
Separate capacitor electrode layers 303 are separately formed around the periphery of 01 using solder plating layers.

On the other hand, as clearly shown in FIGS. 6 to 9, the grounding plate 400 is integrally formed of a conductive material with springiness and has a U-shaped cross section, and has an opening 402 formed in a plane portion 401. , on the legs on both sides,
A locking tongue portion 403 and a locking piece 404 are provided which are cut and raised so as to protrude outward.
As clearly shown in FIG. 3, the locking tongue portion 403 engages with a locking step 140 formed on the side surface of the insulating housing 100 to fix the ground plate 400 to the insulating housing 100. It performs the function of Further, a slit 404A is formed in the center of the locking piece 404 to provide spring properties, and the locking piece 404 is connected to the fixing hole of the printed circuit board 10, as shown in FIG. The modular jack is inserted into the printed circuit board 10, makes electrical contact with the conductors of the printed circuit board 10, and also serves to secure the modular jack onto the printed circuit board 10.

Next, these dielectric plates 300 are connected to the earth plate 40.
The through-hole 301 is exposed from the opening 401 of 0, and the peripheral part of the solder plating layer 302 of the grounding/condenser electrode layer is in contact with the surface part of the grounding plate 400 around the opening 401. They are placed overlapping each other. The connection portion 210 of each contact 200 is connected to each corresponding through hole 3.
01, and the separation capacitor electrode layer 3 formed on the inner wall of the through hole 301 and surrounding the through hole 301.
It is in close contact with the solder plating layer 301A connected to 03. In this way, a capacitor inserted between each contact 200 and the ground plate 400 is formed by each separated capacitor electrode layer 301, the dielectric plate 300 therebetween, and the ground/capacitor electrode layer 302.

In this embodiment, the contacts 200 are staggered in two rows. By doing so, the arrangement pitch of the contacts 200 can be narrowed.

Next, an example of a method for manufacturing a modular jack containing a capacitor with such a configuration will be described below.
This will be explained with reference to FIG.

First, as shown in FIG. 10A, a dielectric plate 300 and a ground plate 400 having the configurations described above are prepared. Further, as shown in FIG. 10B, the contact material 2 is carried by two carriers 250, respectively.
Prepare 00. The carrier 250 has the feed hole 2
51, and has a crimp portion 252 for gripping the contact material 200.

Further, as shown in FIG. 10D, an insulating housing 100 having the configuration described above is prepared.

Next, as shown in FIG. 10C, using appropriate receiving jigs 260 and 270, ground plate 400 is
A dielectric plate 300 is placed on the back surface of the . At this time, it is preferable to apply a creamy solder layer around the opening 402 on the back surface of the grounding plate 400. Ground and capacitor electrode layer 30 on the surface of the dielectric plate 300
2 rests on the periphery of the opening 402 of the grounding plate 400, and each through hole 301 is positioned within the opening 402. And Carrier 2
The tip of each contact material 200 carried by the contact material 50 is inserted into each corresponding through hole 301 so that the tip comes into contact with the surface of the receiving jig 270.

In this state, the entire assembly is heated, for example, in an electric heating furnace (not shown). Then, each solder plating layer and the solder layer are fused, so that the periphery of the ground/capacitor electrode layer 302 on the surface of the dielectric plate 300 is electrically and mechanically connected to the periphery of the opening 402 on the plane of the ground plate 400. At the same time that each contact material 2
00 connection portion 210 is fixed in the through-hole 301 and electrically and mechanically connected to each separated capacitor electrode layer 303 via the solder layer on the inner wall of the through-hole.

Finally, the thus integrated assembly is assembled into an insulating housing 1 as shown in FIG. 10D.
00 into the cavity 120 of the earth plate 400.
The locking tongue portion 403 of the insulating housing 100 is engaged with the locking step portion 140 of the insulating housing 100. Then, the tip of each contact material 200 is attached to the insulating housing 10.
1 to form a connecting portion 211. Thereafter, the carrier 250 is separated from the end of the contact 200.

In the above-mentioned manufacturing method, the fixing of the ground plate and the dielectric plate and the fixing of each contact to the inner wall of the through hole of the dielectric plate were performed by heating at the same time. It may also be carried out separately by separate heating.

Effects of the Invention According to the present invention, since the configuration is as described above, a capacitor for EMI countermeasures (noise removal) can be inserted even if the arrangement pitch of the contacts is narrow. Furthermore, according to the present invention, a capacitor can be inserted simply by inserting the ground plate into the cavity of the insulating housing, so not only can assembly be extremely simple, but also the ground plate can be inserted and fixed into the cavity. Even after the ground plate has been removed, the grounding plate can be removed from the cavity by disengaging the locking tongue and the locking step, so if a defect is found in the capacitor etc. after assembly, etc. You can also easily replace them.

Further, since the capacitance value of the formed capacitor is mainly determined by the thickness of the dielectric plate and the area of the separated capacitor electrode layer, it can be given very easily and accurately.

Separate capacitor electrode layers can be applied at precisely minute intervals using printing technology, etc., so even if the contact arrangement pitch is quite narrow,
Since a capacitor can be provided for each, it is also possible to narrow the arrangement pitch of the contacts.

[Brief explanation of drawings]

1 is a longitudinal sectional view of a modular jack containing a condenser as an embodiment of the present invention, FIG. 2 is a bottom view of the modular jack containing a condenser shown in FIG. 1, and FIG. 4 is a plan view showing the front surface of the dielectric plate 300, and FIG. 5 is a side view showing the back surface of the dielectric plate 300. Figure 6 is a plan view of the assembly of the dielectric plate and ground plate, Figure 7 is a bottom view of the assembly shown in Figure 6, and Figure 8 is a front view of the assembly shown in Figure 6. ,
9 is a side view of the assembly shown in FIG. 6, and FIG. 10 is a schematic perspective view for explaining an example of the method for manufacturing a modular jack containing a condenser of the present invention. 100...Insulating housing, 110...Joining cavity,
120...Cavity part, 130...Locking protruding tongue piece, 140
...locking step part, 200...contact, 210...connection part,
211... Connection portion, 300... Dielectric plate, 301... Penetration hole, 302... Earth/condenser electrode layer, 3
03... Separation capacitor electrode layer, 400... Earth plate, 402... Opening, 403... Locking tongue piece part, 404
...Latching piece.

Claims (1)

[Scope of Claims] 1 Comprising an insulating housing and a contact disposed in the insulating housing, the insulating housing has a coupling cavity in which a mating plug is fitted, and a connecting portion of the contact in an external manner. The contactor has a connecting portion disposed end portion for protruding toward the connecting portion, and the contact extends from the connecting portion through the connecting portion disposed end portion into the insulating housing to connect to the coupling portion. In a modular jack having an extension exposed in a cavity to provide a connection part, a cavity is formed at the end of the insulating housing where the connection part is provided, and the cavity has a ground connection. A board and a dielectric board are arranged, and the ground board is integrally formed with a conductive material having spring properties and has a U-shaped cross section, and the legs on both sides of the ground board are , a locking tongue part protruding outward is formed, an opening is formed in the plane part of the ground plate between the legs, and a connection terminal of the contactor is formed in the dielectric plate. A through-hole is formed through which the dielectric plate is inserted, and a grounding/condenser electrode layer is provided on one surface of the dielectric plate over almost the entire front surface except for the peripheral area of the through-hole, On the other side of the dielectric plate,
A separate capacitor electrode layer is provided around the through-hole, and the dielectric plate is arranged such that the through-hole is located within the opening and serves as the ground and the flat surface of the ground plate. A peripheral portion of the capacitor electrode layer is electrically and mechanically connected to a peripheral portion of the opening in the plane portion of the ground plate, and the connection portion of the contact is connected to the through hole of the dielectric plate. and is electrically and mechanically connected to the separated capacitor electrode layer, and a capacitor is formed by the ground/capacitor electrode layer, the dielectric plate, and the separated capacitor electrode layer; Both inner walls of the cavity of the insulating housing are provided with locking tongues that engage with the locking tongues of the legs on both sides of the earth plate when the earth plate is inserted into the cavity. A modular jack containing a capacitor, characterized in that it is provided with a locking step portion for fixing to the insulating housing. 2. The ground plate is provided with a locking piece for locking the capacitor-containing modular jack onto the printed circuit board and electrically connecting it to the printed circuit board conductor. A modular jack containing a condenser according to claim 1. 3. The capacitor-containing capacitor according to claim 1 or 2, wherein a plurality of the contacts are provided, and a plurality of the through-holes of the dielectric plate are also provided in a staggered arrangement. Modular jacket. 4. The dielectric plate is made of a ceramic material, and the ground/capacitor electrode layer and the separate capacitor electrode layer are solder plating layers applied to the surface of the dielectric plate. A modular jack containing a condenser as described in item 1 or 2 or 3.