JPH0443787Y2 - - Google Patents
Info
- Publication number
- JPH0443787Y2 JPH0443787Y2 JP10495184U JP10495184U JPH0443787Y2 JP H0443787 Y2 JPH0443787 Y2 JP H0443787Y2 JP 10495184 U JP10495184 U JP 10495184U JP 10495184 U JP10495184 U JP 10495184U JP H0443787 Y2 JPH0443787 Y2 JP H0443787Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermopile
- lower frame
- window
- frame
- shaped key
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
【考案の詳細な説明】 本考案はサーモパイルに係る。[Detailed explanation of the idea] The present invention relates to a thermopile.
サーモパイルのパツケージとしてはTO−5が
使用される。第1図は従来構造を示す破断斜視図
であつて、筒状容器本体1内にはヒートシンク2
が設けられる。3は赤外線透過用窓であつて該部
には多層膜赤外干渉フイルタ又はポリエチレンフ
イルム4などが貼着されてなる。こゝに多層膜赤
外干渉フイルタは特定の波長領域の赤外光のみを
選択的に透過すると言う機能及びサーモパイル素
子と外部環境とを隔絶すると言う機能を兼ね備え
ているのである。 TO-5 is used as the thermopile package. FIG. 1 is a cutaway perspective view showing a conventional structure, in which a heat sink 2 is provided inside the cylindrical container body 1.
is provided. 3 is an infrared transmitting window to which a multilayer infrared interference filter or a polyethylene film 4 is adhered. The multilayer infrared interference filter has both the function of selectively transmitting only infrared light in a specific wavelength range and the function of isolating the thermopile element from the external environment.
ところで、サーモパイルの実際使用で赤外光の
選択は必要でない場合もあり、そのような場合は
単にサーモパイル素子と外部環境の隔絶のために
ポリエチレンフイルムが用いられるのである。 By the way, there are cases where the selection of infrared light is not necessary in actual use of the thermopile, and in such cases, a polyethylene film is used simply to isolate the thermopile element from the outside environment.
以上の如く何れにしても従来構造のものは、ヒ
ートシンク及び窓枠が必要となりサーモパイルの
製造組立ては面倒且つ複雑な作業工程を必要とし
てコストアツプの原因となさしめている。 As described above, in any case, the conventional structure requires a heat sink and a window frame, and manufacturing and assembling the thermopile requires a troublesome and complicated work process, causing an increase in costs.
本考案は斯有る問題点を解決除去せんとするも
のであつて、即ちパツケージ自体に対し同時にヒ
ートシンクの機能を持たせるようにして構造の簡
略化を図つたものである。 The present invention is an attempt to solve and eliminate such problems, namely, to simplify the structure by providing the package itself with the function of a heat sink at the same time.
以下、本考案実施の一例を図面にもとづいて説
明する。第2図は一部破断斜視図、第3図は同縦
断面図である。 An example of implementing the present invention will be described below based on the drawings. FIG. 2 is a partially cutaway perspective view, and FIG. 3 is a longitudinal sectional view thereof.
上記図面で見られる通り本考案サーモパイル1
0は下枠10′と該下枠上方で嵌着される同形の
上枠10″とからなり、下枠10′は中央内方に凹
室11が設けられる。一方、該凹室11を取囲む
外周面はL字状の鍵段12に形成されてなり、こ
のさい垂直部は内方に向つて下降する一定角度の
傾斜壁12aに形成されるのであり、これに対し
水平部12bには電極ピン13a,13bが下向
きに埋入され、頭部eは水平部12bに露出状態
となされる。 As seen in the drawing above, the thermopile 1 of the present invention
0 consists of a lower frame 10' and an upper frame 10'' of the same shape that is fitted above the lower frame, and the lower frame 10' is provided with a recessed chamber 11 inside the center. The surrounding outer peripheral surface is formed into an L-shaped key step 12, in which the vertical part is formed as an inclined wall 12a that descends inward at a constant angle, whereas the horizontal part 12b has an L-shaped key step 12. The electrode pins 13a and 13b are buried downward, and the head e is exposed to the horizontal portion 12b.
他方、上枠10″は中央内部に上記下枠10′の
凹室11とほゞ同形をなす窓14を設けしめてな
り、且つ外周側の下半分は上記傾斜壁12aと係
合接触する同一形状の傾斜壁15aに形成される
のであり、また底面は水平部15bに形成される
のである。 On the other hand, the upper frame 10'' is provided with a window 14 having substantially the same shape as the concave chamber 11 of the lower frame 10' in the center thereof, and the lower half of the outer circumferential side has the same shape to engage and come into contact with the inclined wall 12a. The bottom surface is formed in the horizontal part 15b.
しかして、本考案では下枠10′の水平部12
b上にサーモパイル素子17を置き、上方から上
枠10″を嵌入させて両水平部との間でサーモパ
イル素子17を挾着しながら一体接合されるよう
になすのであり、嵌着にさいし傾斜壁12a,1
5aには接着剤を塗布しておく。このさい、両傾
斜壁は嵌め込みの位置精度が正確に保持される上
で著効があり、また接合が容易且つ迅速に行われ
るものとなるのである。 However, in the present invention, the horizontal portion 12 of the lower frame 10'
The thermopile element 17 is placed on top b, and the upper frame 10'' is fitted from above so that the thermopile element 17 is clamped between both horizontal parts and integrally joined. 12a,1
Apply adhesive to 5a. In this case, the two inclined walls are extremely effective in accurately maintaining the positional accuracy of fitting, and the joining can be performed easily and quickly.
こゝにサーモパイル素子17は有機フイルム
(マイラー膜など)上にSb,Biなど低融点の2種
類以上の金属薄膜で必要パターンを形成し、シン
タリングして融着接合させてなるもので窓14内
が温接合部を、水平部の挾着箇所が冷接合部を形
成してなる。 The thermopile element 17 is made by forming a required pattern on an organic film (Mylar film, etc.) with two or more types of thin films of metals with low melting points, such as Sb and Bi, and then sintering and fusion bonding them. The inner part forms a warm joint part, and the clamping part of the horizontal part forms a cold joint part.
なお、窓14の構造に於いて上方部に鍵段18
を設け、必要に応じ多層膜赤外干渉フイルタを取
付けるようにしても良い。19は樹脂モールドで
ある。 In addition, the structure of the window 14 has a key section 18 at the upper part.
A multi-layer infrared interference filter may be attached as required. 19 is a resin mold.
本考案品の製作にさいし材質としては単一金
属、合金、樹脂などが使用されるが、樹脂の場合
は表面を金属薄膜でコーテイングすることにより
赤外線反射率や熱電率などを高め、更らに電気的
シールドをすることもできるであり、また成型が
容易で多量且つ安価に製作することのできるもの
となる。 The materials used in the production of this product include single metals, alloys, and resins, but in the case of resins, the surface is coated with a thin metal film to increase the infrared reflectance and thermoelectricity. It can also be used as an electrical shield, and can be easily molded and manufactured in large quantities at low cost.
本考案で上枠10″はキヤツプ兼ヒートシンク
の機能を持つものであつて、従来品に比べて構造
を簡略化できるものとなり、製造組立てが容易の
ほか、安価となし得るものである。 In the present invention, the upper frame 10'' has the function of a cap and a heat sink, and the structure can be simplified compared to conventional products, making manufacturing and assembly easy and inexpensive.
第1図は従来構造を示す破断斜視図、第2図は
本考案品の一部破断斜視図、第3図は同縦断面図
である。
2……ヒートシンク、3……赤外線透過用窓、
10′……下枠、10″……上枠、11……凹室、
13a,13b……電極ピン、14……窓、17
……サーモパイル素子。
FIG. 1 is a cutaway perspective view showing a conventional structure, FIG. 2 is a partially cutaway perspective view of the product of the present invention, and FIG. 3 is a longitudinal cross-sectional view of the same. 2...Heat sink, 3...Infrared transmission window,
10'...lower frame, 10''...upper frame, 11...concave chamber,
13a, 13b...electrode pin, 14...window, 17
...Thermopile element.
Claims (1)
を設け、該凹室を取囲む周側にはL字状の鍵段を
形成するほか、上枠は中央内方に下枠の凹室と
ほゞ同形をなす窓を設けると共にその下面部を上
記L字状の鍵段と係合させて両者間でサーモパイ
ル素子を挾着するようになさしめ、且つ該挾着部
分に於ける下枠の鍵段水平部には電極ピンを取付
けた構成を特徴とするサーモパイル。 Consisting of a lower frame and an upper frame, the lower frame has a concave chamber inside the center, and an L-shaped key step is formed on the circumferential side surrounding the concave chamber. A window having substantially the same shape as the recessed chamber of the frame is provided, and its lower surface is engaged with the L-shaped key so that the thermopile element is clamped between the two, and the clamping portion is provided with a window. A thermopile characterized by a configuration in which electrode pins are attached to the horizontal part of the key stage of the lower frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10495184U JPS6119734U (en) | 1984-07-10 | 1984-07-10 | thermopile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10495184U JPS6119734U (en) | 1984-07-10 | 1984-07-10 | thermopile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6119734U JPS6119734U (en) | 1986-02-05 |
| JPH0443787Y2 true JPH0443787Y2 (en) | 1992-10-15 |
Family
ID=30664289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10495184U Granted JPS6119734U (en) | 1984-07-10 | 1984-07-10 | thermopile |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119734U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10327694A1 (en) * | 2003-06-20 | 2005-01-05 | Robert Bosch Gmbh | Optical sensor arrangement and corresponding manufacturing method |
| JP2005241457A (en) * | 2004-02-26 | 2005-09-08 | Hamamatsu Photonics Kk | Infrared sensor and manufacturing method thereof |
-
1984
- 1984-07-10 JP JP10495184U patent/JPS6119734U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119734U (en) | 1986-02-05 |
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