JPH0444042A - Photomask - Google Patents
PhotomaskInfo
- Publication number
- JPH0444042A JPH0444042A JP2153354A JP15335490A JPH0444042A JP H0444042 A JPH0444042 A JP H0444042A JP 2153354 A JP2153354 A JP 2153354A JP 15335490 A JP15335490 A JP 15335490A JP H0444042 A JPH0444042 A JP H0444042A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- vernier
- photomask
- accuracy
- pellicle frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012790 confirmation Methods 0.000 abstract description 9
- 238000011326 mechanical measurement Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置などの製造に使用するフォトマス
クのペリクル装着精度確認用のマークに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mark for confirming the accuracy of pellicle attachment of a photomask used in the manufacture of semiconductor devices and the like.
従来のフォトマスクのペリクル装着精度確認用のマーク
は、第6図(α)に示すように矩形の精度確認用マーク
5を、フォトマスク1のパターン面側のペリクルが装着
される位置に数ケ所設けていた。精度確認用マークの短
辺はペリタルフレームの装着位置規格であり、第6図(
b)に示すように、ペリクルフレーム4がすべて精度確
認用マーク5の上にあれば、ペリクル装着精度は正常で
あると判断していた。Conventional marks for checking the accuracy of pellicle attachment on photomasks include rectangular accuracy confirmation marks 5 at several locations on the pattern side of the photomask 1 at the positions where the pellicle is attached, as shown in FIG. 6 (α). It was set up. The short side of the accuracy confirmation mark is the mounting position standard for the perital frame, as shown in Figure 6 (
As shown in b), if all of the pellicle frames 4 were above the accuracy confirmation marks 5, it was determined that the pellicle mounting accuracy was normal.
しかし、前述の従来技術では、精度確認用マークをフォ
トマスク製造のパターン描画工程において同時に設ける
ため、精度確認用マークの位置にもばらつきが生じ、精
度確認用マークの短辺寸法を「ペリクル装着規格+マー
ク位置のばらつき」にしなげればならないという問題点
を有していたそこで本発明はこのような問題点を解決す
るもので、その目的とするところは、正確なペリクル装
着精度が求められる精度確認用マークを提供するところ
にある。However, in the above-mentioned conventional technology, since the accuracy confirmation mark is provided at the same time in the pattern drawing process of photomask manufacturing, the position of the accuracy confirmation mark also varies, and the short side dimension of the accuracy confirmation mark is Therefore, the present invention is intended to solve this problem, and its purpose is to reduce the accuracy required for accurate pellicle mounting accuracy. where a confirmation mark is provided.
本発明のフォトマスクは、四角形のペリクルを装着する
フォトマスクにおいて、フォトマスクのパターン面側の
端面の際とペリクルフレームが装着される位置に、バー
ニアを設けた事を特徴とする。The photomask of the present invention is a photomask to which a rectangular pellicle is attached, and is characterized in that a vernier is provided at the edge of the photomask on the pattern side and at the position where the pellicle frame is attached.
第1図(a)は本発明の実施例におけるフォトマスクの
平面図であって、フォトマスク1のパターン面側に、端
面の際にはバーニア2が、ペリクルフレームが装着され
る位置にはバーニア6がそれぞれ設けられている。第2
図(α)はバーニア2、バーニア6の実施例を示す図で
ある。実際の場合、バーニア2は第2図(b)のバーニ
ア2の拡大図に示すように、約半分フォトマスク1から
食み出し途切れた状態になる。FIG. 1(a) is a plan view of a photomask according to an embodiment of the present invention, in which a vernier 2 is installed on the pattern side of the photomask 1 at the end surface, and a vernier 2 is installed at the position where the pellicle frame is attached. 6 are provided respectively. Second
Figure (α) is a diagram showing an example of the vernier 2 and the vernier 6. In an actual case, as shown in the enlarged view of the vernier 2 in FIG. 2(b), about half of the vernier 2 protrudes from the photomask 1 and becomes discontinued.
次に、第1図(b)は本発明の実施例におけるフォトマ
スクにペリクルを装着した状態の平面図である。ペリク
ルを装着した時のバーニア3は、第2図(c)のバーニ
ア6の拡大図に示すように、約半分ペリクルフレームで
隠される。Next, FIG. 1(b) is a plan view of a state in which a pellicle is attached to a photomask in an embodiment of the present invention. When the pellicle is attached, about half of the vernier 3 is hidden by the pellicle frame, as shown in the enlarged view of the vernier 6 in FIG. 2(c).
前記実施例において実際の精度を求めてみると以下のよ
うになる。The actual accuracy obtained in the above embodiment is as follows.
第2図(b)のバーニア2の読み値は「−o、 6叫」
である。また第2図(c)のバーニア6の読み値は「−
0,1mm Jである。よって、本実施例の場合ペリク
ル装着精度は、
(装着精度)=(バーニア2)−(バーニア6)により
求められるので「−0,2mm Jとなる。The reading of vernier 2 in Figure 2 (b) is “-o, 6 screams”
It is. Also, the reading value of the vernier 6 in Fig. 2(c) is “-
0.1 mm J. Therefore, in the case of this embodiment, the pellicle mounting accuracy is determined by (mounting accuracy)=(vernier 2)-(vernier 6), so it is -0.2 mm J.
以上に述べたように本発明によれば、フォトマスクのパ
ターン面側の端面の際とペリクルフレームが装着される
位置に、バーニアを設ける事により、開学にかつ正確に
ペリクルの装着精度を求めることができるという効果を
有する。また、ノギスなど機械的な測定の必要もないの
で、異物付着の防止という効果も有する。As described above, according to the present invention, by providing a vernier at the edge of the pattern side of the photomask and at the position where the pellicle frame is mounted, the mounting accuracy of the pellicle can be obtained quickly and accurately. It has the effect of being able to Furthermore, since there is no need for mechanical measurements such as calipers, it also has the effect of preventing foreign matter from adhering.
第1図(α)、(b)は本発明のフオ)fスフの実施例
を示す、ペリクル装着前後の平面図である。
第2図(d)、(1,(C)は本発明のフォトマスクに
設けるバーニアの実施例を示す拡大図である。
第6図(α)、(b)は従来のフォトマスクを示す、ペ
リクル装着前後の平面図である。
1・・・・・・・・・フォトマスク
2・・・・・・・・・バーニア
6・・・・・・・・・バーニア
4・・・・・・・・・ペリクルフレーム5・・・・・・
・・・精度確認用マーク以上
出願人 セイコーエプソン株式会社FIGS. 1(α) and 1(b) are plan views showing an embodiment of the front panel of the present invention before and after mounting a pellicle. FIGS. 2(d), (1, and (C) are enlarged views showing examples of verniers provided in the photomask of the present invention. FIGS. 6(α) and (b) show conventional photomasks. These are plan views before and after the pellicle is attached. 1... Photomask 2... Vernier 6... Vernier 4... ...Pellicle frame 5...
...Accuracy confirmation mark or above Applicant: Seiko Epson Corporation
Claims (1)
フォトマスクのパターン面側の端面の際とペリクルフレ
ームが装着される位置に、バーニアを設けた事を特徴と
するフォトマスク。In a photomask equipped with a square pellicle,
A photomask characterized by a vernier provided at the edge of the pattern side of the photomask and at a position where a pellicle frame is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2153354A JPH0444042A (en) | 1990-06-12 | 1990-06-12 | Photomask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2153354A JPH0444042A (en) | 1990-06-12 | 1990-06-12 | Photomask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444042A true JPH0444042A (en) | 1992-02-13 |
Family
ID=15560630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2153354A Pending JPH0444042A (en) | 1990-06-12 | 1990-06-12 | Photomask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444042A (en) |
-
1990
- 1990-06-12 JP JP2153354A patent/JPH0444042A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100303743B1 (en) | An exposure method | |
| JP4286194B2 (en) | Pellicle frame and pellicle for photolithography using the frame | |
| US5557855A (en) | Reticle | |
| CN101625528B (en) | Mask clamp | |
| JPH0444042A (en) | Photomask | |
| JPS6022319A (en) | Semiconductor exposure apparatus | |
| JP2015001683A (en) | High-flatness pellicle for lithography | |
| US5552251A (en) | Reticle and method for measuring rotation error of reticle by use of the reticle | |
| JPH06324475A (en) | Reticle | |
| SG138458A1 (en) | Lithographic apparatus and device manufacturing method | |
| JPH0132044Y2 (en) | ||
| JPH0545710U (en) | Pellicle frame | |
| KR20050066889A (en) | Mark system and estimating method for overlay alignment and mask alignment | |
| JPS63103951A (en) | Dust inspection device | |
| JPS63220143A (en) | photo mask | |
| JPS5996729A (en) | Method for measuring positional accuracy of photomask and the like | |
| JPH08114911A (en) | Pellicle for photomask and photomask | |
| JPH0227811B2 (en) | ||
| JPH04102851A (en) | Reticle | |
| JP2764925B2 (en) | Method for manufacturing semiconductor device | |
| Skinner | Photomask limitations and directions | |
| JPS5858807B2 (en) | photo mask | |
| JPS61124943A (en) | mask | |
| JPH01228128A (en) | Alignment process | |
| JPH0437113A (en) | Contraction projecting aligner |