JPH044405U - - Google Patents
Info
- Publication number
- JPH044405U JPH044405U JP4436390U JP4436390U JPH044405U JP H044405 U JPH044405 U JP H044405U JP 4436390 U JP4436390 U JP 4436390U JP 4436390 U JP4436390 U JP 4436390U JP H044405 U JPH044405 U JP H044405U
- Authority
- JP
- Japan
- Prior art keywords
- signal lines
- transmission line
- dielectric layer
- ground layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims description 4
Landscapes
- Waveguides (AREA)
Description
第１図はこの考案の実施例の一部を示す斜視図
、第２図はこの考案の他の実施例の一部を示す斜
視図、第３図は第２図中の１本の信号線に対する
伝送路と等価な同軸伝送路を示す断面図、第４図
はこの考案の更に他の実施例の一部を示す断面図
、第５図はこの考案をマイクロストリツプライン
形式に適用した例を示す斜視図、第６図は従来の
プリント基板伝送路の一部を示す斜視図、第７図
は提案されているプリント基板伝送路を示す斜視
図である。
Fig. 1 is a perspective view showing a part of an embodiment of this invention, Fig. 2 is a perspective view showing a part of another embodiment of this invention, and Fig. 3 shows one signal line in Fig. 2. Fig. 4 is a sectional view showing a part of a further embodiment of this invention, and Fig. 5 is an example of applying this invention to a microstripline type. 6 is a perspective view showing a part of a conventional printed circuit board transmission path, and FIG. 7 is a perspective view showing a proposed printed circuit board transmission path.
Claims (1)
記誘電体層の他面に上記各信号線と対向し、これ
よりも幅の広い接地層がそれぞれ互いに分離され
て形成され、 上記各信号線とその対向する上記接地層とでそ
れぞれ独立した伝送路が構成されているプリント
基板伝送路。[Claims for Utility Model Registration] A plurality of signal lines are formed on one side of the dielectric layer, and a ground layer that is wider than the signal lines and is separated from the other side of the dielectric layer, respectively. A printed circuit board transmission line, wherein each of the signal lines and the ground layer facing each other form an independent transmission line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044363U JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044363U JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044405U true JPH044405U (en) | 1992-01-16 |
| JP2603022Y2 JP2603022Y2 (en) | 2000-02-14 |
Family
ID=31557597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044363U Expired - Lifetime JP2603022Y2 (en) | 1990-04-25 | 1990-04-25 | Printed circuit board transmission line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2603022Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082525A (en) * | 2009-10-12 | 2011-04-21 | Internatl Business Mach Corp <Ibm> | Ceramic package, method for reducing joint noise in ceramic package and controlling impedance discontinuity, and computer program (noise joint reduction and impedance discontinuity control in high-speed ceramic module) |
| JP2013510407A (en) * | 2009-11-06 | 2013-03-21 | モレックス インコーポレイテド | Multilayer circuit member and assembly therefor |
| JP2013089841A (en) * | 2011-10-20 | 2013-05-13 | Kyocer Slc Technologies Corp | Wiring board |
| JPWO2021182158A1 (en) * | 2020-03-11 | 2021-09-16 | ||
| JPWO2021182157A1 (en) * | 2020-03-11 | 2021-09-16 | ||
| WO2023037852A1 (en) * | 2021-09-07 | 2023-03-16 | 株式会社村田製作所 | Multilayer substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158502A (en) * | 1980-05-12 | 1981-12-07 | Junkosha Co Ltd | Strip line |
| JPS57143901A (en) * | 1981-02-27 | 1982-09-06 | Junkosha Co Ltd | Strip line |
-
1990
- 1990-04-25 JP JP1990044363U patent/JP2603022Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158502A (en) * | 1980-05-12 | 1981-12-07 | Junkosha Co Ltd | Strip line |
| JPS57143901A (en) * | 1981-02-27 | 1982-09-06 | Junkosha Co Ltd | Strip line |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082525A (en) * | 2009-10-12 | 2011-04-21 | Internatl Business Mach Corp <Ibm> | Ceramic package, method for reducing joint noise in ceramic package and controlling impedance discontinuity, and computer program (noise joint reduction and impedance discontinuity control in high-speed ceramic module) |
| JP2013510407A (en) * | 2009-11-06 | 2013-03-21 | モレックス インコーポレイテド | Multilayer circuit member and assembly therefor |
| JP2013089841A (en) * | 2011-10-20 | 2013-05-13 | Kyocer Slc Technologies Corp | Wiring board |
| JPWO2021182158A1 (en) * | 2020-03-11 | 2021-09-16 | ||
| JPWO2021182157A1 (en) * | 2020-03-11 | 2021-09-16 | ||
| US11751321B2 (en) | 2020-03-11 | 2023-09-05 | Murata Manufacturing Co., Ltd. | Resin multilayer substrate |
| WO2023037852A1 (en) * | 2021-09-07 | 2023-03-16 | 株式会社村田製作所 | Multilayer substrate |
| JPWO2023037852A1 (en) * | 2021-09-07 | 2023-03-16 | ||
| US12439505B2 (en) | 2021-09-07 | 2025-10-07 | Murata Manufacturing Co., Ltd. | Multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2603022Y2 (en) | 2000-02-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |