JPH0444149U - - Google Patents

Info

Publication number
JPH0444149U
JPH0444149U JP1990087302U JP8730290U JPH0444149U JP H0444149 U JPH0444149 U JP H0444149U JP 1990087302 U JP1990087302 U JP 1990087302U JP 8730290 U JP8730290 U JP 8730290U JP H0444149 U JPH0444149 U JP H0444149U
Authority
JP
Japan
Prior art keywords
external connection
connection terminal
bonding electrode
line
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990087302U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990087302U priority Critical patent/JPH0444149U/ja
Publication of JPH0444149U publication Critical patent/JPH0444149U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す斜視図、第２
図、第３図はそれぞれ第１図におけるＡ−Ａ′線
断面図、Ｂ−Ｂ′線破断断面図、第４図は従来の
ＩＣパツケージの一例を示す断面図、第５図は第
４図におけるＣ−Ｃ′線断面図である。 １……同軸線路、２……ボンデイング用電極、
３……外部接続用端子、４……ＧＮＤ、５……金
属板、６……誘電体基板、７……誘電体、８……
ＩＣ、９……ボンデイングワイヤ、１０……内層
導体、１１……ＩＣ収容部、１２……絶縁体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外部接続用端子とボンデイング用電極とＩＣの
    収容部とを有するＩＣパツケージにおいて、前記
    外部接続用端子と前記ボンデイング用電極との間
    の信号線路が同軸線路であることを特徴とするＩ
    Ｃパツケージ。
JP1990087302U 1990-08-21 1990-08-21 Pending JPH0444149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087302U JPH0444149U (ja) 1990-08-21 1990-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087302U JPH0444149U (ja) 1990-08-21 1990-08-21

Publications (1)

Publication Number Publication Date
JPH0444149U true JPH0444149U (ja) 1992-04-15

Family

ID=31819537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087302U Pending JPH0444149U (ja) 1990-08-21 1990-08-21

Country Status (1)

Country Link
JP (1) JPH0444149U (ja)

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