JPS6282736U - - Google Patents
Info
- Publication number
- JPS6282736U JPS6282736U JP1985174362U JP17436285U JPS6282736U JP S6282736 U JPS6282736 U JP S6282736U JP 1985174362 U JP1985174362 U JP 1985174362U JP 17436285 U JP17436285 U JP 17436285U JP S6282736 U JPS6282736 U JP S6282736U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- insulating base
- conductive path
- base substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本考案の他の実施例を示す断面図、第３図およ
び第４図は従来例を示す断面図である。 １……金属基板、２……導電路、３……絶縁ベ
ース基板、４……半導体素子、５，７……導体、
６……Ａｌワイヤー線。
は本考案の他の実施例を示す断面図、第３図およ
び第４図は従来例を示す断面図である。 １……金属基板、２……導電路、３……絶縁ベ
ース基板、４……半導体素子、５，７……導体、
６……Ａｌワイヤー線。
Claims (1)
- 金属基板と、該金属基板上に設けた所望形状の
導電路と、前記金属基板上の少なくとも一カ所に
固着された半導体材料からなる絶縁ベース基板と
、該絶縁ベース基板に設けられた導体と、該導電
路上にフエイスダウン接続される半導体素子とを
具備し、前記金属基板上に設けた導電路と前記絶
縁ベース基板上に設けた導体とをボンデイングワ
イヤーで電気的接続することを特徴とした混成集
積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985174362U JPS6282736U (ja) | 1985-11-13 | 1985-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985174362U JPS6282736U (ja) | 1985-11-13 | 1985-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282736U true JPS6282736U (ja) | 1987-05-27 |
Family
ID=31112672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985174362U Pending JPS6282736U (ja) | 1985-11-13 | 1985-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282736U (ja) |
-
1985
- 1985-11-13 JP JP1985174362U patent/JPS6282736U/ja active Pending