JPH0444171U - - Google Patents

Info

Publication number
JPH0444171U
JPH0444171U JP1990086772U JP8677290U JPH0444171U JP H0444171 U JPH0444171 U JP H0444171U JP 1990086772 U JP1990086772 U JP 1990086772U JP 8677290 U JP8677290 U JP 8677290U JP H0444171 U JPH0444171 U JP H0444171U
Authority
JP
Japan
Prior art keywords
lead
narrow
semiconductor device
wide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990086772U
Other languages
English (en)
Japanese (ja)
Other versions
JP2512626Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990086772U priority Critical patent/JP2512626Y2/ja
Publication of JPH0444171U publication Critical patent/JPH0444171U/ja
Application granted granted Critical
Publication of JP2512626Y2 publication Critical patent/JP2512626Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1990086772U 1990-08-21 1990-08-21 樹脂封止形光半導体装置 Expired - Fee Related JP2512626Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Publications (2)

Publication Number Publication Date
JPH0444171U true JPH0444171U (fr) 1992-04-15
JP2512626Y2 JP2512626Y2 (ja) 1996-10-02

Family

ID=31818609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086772U Expired - Fee Related JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Country Status (1)

Country Link
JP (1) JP2512626Y2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
JP2007019153A (ja) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd 光リンクデバイス
JP2011249433A (ja) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd 発光装置及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (fr) * 1980-05-26 1981-12-23
JPH0247070U (fr) * 1988-09-28 1990-03-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (fr) * 1980-05-26 1981-12-23
JPH0247070U (fr) * 1988-09-28 1990-03-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
JP2007019153A (ja) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd 光リンクデバイス
JP2011249433A (ja) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd 発光装置及びその製造方法

Also Published As

Publication number Publication date
JP2512626Y2 (ja) 1996-10-02

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees