JPH0444178U - - Google Patents
Info
- Publication number
- JPH0444178U JPH0444178U JP8777890U JP8777890U JPH0444178U JP H0444178 U JPH0444178 U JP H0444178U JP 8777890 U JP8777890 U JP 8777890U JP 8777890 U JP8777890 U JP 8777890U JP H0444178 U JPH0444178 U JP H0444178U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- layer
- wiring board
- printed wiring
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例による４層プリン
ト配線板を示す断面図、第２図は一実施例による
プリント配線板の正面図、第３図、第４図は従来
例による４層プリント配線板を示す図である。
図において、１は表面層（１層）プリントコン
タクト、２は裏面層（４層）プリントコンタクト
、３は内層（２層）プリントコンタクト、４は内
層（３層）プリントコンタクト、５ａ〜５ｄはス
ルーホールめつき穴、６ａ〜６ｄはパターン、７
は絶縁基板、８は内層電源、ＧＮＤはパターンで
ある。なお、図中同一符号は同一または相当部分
を示す。
Fig. 1 is a sectional view showing a four-layer printed wiring board according to an embodiment of this invention, Fig. 2 is a front view of a printed wiring board according to one embodiment, and Figs. 3 and 4 are four-layer printed wiring boards according to a conventional example. It is a figure showing a wiring board. In the figure, 1 is a surface layer (1 layer) printed contact, 2 is a back layer (4 layer) printed contact, 3 is an inner layer (2 layer) printed contact, 4 is an inner layer (3 layer) printed contact, and 5a to 5d are through-layer contacts. Hole plating holes, 6a to 6d are patterns, 7
8 is an insulating substrate, 8 is an inner layer power supply, and GND is a pattern. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
、表面層と裏面層の外部接続用プリントコンタク
ト間にある絶縁基板の一部を取り除いてスリツト
状にし、そのスリツト間にもプリントコンタクト
を設けたことを特徴とする３層構造以上のプリン
トコンタクトを備えたプリント配線板。 In a card edge type printed wiring board, a part of the insulating substrate between the printed contacts for external connection on the front layer and the back layer is removed to form a slit, and a printed contact is also provided between the slits. A printed wiring board with printed contacts of three or more layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8777890U JPH0444178U (en) | 1990-08-20 | 1990-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8777890U JPH0444178U (en) | 1990-08-20 | 1990-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444178U true JPH0444178U (en) | 1992-04-15 |
Family
ID=31820439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8777890U Pending JPH0444178U (en) | 1990-08-20 | 1990-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444178U (en) |
-
1990
- 1990-08-20 JP JP8777890U patent/JPH0444178U/ja active Pending
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