JPH0444190U - - Google Patents
Info
- Publication number
- JPH0444190U JPH0444190U JP8643090U JP8643090U JPH0444190U JP H0444190 U JPH0444190 U JP H0444190U JP 8643090 U JP8643090 U JP 8643090U JP 8643090 U JP8643090 U JP 8643090U JP H0444190 U JPH0444190 U JP H0444190U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- accommodating
- enclosure
- metal plate
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims 1
- 230000004308 accommodation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はスイツチング電源装置に適用した本考
案の一実施例を示す断面図、第２図は分解斜視図
、第３図は本考案の他の実施例を示す断面図であ
る。
１……電子部品収容体、２……回路基板、３…
…金属板、４……電力用半導体装置、４ａ……外
部リード、４ｂ……外囲体、５……電子部品収容
部、６……外囲体収容部、７……外部リード収容
孔（外部リード収容部）、８……押え部（押え手
段）、１５……貫通孔（スルーホール）。
FIG. 1 is a cross-sectional view showing one embodiment of the present invention applied to a switching power supply device, FIG. 2 is an exploded perspective view, and FIG. 3 is a cross-sectional view showing another embodiment of the present invention. 1...Electronic component housing, 2...Circuit board, 3...
... Metal plate, 4 ... Power semiconductor device, 4a ... External lead, 4b ... Enclosure, 5 ... Electronic component housing section, 6 ... Envelope housing section, 7 ... External lead accommodation hole ( external lead accommodating part), 8... holding part (holding means), 15... through hole (through hole).
Claims (1)
れた回路基板と、複数の電子部品収納部が形成さ
れ且つ絶縁性材料から成る電子部品収容体と、 電子装置の外壁を構成する金属板とを具備し、 外囲体と該外囲体の側面から導出された外部リ
ードとを有する複数の電力用半導体装置の前記外
部リードは折り曲げられて前記回路基板のスルー
ホールに固定され、 前記電子部品収納体は前記回路基板と前記金属
板との間に配置され、 前記電力用半導体装置の外囲体は前記回路基板
と前記金属板の延在する方向に略並行に前記電子
部品収納部内に配置され且つ絶縁性の押え手段に
よつて前記金属板側に押圧された状態で前記電子
部品収納部内に固定されることを特徴とする電子
装置。 (2) 前記電子部品収容部はそれぞれ外囲体収容
部と該外囲体収容部の近傍に配置された貫通孔か
ら成る複数の外部リード収容部から構成され、前
記電力用半導体装置は前記外囲体が前記外囲体収
容部に収容され且つ前記外部リードが前記外部リ
ード収容部に収容されて位置決め固定されている
請求項(1)の電子装置。[Scope of Claim for Utility Model Registration] (1) A circuit board on which a plurality of through holes and electric circuits are formed, an electronic component accommodating body formed with a plurality of electronic component accommodating parts and made of an insulating material, and an electronic device. A plurality of power semiconductor devices are provided with a metal plate constituting an outer wall, and each of the plurality of power semiconductor devices has an outer enclosure and an outer lead led out from a side surface of the outer enclosure. the electronic component housing is disposed between the circuit board and the metal plate, and the outer enclosure of the power semiconductor device is substantially parallel to the direction in which the circuit board and the metal plate extend. An electronic device, wherein the electronic device is disposed within the electronic component storage portion and is fixed within the electronic component storage portion while being pressed against the metal plate side by an insulating holding means. (2) The electronic component accommodating section is composed of a plurality of external lead accommodating sections each including an outer enclosure accommodating section and a through hole arranged in the vicinity of the outer enclosure accommodating section, and the power semiconductor device is connected to the outer lead accommodating section. 2. The electronic device according to claim 1, wherein the enclosure is housed in the enclosure accommodating part, and the external lead is housed and positioned and fixed in the external lead accommodating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8643090U JPH073674Y2 (en) | 1990-08-20 | 1990-08-20 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8643090U JPH073674Y2 (en) | 1990-08-20 | 1990-08-20 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444190U true JPH0444190U (en) | 1992-04-15 |
| JPH073674Y2 JPH073674Y2 (en) | 1995-01-30 |
Family
ID=31818091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8643090U Expired - Fee Related JPH073674Y2 (en) | 1990-08-20 | 1990-08-20 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073674Y2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220278A (en) * | 1998-01-29 | 1999-08-10 | Yazaki Corp | Heat dissipation structure of heat-generating components |
| JP2003513457A (en) * | 1999-11-05 | 2003-04-08 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electronic control unit |
| WO2006030606A1 (en) * | 2004-09-17 | 2006-03-23 | Kabushiki Kaisha Yaskawa Denki | Motor control device and method for assembling motor control device |
| JP2006310451A (en) * | 2005-04-27 | 2006-11-09 | Kyocera Corp | Electronic apparatus |
| EP1544915A3 (en) * | 2003-12-19 | 2007-12-05 | Hitachi Industrial Equipment Systems Co. Ltd. | Electronic module heat sink mounting arrangement |
| JP2010251487A (en) * | 2009-04-15 | 2010-11-04 | Mitsubishi Electric Corp | Circuit device and method of manufacturing circuit device |
| JP2013243264A (en) * | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | Electronic component attachment module and electric power conversion apparatus |
| CN104066311A (en) * | 2013-03-21 | 2014-09-24 | 株式会社丰田自动织机 | Substrate spacer and inverter device |
| JP2016115871A (en) * | 2014-12-17 | 2016-06-23 | Ｋｙｂ株式会社 | Electronic apparatus |
| JP2016220470A (en) * | 2015-05-25 | 2016-12-22 | 三菱電機株式会社 | Power equipment |
| JP2019507046A (en) * | 2016-11-08 | 2019-03-14 | 天津深之藍海洋設備科技有限公司Ｔｉａｎｊｉｎ Ｄｅｅｐｆａｒ Ｏｃｅａｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． | ROV propeller tail cover, ROV propeller and ROV |
| JP2019134534A (en) * | 2018-01-30 | 2019-08-08 | 三菱電機株式会社 | Power converter |
| EP3706520A1 (en) * | 2019-03-08 | 2020-09-09 | Mahle International GmbH | Mounting devices for semiconductor packages |
| JP2021088057A (en) * | 2021-03-04 | 2021-06-10 | 川崎重工業株式会社 | Robot controller |
| WO2024214243A1 (en) * | 2023-04-13 | 2024-10-17 | ファナック株式会社 | Motor drive device |
-
1990
- 1990-08-20 JP JP8643090U patent/JPH073674Y2/en not_active Expired - Fee Related
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11220278A (en) * | 1998-01-29 | 1999-08-10 | Yazaki Corp | Heat dissipation structure of heat-generating components |
| JP2003513457A (en) * | 1999-11-05 | 2003-04-08 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electronic control unit |
| EP1544915A3 (en) * | 2003-12-19 | 2007-12-05 | Hitachi Industrial Equipment Systems Co. Ltd. | Electronic module heat sink mounting arrangement |
| WO2006030606A1 (en) * | 2004-09-17 | 2006-03-23 | Kabushiki Kaisha Yaskawa Denki | Motor control device and method for assembling motor control device |
| JPWO2006030606A1 (en) * | 2004-09-17 | 2008-05-08 | 株式会社安川電機 | Motor control device and motor control device assembling method |
| JP2010178625A (en) * | 2004-09-17 | 2010-08-12 | Yaskawa Electric Corp | Motor control apparatus and method of assembling motor control apparatus |
| JP4548619B2 (en) * | 2004-09-17 | 2010-09-22 | 株式会社安川電機 | Motor control device |
| JP2012196132A (en) * | 2004-09-17 | 2012-10-11 | Yaskawa Electric Corp | Assembly method of motor control device |
| JP2006310451A (en) * | 2005-04-27 | 2006-11-09 | Kyocera Corp | Electronic apparatus |
| JP2010251487A (en) * | 2009-04-15 | 2010-11-04 | Mitsubishi Electric Corp | Circuit device and method of manufacturing circuit device |
| JP2013243264A (en) * | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | Electronic component attachment module and electric power conversion apparatus |
| CN104066311A (en) * | 2013-03-21 | 2014-09-24 | 株式会社丰田自动织机 | Substrate spacer and inverter device |
| JP2014183719A (en) * | 2013-03-21 | 2014-09-29 | Toyota Industries Corp | Member for holding distance between substrates, and inverter device |
| US9485865B2 (en) | 2013-03-21 | 2016-11-01 | Kabushiki Kaisha Toyota Jidoshokki | Substrate spacing member and inverter device |
| CN104066311B (en) * | 2013-03-21 | 2019-08-16 | 株式会社丰田自动织机 | Substrate gap retaining member and DC-to-AC converter |
| JP2016115871A (en) * | 2014-12-17 | 2016-06-23 | Ｋｙｂ株式会社 | Electronic apparatus |
| JP2016220470A (en) * | 2015-05-25 | 2016-12-22 | 三菱電機株式会社 | Power equipment |
| JP2019507046A (en) * | 2016-11-08 | 2019-03-14 | 天津深之藍海洋設備科技有限公司Ｔｉａｎｊｉｎ Ｄｅｅｐｆａｒ Ｏｃｅａｎ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． | ROV propeller tail cover, ROV propeller and ROV |
| US10780966B2 (en) | 2016-11-08 | 2020-09-22 | Tianjin Deepfar Ocean Technology Co., LTD | ROV propeller tailhood, ROV propeller and ROV |
| JP2019134534A (en) * | 2018-01-30 | 2019-08-08 | 三菱電機株式会社 | Power converter |
| EP3706520A1 (en) * | 2019-03-08 | 2020-09-09 | Mahle International GmbH | Mounting devices for semiconductor packages |
| JP2021088057A (en) * | 2021-03-04 | 2021-06-10 | 川崎重工業株式会社 | Robot controller |
| WO2024214243A1 (en) * | 2023-04-13 | 2024-10-17 | ファナック株式会社 | Motor drive device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073674Y2 (en) | 1995-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |