JPH0444290A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPH0444290A JPH0444290A JP14851290A JP14851290A JPH0444290A JP H0444290 A JPH0444290 A JP H0444290A JP 14851290 A JP14851290 A JP 14851290A JP 14851290 A JP14851290 A JP 14851290A JP H0444290 A JPH0444290 A JP H0444290A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- base plate
- metal base
- resin layer
- resist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011888 foil Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、アルミニュウム板２９ｗ４板等の金属板を
ベースとしたプリント配線基板の製造方法に係わり、更
に詳しくは成形工程を短縮させて生産性を向上させたプ
リント配線基板の製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board based on a metal plate such as an aluminum plate 29W4 plate, and more specifically, to shorten the molding process and improve productivity. The present invention relates to a method of manufacturing a printed wiring board with improved performance.
（従来の技術〕
従来、金属板をベースとしたプリント配線基板の製造方
法としては、例えば、第３図（ａ）→第３図（ハ）→第
３図（Ｃ）→第３図（ロ）→第３図（６）→第３図（社
）の工程による第１の製造方法と、第３図（ａ）→第３
図（ｂ） →第３図（Ｃ）−第３図（ｅ） →第３図（
ｆ）−第３図（６）→第３図（ハ）の工程による第２の
製造方法とが知られている。(Prior Art) Conventionally, as a method for manufacturing a printed wiring board based on a metal plate, for example, the method of manufacturing a printed wiring board based on a metal plate has been as follows: ) → Figure 3 (6) → The first manufacturing method according to the process of Figure 3 (sha), and the process of Figure 3 (a) → 3
Figure (b) → Figure 3 (C) - Figure 3 (e) → Figure 3 (
f) - A second manufacturing method according to the steps shown in FIG. 3(6)→FIG. 3(c) is known.
即ち、第１の製造方法は、第３図（ａ）に示すアルミニ
ュウム板、銅板等の金属ベース板ｌに、ドリルまたはパ
ンチングプレス等によって所定の大きさの貫通孔２を形
成した後（第３図Ｑ）））、第３図（Ｃ）に示すように
、金属ベース板ｌの一側面に、接着剤としての機能を有
する絶縁樹脂層３を介して金ｌｌ箔４を貼付け、そして
金属ベース板１の他側面に、複数枚（この実施例では２
枚）のプリプレグシート５を加熱加圧して貼り付ける（
第３図＠）、この時、第３図（転）に示すように絶縁樹
脂層３及びプリプレグシート５内から溶融流出した樹脂
６が、前記貫通孔２内に流入充填されると共に、前記絶
縁樹脂層３と、プリプレグシート５が溶融硬化した絶縁
樹脂層７とで金属ベース板１の両面が被覆され、金属箔
４を積層したプリント配線基板Ｘが製造される。That is, in the first manufacturing method, after forming a through hole 2 of a predetermined size in a metal base plate l such as an aluminum plate or a copper plate shown in FIG. As shown in FIG. On the other side of the board 1, there are a plurality of sheets (in this example, two
Heat and press the prepreg sheets 5 (sheets) and paste them (sheets).
At this time, as shown in FIG. 3 (roll), the resin 6 melted and flowed out from inside the insulating resin layer 3 and the prepreg sheet 5 flows into and fills the through hole 2, and at the same time, as shown in FIG. Both surfaces of the metal base plate 1 are coated with the resin layer 3 and the insulating resin layer 7 obtained by melting and hardening the prepreg sheet 5, and a printed wiring board X having the metal foil 4 laminated thereon is manufactured.
そして、このようにして製造されたプリント配線基板Ｘ
を、第３図（ハ）に示すように貫通孔２の中心に、同心
円でスルーホール８を貫通成形し、更に金属箔４に従来
の方法によりエツチング処理して不要部分を除去するこ
とによりプリント回路９を形成すると共に、スルーホー
ル８の内周面にメツキを施してスルーホールメツキ層１
０を形成し、プリント配線板Ｙを得るのである。And the printed wiring board X manufactured in this way
As shown in FIG. 3(c), a through hole 8 is formed in a concentric circle at the center of the through hole 2, and the metal foil 4 is etched by a conventional method to remove unnecessary parts. At the same time as forming the circuit 9, plating is applied to the inner peripheral surface of the through hole 8 to form the through hole plating layer 1.
0 is formed to obtain a printed wiring board Y.
また、上記第２の製造方法は、上述した第１の製造方法
における第３図（ｄ）の工程を、第３図（ｅ）及び第３
図（ｆ）の工程にしたものであり、その他の工程は第１
の製造工程と全く同様である。Further, the second manufacturing method described above replaces the step of FIG. 3(d) in the first manufacturing method described above with the step of FIG. 3(e) and
The process shown in Figure (f) is used, and the other steps are as follows.
The manufacturing process is exactly the same as that of .
即ち、第３図（Ｃ）の金属ベース板１の一側面に、接着
剤としての機能を有する絶縁樹脂層３を介して金属箔４
を貼付けた後、貫通孔２内に第３図（ｅ）に示すように
、予め成形しておいた孔埋め樹脂１１を埋設した後、金
属ベース板ｌの他側面に、プリプレグシート１２を加熱
加圧して貼り付ける（第３図（ｆ））。このようにして
成形した後は、第１の製造工程の第３図（ｇ）及び第３
図（社）と全く同様である。That is, a metal foil 4 is attached to one side of the metal base plate 1 in FIG. 3(C) via an insulating resin layer 3 that functions as an adhesive.
As shown in FIG. 3(e), a pre-formed hole filling resin 11 is buried in the through hole 2, and then a prepreg sheet 12 is heated on the other side of the metal base plate l. Apply pressure and paste (Fig. 3(f)). After molding in this way, the parts shown in Fig. 3 (g) and 3 of the first manufacturing process are
It is exactly the same as the figure (sha).
［発明が解決しようとする問題点］
然しながら、上記のような第１の製造方法は、第３図（
ｄ）の工程においてプリプレグシート５を加熱加圧して
貼り付ける際に、絶縁樹脂層３及びプリプレグシート５
内から溶融流出した樹脂６が前記貫通孔２内に流入充填
されると、その樹脂量に相当する絶縁樹脂層３及びプリ
プレグシート５の表面が凹み、絶縁層の厚さにむらが出
来てプリント配線基板Ｘの表面が平滑でなくなり、この
結果、精度の悪い欠陥製品となる問題があった。[Problems to be Solved by the Invention] However, the first manufacturing method as described above is similar to that shown in FIG.
When applying heat and pressure to the prepreg sheet 5 in step d), the insulating resin layer 3 and the prepreg sheet 5
When the resin 6 that has melted and flowed out from inside flows into and fills the through hole 2, the surfaces of the insulating resin layer 3 and prepreg sheet 5 corresponding to the amount of resin are dented, and the thickness of the insulating layer becomes uneven, causing printing. The surface of the wiring board X is no longer smooth, resulting in a defective product with poor precision.
また、第２の製造方法の場合には、孔埋め樹脂１１を予
め成形しておいて、貫通孔２内に孔埋めしなければなら
ない為に、製造工程が２工程または３工程増え、この結
果、生産性の向上を図ることが出来ない上に、コストア
ップになる問題があった。In addition, in the case of the second manufacturing method, since the hole-filling resin 11 must be molded in advance and filled into the through-hole 2, the number of manufacturing steps increases by two or three. However, in addition to not being able to improve productivity, there was also the problem of increased costs.
また、従来の第１及び第２の製造方法の場合には、スル
ーホール８の数が増えると、貫通孔２を形成するのに多
（の手間と時間を要し、また常に全ての貫通孔２を精度
良く加工するのは、非常に難しいと言う問題があった。In addition, in the case of the conventional first and second manufacturing methods, when the number of through holes 8 increases, it takes a lot of effort and time to form the through holes 2, and all the through holes are always There was a problem in that it was extremely difficult to process 2 with high precision.
この発明は、かかる従来の課題に着目して案出されたも
ので、加工工程を少なくして生産性の向上を図ることが
出来ると共に、常に精度の高いプリント配線基板を製造
することが出来るプリント配線基板の製造方法を提供す
ることを目的とするものである。This invention was devised by focusing on such conventional problems, and it is possible to improve productivity by reducing the number of processing steps, and also to make it possible to consistently manufacture highly accurate printed wiring boards. The object of the present invention is to provide a method for manufacturing a wiring board.
この発明は上記目的を達成するため、エツチング処理可
能な金属板の一方の表面に絶縁樹脂層を介して金属箔を
積層させ、該絶縁樹脂層を加熱加圧し、硬化させる一方
、金属ベース板の一方の表面側に保護フィルム、他方の
表面にレジストフィルムを貼付けた後、このレジストフ
ィルムにスルホールパターンを描いてエツチング処理に
より前記金属ベース板にスルホールと成る孔を形成し、
前記金属ベース板の両表面から保護フィルム及びレジス
トフィルムを剥がした後、プリプレグシートを積層させ
て加熱加圧することにより、プリプレグシート中の樹脂
を前記孔に充填することを要旨とするものである。In order to achieve the above object, the present invention laminates a metal foil on one surface of an etching-processable metal plate via an insulating resin layer, heats and presses the insulating resin layer to harden it, and at the same time After pasting a protective film on one surface and a resist film on the other surface, a through-hole pattern is drawn on the resist film and through-holes are formed in the metal base plate by etching,
After peeling off the protective film and the resist film from both surfaces of the metal base plate, the prepreg sheets are laminated and heated and pressurized to fill the holes with the resin in the prepreg sheets.
この発明は上記のように構成され、スルホールとなる孔
の形成を、エツチング処理で行うことにより従来の製造
工程を短縮出来ると共に、絶縁樹脂層を均一化でき、製
品精度を高めることが出来る上に生産性の向上を図るこ
とが出来るのである。The present invention is constructed as described above, and by performing the etching process to form holes that will become through holes, the conventional manufacturing process can be shortened, the insulating resin layer can be made uniform, and product precision can be improved. This makes it possible to improve productivity.
以下、添付図面に基づき、この発明の詳細な説明する。 Hereinafter, the present invention will be described in detail based on the accompanying drawings.
なお、従来例と同一構成要素は、同一符号を付して説明
は省略する。Note that the same components as those in the conventional example are given the same reference numerals, and the description thereof will be omitted.
第１図（ａ）〜第１図げ）は、この発明の実施例を示す
プリント配線基板の製造工程の説明図であって、第１図
（ａ）に示すアルミニュウム板、銅板等の金属ベース板
ｌの一側面に、第３図（ｂ）に示すように、接着剤とし
ての機能を有する絶縁樹脂層３を介して金属箔４を貼付
ける。FIGS. 1(a) to 1(g) are explanatory diagrams of the manufacturing process of a printed wiring board showing an embodiment of the present invention. As shown in FIG. 3(b), a metal foil 4 is pasted on one side of the plate 1 with an insulating resin layer 3 having an adhesive function interposed therebetween.
そして、第１図（Ｃ）に示すように、金属ベース板ｌの
一方の表面に保護フィルム１２ａ、他方の表面にレジス
トフィルム１２を貼付けた後、前記レジストフィルム１
２ｂにスルホールパターンを描いてエツチング処理によ
り前記金属ベース板１にスルホールとなる孔１３を形成
する（第１図（５））。Then, as shown in FIG. 1(C), after pasting the protective film 12a on one surface of the metal base plate l and the resist film 12 on the other surface, the resist film 1
A through-hole pattern is drawn on 2b and etching is performed to form holes 13 to serve as through-holes in the metal base plate 1 (FIG. 1(5)).
そして、前記金属ベース板１０両表面から保護フィルム
１２ａ及びレジストフィルム１２ｂを剥がした後、従来
と同様に複数枚のプリプレグシート１４を積層させて加
熱加圧する（第１図（ｅ））。これにより、前記絶縁樹
脂層３及びプリプレグシート１４中から溶融流出した樹
脂１５が、前記孔１３内に流入充填されると共に、第１
図げ）に示すように、前記絶縁樹脂層３と、プリプレグ
シート１４が溶融硬化した絶縁樹脂層１６とで金属ベー
ス板１の両面が被覆され、金属箔４を積層したプリント
配線基板Ｘが製造されるのである。Then, after peeling off the protective film 12a and the resist film 12b from both surfaces of the metal base plate 10, a plurality of prepreg sheets 14 are laminated and heated and pressed as in the conventional method (FIG. 1(e)). As a result, the resin 15 melted and flowed out from the insulating resin layer 3 and the prepreg sheet 14 flows into and fills the holes 13, and the first
As shown in Fig. 1, a printed wiring board X is produced in which both sides of the metal base plate 1 are covered with the insulating resin layer 3 and the insulating resin layer 16 obtained by melting and hardening the prepreg sheet 14, and a metal foil 4 is laminated thereon. It will be done.
そして、このようにして製造されたプリント配線基板Ｘ
は、従来と同様に、樹脂１５が充填された孔１３の中心
に、同心円でスルーホールを貫通成形しく図示省略）、
更に金属箔４に従来の方法によりエツチング処理して不
要部分を除去することによりプリント回路を形成すると
共に、スルーホールの内周面にメツキを施してスルーホ
ールメツキ層を形成しく図示省略）、プリント配線板を
得るのである。And the printed wiring board X manufactured in this way
As in the conventional case, a through hole is formed in a concentric circle in the center of the hole 13 filled with the resin 15 (not shown),
Furthermore, a printed circuit is formed by etching the metal foil 4 using a conventional method to remove unnecessary parts, and the inner peripheral surface of the through hole is plated to form a through hole plating layer (not shown). You get a wiring board.
また、第２図（ａ）〜第２図（Ｃ）は、この発明の第２
実施例を示し、この第２実施例は、上記第１実施例の第
１図（ａ）〜第１図（ｄ）と同様に、金属ベース板ｔに
スルーホールとなる穴１３を形成した後、別工程におい
て、第２図（ａＪに示すような内層材１日を調製する。Moreover, FIG. 2(a) to FIG. 2(C) are the second
This second example is similar to FIGS. 1(a) to 1(d) of the first example, after forming a hole 13 to be a through hole in the metal base plate t. In a separate step, an inner layer material as shown in FIG. 2 (aJ) is prepared.
この内層材１８は、通常の多層板の製造方法により製造
するものであり、例えば、両面銅張り積層板を整面し、
その面に感光性のフォントレジストをラミネートし、露
光、現像、エツチング、フォントレジスト剥離等の工程
を経て両面に回路１７．１７’を形成させる。このよう
にして、両面に回路１７゜１７°を形成させた積層板の
一枚が内層材１８が、或いはその複数枚をガラスクロス
にエポキシ樹脂、ポリイミド樹脂、変性ポリイミド樹脂
等を含浸させて成るプリプレグを介して積層させた内層
材１８である。This inner layer material 18 is manufactured by a normal multilayer board manufacturing method, for example, by leveling a double-sided copper-clad laminate,
A photosensitive font resist is laminated on that surface, and circuits 17 and 17' are formed on both sides through steps such as exposure, development, etching, and font resist peeling. In this way, one of the laminated plates with the circuits 17° and 17° formed on both sides is made up of the inner layer material 18, or a plurality of sheets thereof, made of glass cloth impregnated with epoxy resin, polyimide resin, modified polyimide resin, etc. This is an inner layer material 18 laminated with prepreg interposed therebetween.
このようにして調製した内層材１８を、第２図（ａ）に
示すように、内層材１８の両側にプリプレグシー）１４
．１４″を介して、前記実施例１の第１図（ａ）〜第１
図（イ）の工程により製造された金属ベース板１．１°
に、スルーホールとなる穴１３を形成したものを積層さ
せて、加熱。The inner layer material 18 prepared in this manner is coated on both sides of the inner layer material 18 with prepreg sheets 14 as shown in FIG. 2(a).
．． 14'' of the above-mentioned Example 1.
Metal base plate 1.1° manufactured by the process shown in Figure (A)
A layer with a hole 13 formed thereon that becomes a through hole is laminated and heated.
加圧するものである。It applies pressure.
これにより、前記絶縁樹脂層３及びプリプレグシー）１
４．１４’ 中から溶融流出した樹脂１５．１５’が、
第２図（ｂ）に示すように、前記孔１３内に流入充填さ
れると共に、前記絶縁樹脂層３と、プリプレグシート１
４，１４°カｆＪ融硬化した絶縁樹脂層１５．１５°と
で金属ベース板１，１”の両面が被覆され、そして、従
来と同様にスルーホール８．８゛を貫通成形し、第２図
（Ｃ）に示すように、金属箔４，４°に、従来の方法に
よりプリント回路を形成すると共に、スルーホール８．
８ の内周面にメツキを施してスルーホールメツキ層１
０を形成してプリント配線基板Ｘ°を製造するものであ
る。As a result, the insulating resin layer 3 and the prepreg resin layer 1
4.14' The resin 15.15' that melted and flowed out from inside was
As shown in FIG. 2(b), the insulating resin layer 3 and the prepreg sheet 1 are filled with the insulating resin layer 3 and the prepreg sheet 1.
Both sides of the metal base plate 1,1" are covered with the insulating resin layer 15.15" which is fused and hardened at 4.14°, and a through hole 8.8" is formed in the same manner as before, and the second As shown in Figure (C), a printed circuit is formed on the metal foil 4,4° by a conventional method, and a through hole 8.
Through-hole plating layer 1 is applied by plating the inner peripheral surface of 8.
0 is formed to manufacture a printed wiring board X°.
この発明は上記のような工程によりプリント配線基板を
製造するもので、特にスルホールとなる孔１３の形成を
、エツチング処理で行うことにより、スルホールの数が
多くなっても一度の位置決めにより同時に成形でき、成
形精度が向上する上、従来の孔開は工程や、孔に樹脂を
充填する工程を短縮出来、絶縁樹脂層３及び１６の厚さ
を均一化でき、製品精度を高めることが出来ると共に、
生産性の向上を図ることが出来るのである。This invention manufactures a printed wiring board by the process described above, and in particular, by forming the holes 13 that will become through holes by etching, even if the number of through holes is large, they can be formed at the same time by one positioning. In addition to improving the molding accuracy, it is possible to shorten the process of conventional hole punching and the process of filling the holes with resin, the thickness of the insulating resin layers 3 and 16 can be made uniform, and the product accuracy can be improved.
This makes it possible to improve productivity.
この発明は、上記のようにエツチング処理可能な金属板
の一方の表面に絶縁樹脂層を介して金属箔を積層させ、
該絶縁樹脂層を加熱加圧し、硬化させる一方、金属ベー
ス板の一方の表面側に保護フィルム、他方の表面にレジ
ストフィルムを貼付けた後、このレジストフィルムにス
ルホールパターンを描いてエツチング処理により前記金
属ベース板にスルホールと成る孔を形成し、前記金属ベ
ース板の両表面から保護フィルム及びレジストフィルム
を剥がした後、プリプレグシートを積層させて加熱加圧
することにより、プリプレグシート中の樹脂を前記孔に
充填するので、以下のような優れた効果を奏するもので
ある。In this invention, metal foil is laminated on one surface of the metal plate which can be etched as described above with an insulating resin layer interposed therebetween.
While the insulating resin layer is heated and pressurized to harden, a protective film is attached to one surface of the metal base plate and a resist film is attached to the other surface. A through-hole pattern is drawn on this resist film and the metal is etched by etching. After forming a through hole in the base plate and peeling off the protective film and resist film from both surfaces of the metal base plate, the prepreg sheets are stacked and heated and pressurized to fill the holes with the resin in the prepreg sheet. Since it is filled with water, it has the following excellent effects.
（ａ）、スルホールとなる孔の形成を、エツチング処理
で行うことにより、スルホールの数が多くなっても一度
の位置決めにより同時に成形でき、成形精度が向上する
。(a) By forming holes that will become through holes by etching, even if the number of through holes increases, they can be molded at the same time by positioning once, improving molding accuracy.
（ｂ）、従来の孔開は工程や、孔に樹脂を充填する工程
を短縮出来るので、生産性の向上を図ることが出来る。(b) Since the conventional hole drilling process and the process of filling the holes with resin can be shortened, productivity can be improved.
（Ｃ）、また、金属基板がユニバーサルになり、多様な
配線板に対応でき、多品種、少量生産に極めて有効とな
る。(C) Furthermore, the metal substrate becomes universal and can be used with a variety of wiring boards, making it extremely effective for high-mix, low-volume production.
【図面の簡単な説明】
第１図（ａ）〜第１図げ）は、この発明の実施例を示す
プリント配線基板の製造工程の説明図、第２図（ａ）〜
第２図（Ｃ）は、この発明の第２実施例を示すプリント
配線基板の製造工程の説明図、第３図（ａ）〜第３図（
へ）は、従来のプリント配線基板の製造工程の説明図で
ある。
１・・・金属ベース板、３・・・絶縁樹脂層、４・・・
金属箔、１２ａ・・・保護フィルム、１２ｂ・・・レジ
ストフィルム、１３・・・孔、１４・・・プリプレグシ
ート、１５・・・樹脂。[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1(a) to 1) are explanatory diagrams of the manufacturing process of a printed wiring board showing an embodiment of the present invention, and FIGS. 2(a) to 1)
FIG. 2(C) is an explanatory diagram of the manufacturing process of a printed wiring board showing a second embodiment of the present invention, and FIG. 3(a) to FIG.
1) is an explanatory diagram of the manufacturing process of a conventional printed wiring board. 1... Metal base plate, 3... Insulating resin layer, 4...
Metal foil, 12a... Protective film, 12b... Resist film, 13... Hole, 14... Prepreg sheet, 15... Resin.
Claims (1)
層を介して金属箔を積層させ、該絶縁樹脂層を加熱加圧
し、硬化させる一方、金属ベース板の一方の表面側に保
護フィルム、他方の表面にレジストフィルムを貼付けた
後、このレジストフィルムにスルホールパターンを描い
てエッチング処理により前記金属ベース板にスルホール
と成る孔を形成し、前記金属ベース板の両表面から保護
フィルム及びレジストフィルムを剥がした後、プリプレ
グシートを積層させて加熱加圧することにより、プリプ
レグシート中の樹脂を前記孔に充填することを特徴とす
るプリント配線基板の製造方法。A metal foil is laminated on one surface of an etching-processable metal plate via an insulating resin layer, and the insulating resin layer is heated and pressurized to harden, while a protective film is placed on one surface of the metal base plate, and a After pasting a resist film on the surface, a through-hole pattern was drawn on the resist film, holes were formed in the metal base plate by etching, and the protective film and resist film were peeled off from both surfaces of the metal base plate. A method for manufacturing a printed wiring board, characterized in that the holes are then filled with resin in the prepreg sheets by stacking the prepreg sheets and applying heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14851290A JP2864276B2 (en) | 1990-06-08 | 1990-06-08 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14851290A JP2864276B2 (en) | 1990-06-08 | 1990-06-08 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444290A true JPH0444290A (en) | 1992-02-14 |
| JP2864276B2 JP2864276B2 (en) | 1999-03-03 |
Family
ID=15454428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14851290A Expired - Lifetime JP2864276B2 (en) | 1990-06-08 | 1990-06-08 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2864276B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI393517B (en) * | 2010-05-04 | 2013-04-11 | 台光電子材料股份有限公司 | Method for manufacturing metal substrate |
| CN119715054A (en) * | 2024-12-13 | 2025-03-28 | 珠海杰赛科技有限公司 | Sample preparation method of resin sheet |
-
1990
- 1990-06-08 JP JP14851290A patent/JP2864276B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI393517B (en) * | 2010-05-04 | 2013-04-11 | 台光電子材料股份有限公司 | Method for manufacturing metal substrate |
| CN119715054A (en) * | 2024-12-13 | 2025-03-28 | 珠海杰赛科技有限公司 | Sample preparation method of resin sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2864276B2 (en) | 1999-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112770540B (en) | A processing method of a thick copper PCB board with a bonding structure in a step position | |
| JP3488839B2 (en) | Manufacturing method of printed wiring board | |
| US20160338193A1 (en) | Multilayer board and method of manufacturing multilayer board | |
| CN106507585B (en) | The Method of Improving the Resistance Value Accuracy of Buried Resistor Printed Circuit Board | |
| JPH0444290A (en) | Manufacture of printed circuit board | |
| JPH04127492A (en) | Material for printed wiring, manufacture thereof and printed wiring board | |
| JP2007073642A (en) | Method for manufacturing printed wiring board | |
| JP3583241B2 (en) | Manufacturing method of metal foil clad laminate and manufacturing method of printed wiring board | |
| JPH01241893A (en) | Manufacture of metal base laminated board | |
| JPH10126058A (en) | Manufacturing method of multilayer printed wiring board | |
| KR100299671B1 (en) | making method of multy metal printed circuit board | |
| CN114765928B (en) | Printed circuit board and laminating method thereof | |
| JPH0493093A (en) | Forming method for electronic component containing recess of circuit board | |
| JPH1110791A (en) | Bonding material for manufacturing single-sided metal-clad laminates | |
| JP3594765B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPH0417385A (en) | Manufacture of compound circuit board | |
| JPH11348177A (en) | Copper foil with resin, manufacture thereof, and multilayer printed wiring board using same | |
| JPH0878803A (en) | Printed wiring board and manufacturing method thereof | |
| JPH10313177A (en) | Manufacture of multilayered printed wiring board | |
| JP4876691B2 (en) | Manufacturing method of paste-filled prepreg and manufacturing method of circuit board | |
| JPH03194998A (en) | Manufacture of multilayer circuit board | |
| JP2004158672A (en) | Method for manufacturing multilayer board | |
| JPH0471707B2 (en) | ||
| JPH04312995A (en) | Manufacture of copper-clad board | |
| JPS6139598A (en) | Method of forming resist pattern |