JPH0444416B2 - - Google Patents
Info
- Publication number
- JPH0444416B2 JPH0444416B2 JP58173506A JP17350683A JPH0444416B2 JP H0444416 B2 JPH0444416 B2 JP H0444416B2 JP 58173506 A JP58173506 A JP 58173506A JP 17350683 A JP17350683 A JP 17350683A JP H0444416 B2 JPH0444416 B2 JP H0444416B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- lead frame
- auxiliary
- resin part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は熱硬化性樹脂を用いトランスフア形成
を行う樹脂封止半導体装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a resin-sealed semiconductor device in which a thermosetting resin is used to form a transfer.
第１図にヒートシンクを有するSIP（Single In
−line Package）型の半導体装置の一例を示し、
第２図にそのＡ−A′断面を示す。図において、
ヒートシンク３上にマウントされた半導体ペレツ
ト７はリードフレーム２のインナーリード部と細
線（ボンデイングワイヤ）６により接続されてい
る。またヒートシンク３はリードフレーム２に接
続体２3により固定されている。この状態でリー
ドフーレーム２をトランスフアモールド用の図示
しない金型に設置し、金型内のキヤビテイ（中空
部）に熱硬化性のエポキシ樹脂やシリコーン樹脂
を流し込み硬化させて、ペレツトを封止する樹脂
封止部１を形成する。
Figure 1 shows a SIP (Single In) with a heat sink.
-line Package) type semiconductor device is shown.
FIG. 2 shows the A-A' cross section. In the figure,
A semiconductor pellet 7 mounted on a heat sink 3 is connected to an inner lead portion of a lead frame 2 by a thin wire (bonding wire) 6. Further, the heat sink 3 is fixed to the lead frame 2 by a connecting body 2 3 . In this state, the lead frame 2 is placed in a mold for transfer molding (not shown), and thermosetting epoxy resin or silicone resin is poured into the cavity (hollow part) in the mold and hardened to seal the pellet. A resin sealing portion 1 is formed.
このようないわゆる低圧トランスフアモールド
成形法による樹脂封止工程は、量産に好適である
ため、今日広く採用されている。 Such a resin sealing process using a so-called low-pressure transfer molding method is suitable for mass production, and is therefore widely used today.
ところで、上記のようにして、トランスフアモ
ールドによりリードフレーム２に樹脂封止部１を
形成した場合に、モールド金型とヒートシンク３
との間のわずかな間〓を通して樹脂が漏れ、ヒー
トシンク３の特に側面に樹脂バリ５が形成され
る。
By the way, when the resin sealing part 1 is formed on the lead frame 2 by transfer molding as described above, the molding die and the heat sink 3
The resin leaks through the small gap between the heat sink 3 and the heat sink 3, and resin burrs 5 are formed particularly on the side surfaces of the heat sink 3.
このような樹脂バリ５は外観上好ましくない上
にヒートシンク３の放熱特性を悪化させ素子の信
頼性の低下を招くと共に、後に軽いシヨツク等で
バリ５が脱落し、このような装置が組み込まれた
製品の故障を引き起こす等の不都合を招く。 Such resin burrs 5 are not only undesirable in appearance, but also deteriorate the heat dissipation characteristics of the heat sink 3, leading to a decrease in reliability of the device.Furthermore, the burrs 5 were later removed by a light shock, etc., and such a device was not installed. This may cause inconveniences such as product failure.
このため、従来はナイフ状の工具により手作業
でバリ５を除去していたが極めて作業性が悪く、
製造コストが高くなるという問題があつた。 For this reason, conventionally, the burr 5 was removed manually using a knife-like tool, but the workability was extremely poor.
There was a problem of high manufacturing costs.
また、この他、例えばセラミツク粒子等の硬質
の粒子を高圧エアーで装置に吹き付けたり、硬質
粒子を水流で吹き付けたりするドライホーニング
やウエツトホーニング等によるバリ取り方法もあ
るが、ヒートシンク３に付着するバリ５は、厚い
場合が多く、思うようにバリ５を取ることができ
ない。さらに、ドライホーニングやウエツトホー
ニングにより十分にバリ５を取ろうとすると、ヒ
ートシンク３表面や樹脂部７表面までも傷つける
ため、好ましくない。 In addition, there are other deburring methods, such as dry honing or wet honing, in which hard particles such as ceramic particles are sprayed onto the device with high-pressure air, or hard particles are sprayed with a stream of water; The burr 5 is often thick and cannot be removed as desired. Furthermore, if an attempt is made to sufficiently remove the burr 5 by dry honing or wet honing, the surface of the heat sink 3 and the resin portion 7 will also be damaged, which is not preferable.
本発明は上記のような点に鑑みてなされたもの
で、極めて簡素な作業によりヒートシンク面のバ
リ取り作業を行うことのできる半導体装置の製造
方法を提供し、作業性の向上を図ろうとするもの
である。
The present invention has been made in view of the above points, and aims to improve workability by providing a method for manufacturing a semiconductor device that allows deburring of a heat sink surface with extremely simple work. It is.
すなわち本発明による樹脂封止半導体装置の製
造方法によれば、モールド金型としてバリを生じ
易い部分に補助樹脂を形成するための凹部を設け
た金型を用い、ペレツトがマウントされヒートシ
ンクと一体となつたリードフレームを樹脂封止す
ることにより、ヒートシンク側面にパツケージ本
体の樹脂部とは異なる補助樹脂部を有する装置を
形成する。次いで、このような装置の補助樹脂部
を、例えばリードフレームの不要な枠部等を切断
するリードカツト工程等、装置の不要部分を除去
する工程において叩き落とすようにするものであ
る。
That is, according to the method of manufacturing a resin-sealed semiconductor device according to the present invention, a mold is used that has a recess for forming an auxiliary resin in a part where burrs are likely to occur, and a pellet is mounted and integrated with a heat sink. By sealing the lead frame with resin, a device having an auxiliary resin part different from the resin part of the package body on the side surface of the heat sink is formed. Next, the auxiliary resin portion of such a device is knocked off in a step of removing unnecessary parts of the device, such as a lead cutting step of cutting an unnecessary frame portion of the lead frame.
以下図面を参照して本発明の一実施例につき説
明する。
An embodiment of the present invention will be described below with reference to the drawings.
第３図および第３図の装置Ｂ−B′断面を示す
第４図において、ヒートシンク３上にペレツト７
をマウントし、ボンデイングワイヤ６を用いてリ
ードフレーム２のインナーリードとペレツト７と
を接続する。 In FIG. 3 and FIG. 4, which shows a cross section of the device B-B' in FIG.
is mounted, and the inner lead of the lead frame 2 and the pellet 7 are connected using the bonding wire 6.
この後このリードフレーム２をトランスフアモ
ールド用の金型に設置し従来と同様の樹脂封止を
行うが、この金型としてキヤビテイのヒートシン
ク３の側面に当たる部位に凹部が設けられている
ものを用いる。 After this, this lead frame 2 is placed in a mold for transfer molding, and resin sealing is performed in the same way as in the conventional method, but the mold used is one that has a recess in the part of the cavity that corresponds to the side surface of the heat sink 3. .
このようにして、第３図および第４図に示すよ
うにヒートシンク３の露出部に樹脂部１とは異な
る補助樹脂部１０を形成する。ここで、この補助
樹脂部１０の断面は、第４図に示すように台形或
いは三角形であることが望ましい。また、上記補
助樹脂部１０は、パツケージの本体となる樹脂部
１と補助樹脂部１０とが一体とならないように、
接触部１１において接触する程度か、もしくは、
樹脂部１と補助樹脂部１０との間にある程度の間
隔が設定される程度に形成する。 In this way, an auxiliary resin section 10 different from the resin section 1 is formed in the exposed portion of the heat sink 3, as shown in FIGS. 3 and 4. Here, the cross section of this auxiliary resin part 10 is preferably trapezoidal or triangular as shown in FIG. In addition, the auxiliary resin part 10 is designed so that the resin part 1 that becomes the main body of the package and the auxiliary resin part 10 are not integrated.
The extent of contact at the contact portion 11, or
The resin part 1 and the auxiliary resin part 10 are formed so that a certain distance is set between them.
ここで、このようにしても、モールド樹脂であ
るエポキシやシリコーン樹脂は流動性が良いた
め、モールド工程において樹脂部１と補助樹脂部
１０間の接触部１１における金型とヒートシンク
３との間隔から樹脂が金型の補助樹脂部１０用の
凹部に注入され、凹部は充填される。 Even with this method, since the molding resin such as epoxy or silicone resin has good fluidity, the distance between the mold and the heat sink 3 at the contact area 11 between the resin part 1 and the auxiliary resin part 10 during the molding process Resin is injected into the recess for the auxiliary resin part 10 of the mold, and the recess is filled.
以上のようにして第３図および第４図に示すよ
うな装置を得た後、リードフレーム２の不要の外
枠部２1、ダム部２2、接続体２3等の枠部を切り
落とす。このリードカツト工程と同時に補助樹脂
部１０に例えば矢印１２方向に力を加え、補助樹
脂部１０を叩き落とす。 After obtaining the device as shown in FIGS. 3 and 4 as described above, unnecessary frame portions of the lead frame 2, such as the outer frame portion 2 1 , the dam portion 2 2 , the connecting body 2 3 , etc., are cut off. At the same time as this lead cutting process, a force is applied to the auxiliary resin part 10, for example in the direction of arrow 12, and the auxiliary resin part 10 is knocked off.
すなわち、リードカツト工程では通常第５図Ａ
およびＢに示すように、受け台２０上にリードフ
レーム２を固定し、矢印１３方向に切断具２１を
下げて切断する。従つて、補助樹脂部１０の幅ｌ
（第４図参照）をある程度とれば、ヒートシンク
３の側面に沿つた方向に補助樹脂部１０に容易に
力を加えられ、リードカツト用の切断具を用いて
リードカツトと同時に補助樹脂部１０を落とすこ
とができる。 That is, in the lead cutting process, normally
As shown in FIG. 2 and B, the lead frame 2 is fixed on the pedestal 20, and the cutting tool 21 is lowered in the direction of the arrow 13 to cut it. Therefore, the width l of the auxiliary resin part 10
(See Figure 4), you can easily apply force to the auxiliary resin part 10 in the direction along the side surface of the heat sink 3, and use a cutting tool for lead cutting to drop the auxiliary resin part 10 at the same time as cutting the lead. I can do it.
勿論、第３図および第４図に示すようなもので
はヒートシンク１の周囲に厚い樹脂バリが発生せ
ず、従来のように煩雑で困難な樹脂バリ除去作業
を行う必要がない。 Of course, in the case shown in FIGS. 3 and 4, thick resin burrs are not generated around the heat sink 1, and there is no need to perform the complicated and difficult resin burr removal work as in the conventional case.
以上のような本発明による樹脂封止半導体装置
の製造方法によれば、ヒートシンクの周囲に従来
のようなバリが発生せず、ヒートシンク表面やパ
ツケージ本体の樹脂部表面に傷をつけることなく
ヒートシンク面のバリを完全に除去できる。しか
も、従来のような作業性の悪いバリ取り工程を廃
止でき、生産コストの低減を図ることができる。
特にリードカツト工程と同時に補助樹脂部を落と
すようにすれば効果的である。
According to the method for manufacturing a resin-sealed semiconductor device according to the present invention as described above, burrs do not occur around the heat sink as in the conventional case, and the heat sink surface can be easily removed without damaging the heat sink surface or the resin part surface of the package body. burrs can be completely removed. Moreover, the conventional deburring process, which has poor workability, can be eliminated, and production costs can be reduced.
It is especially effective if the auxiliary resin part is removed at the same time as the lead cutting process.
第１図および第２図はそれぞれ従来の樹脂封止
半導体装置の製造方法を説明するための斜視図お
よび断面図、第３図および第４図はそれぞれ本発
明の一実施例に係る樹脂封止半導体装置の製造方
法を説明するための斜視図および断面図、第５図
はリードカツト工程を説明する断面図である。
１……樹脂部、２……リードフレーム、３……
ヒートシンク、７……半導体ペレツト、１０……
補助樹脂部、１１……接続部。
1 and 2 are a perspective view and a sectional view, respectively, for explaining a conventional method of manufacturing a resin-sealed semiconductor device, and FIGS. 3 and 4 show a resin-sealed semiconductor device according to an embodiment of the present invention, respectively. FIG. 5 is a perspective view and a cross-sectional view for explaining a method of manufacturing a semiconductor device, and FIG. 5 is a cross-sectional view for explaining a lead cutting process. 1...Resin part, 2 ...Lead frame, 3...
Heat sink, 7... Semiconductor pellet, 10...
Auxiliary resin part, 11... Connection part.
Claims (1)
封止することによりリードフレームおよびヒート
シンクと一体となつた樹脂部を有する装置を形成
する第１の工程と、上記リードフレームの不要部
分を除去する第２の工程とを具備し、 上記第１の工程において上記樹脂部とは実質的
に独立しかつ上記リードフレームに対して略直交
する上記ヒートシンク側面上に突出する補助樹脂
部を形成し、上記第２の工程において上記リード
フレームの不要部分とともに上記補助樹脂部を機
械的に除去することを特徴とする樹脂封止半導体
装置の製造方法。[Claims] 1. A first step of forming a device having a resin part integrated with a lead frame and a heat sink by sealing a semiconductor pellet with resin using a mold, and eliminating the need for the lead frame. and a second step of removing a portion of the heat sink, and in the first step, an auxiliary resin portion that is substantially independent of the resin portion and protrudes onto a side surface of the heat sink that is substantially perpendicular to the lead frame. A method for manufacturing a resin-sealed semiconductor device, characterized in that the auxiliary resin portion is formed and the auxiliary resin portion is mechanically removed together with the unnecessary portion of the lead frame in the second step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58173506A JPS6065555A (en) | 1983-09-20 | 1983-09-20 | Manufacture of resin-seal semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58173506A JPS6065555A (en) | 1983-09-20 | 1983-09-20 | Manufacture of resin-seal semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6065555A JPS6065555A (en) | 1985-04-15 |
| JPH0444416B2 true JPH0444416B2 (en) | 1992-07-21 |
Family
ID=15961785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58173506A Granted JPS6065555A (en) | 1983-09-20 | 1983-09-20 | Manufacture of resin-seal semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6065555A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770658B2 (en) * | 1987-12-17 | 1995-07-31 | 三菱電機株式会社 | Method for manufacturing semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5613738A (en) * | 1979-07-13 | 1981-02-10 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
-
1983
- 1983-09-20 JP JP58173506A patent/JPS6065555A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6065555A (en) | 1985-04-15 |
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