JPH0444804A - Automatic feeding and discharge apparatus of laser scriber substrate - Google Patents

Automatic feeding and discharge apparatus of laser scriber substrate

Info

Publication number
JPH0444804A
JPH0444804A JP2152376A JP15237690A JPH0444804A JP H0444804 A JPH0444804 A JP H0444804A JP 2152376 A JP2152376 A JP 2152376A JP 15237690 A JP15237690 A JP 15237690A JP H0444804 A JPH0444804 A JP H0444804A
Authority
JP
Japan
Prior art keywords
substrate
feeding
supply
magazine section
magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2152376A
Other languages
Japanese (ja)
Inventor
Ryoji Hakuta
伯田 良次
Masahiko Ando
正彦 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2152376A priority Critical patent/JPH0444804A/en
Publication of JPH0444804A publication Critical patent/JPH0444804A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Registering Or Overturning Sheets (AREA)

Abstract

PURPOSE:To prevent the receipt of 2 pieces of substrate steadily and contrive a speedy feeding and discharge of the same to and from a descending table by providing an outlet for substrate which has a slit permitting the passage of no more than one piece of substrate on the lower part of a feeding magazine part, fixing the substrate by adsorption and having a movable feeding table and registration base. CONSTITUTION:On the lower part thereof a feeding magazine part 14 is equipped with an outlet for substrate which has a slit permitting the passage of no more than one piece of substrate 23. A feeding table 15 is adjusted to the side of the feeding magazine part 14 and a substrate 23 is set thereon (initial position). To prevent the substrate from the dislocation, the substrate to be discharged 23 is securely fixed by an adsorbing opening 32 in the feeding side and the substrate to be received 23 by a suction opening 33 in the receiving side. The substrate 23 is discharged and moved to the processing position, while the processed substrate 23 is caused to slide into and be received by the lowermost part within the receiving magazine part 17, preceded by a synthetic resin plate 35. Thereafter, a registration base 16 is elevated to the height of processing, receiving the substrate 23 from the feeding table 15, adjusting its position, causing it to be sucked in a vacuum and simultaneously returning the feeding magazine part 14 and the receiving magazine part 17 to the initial position (by elevation).

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はレーザスクライパの加工位置にセラミック基板
(以下基板とする)を自動的に投入及び排出する装置に
係シ、特に基板の2蚊取シを防止し、高速に基板の投入
及び排出が可能なレーデスクライバ基板の自動投入排出
装置に関する。
Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a device for automatically loading and unloading a ceramic substrate (hereinafter referred to as a substrate) to a processing position of a laser scraper, and particularly relates to a device for automatically loading and unloading a ceramic substrate (hereinafter referred to as a substrate) into a processing position of a laser scraper. The present invention relates to an automatic loading/unloading device for a radar scriber board that prevents chipping and can load and unload the board at high speed.

(従来の技術) 従来のレーザスクライパ基板の自動投入排出装置は、伺
えば第12図の(a)及び(b)にそれぞれ平面図、正
面図を示すようにレーザスクライパ本体外に設置された
マガジンから真空パッドにより基板23を供給及び排出
するものが佃られている。この装置は、主に加工前の基
板23を保管しておく供給側マガジン1.供給側マガジ
ンl上に保管されている基板23を昇降させる供給側昇
降モータ2、基板23を吸着保持する吸着バッド3.吸
着バッド3を90度回転させる回転装置4.レーザスク
ライパ内のXY子テーブルに供給され九基板23を位置
決めする位置決めビン6、押し当てエアシリンダー7、
加工治具8.加工後の基板23を保管する排出側マガジ
ン9.排出側マガジン9上に保管した基板23を昇降さ
せる排出側昇降モータ10及び装置動作fフン)a−・
ルする制御用シーケンサ11から構成されでいる。
(Prior Art) A conventional automatic loading/unloading device for laser scraper boards is installed outside the laser scraper main body, as shown in FIGS. 12(a) and 12(b), which are a plan view and a front view, respectively. There is a device that supplies and discharges substrates 23 from a magazine using a vacuum pad. This device mainly consists of a supply side magazine 1. which stores substrates 23 before processing. A supply-side lifting motor 2 that raises and lowers the board 23 stored on the supply-side magazine l; a suction pad 3 that holds the board 23 by suction; Rotating device 4 for rotating the suction pad 3 by 90 degrees. a positioning bin 6 that is supplied to the XY child table in the laser scraper and positions the nine substrates 23; a pressing air cylinder 7;
Processing jig 8. A discharge side magazine 9 for storing the processed substrate 23. Operation of the ejection side elevating motor 10 and device for elevating and lowering the board 23 stored on the ejection side magazine 9
It is composed of a control sequencer 11 that performs control.

動作は、供給側昇降モータ2により供給側マガジンl上
に保管L4おいた基板23を吸着バッド3で吸着される
位置まで上昇させ7’l:後、#上部の基板23をアー
ムの先端に承句けた吸着バッド3で吸着し。ついで回転
装置4を作動させてアームを右側に90度回転させて基
板23をXYデープル5上に畝flit、、さらに位置
決めビン6で所定の位置にセット(8,た後、加工治具
8を用いて基板23に所定の穴、スリットなどを加工[
2て形成し5゜加工終了後加工済の基板23を再度吸着
バッド3で吸着すると同時に他の吸着バッド3で供給側
マガジン1から新L7い基板23を吸着し5.そしてア
ームを右@に90度回転させて加工済の基板23を排出
llvlツガ9上に載置すると同時iC覇り、い基板2
3は、XY子テーブル上に載置される。加工が開始され
るとアームは逆方向に90度回転し6加工絆了まで待機
する。以後上記の動作を繰り返シフ、供給側マガジン1
から基板23が無くなるまで全自動で加工が行われる。
The operation is as follows: The supply side lifting motor 2 raises the board 23 stored L4 on the supply side magazine l to the position where it is sucked by the suction pad 3. Adsorb it with Kureki Suction Pad 3. Next, operate the rotation device 4 to rotate the arm 90 degrees to the right to ridge the substrate 23 onto the XY table 5, and then set it in a predetermined position using the positioning bin 6 (8), and then set the processing jig 8. [
2. After forming the substrate 23 and completing the 5° processing, the processed substrate 23 is sucked again with the suction pad 3. At the same time, the new L7 substrate 23 is sucked from the supply side magazine 1 with the other suction pad 3.5. Then, when the arm is rotated 90 degrees to the right and the processed substrate 23 is ejected and placed on the llvl hemlock 9, the iC overrides the substrate 2.
3 is placed on the XY child table. When machining starts, the arm rotates 90 degrees in the opposite direction and waits until the end of the 6th machining process. After that, repeat the above operation and shift, supply side magazine 1
Processing is carried out fully automatically from to until the substrate 23 is used up.

(発明が解決しようとする課題) しかしながら上記に示す装置を用いて基板に加工を施す
場合、研蒙した基板を用いると、基板の面精度が高いた
め基板同上が密着し2.吸着バッドで基板を吸着すると
き2枚取りを起と−tという欠点が生じる。
(Problems to be Solved by the Invention) However, when processing a substrate using the above-mentioned apparatus, if a polished substrate is used, the surface accuracy of the substrate is high, so that the substrate adheres closely to the substrate. When picking up a substrate with a suction pad, there is a drawback of -t when two sheets are picked up.

まな基板の投入、取出し5の高速化を図るため。To speed up the loading and unloading of large boards.

基板の搬送時間を・短縮(,2り場合、基板の@看保持
を吸着パッドにより行っており、さらにアームを回転さ
せて基板を搬送するため、吸着パッドから基板が幕下し
たり、基板のbr置ずれが生じたりするンそれがある。
Reducing the time required to transport the board Misalignment may occur.

本発明は供給側マガジンからの基板の取出1,1(おい
で、確実[2秒取りを防止し、シ・−ザスクライバの加
工チー・ブルー・の基板の投入、排出の高速化が図れる
レーザスクライパ基板の自動投入排出装置を提供するこ
とを目的とするものである。
The present invention is a laser scriber that prevents the unloading of substrates from the supply side magazine (1, 1, 1, 2), and speeds up the loading and unloading of substrates in the machining process of the scissor scriber. The object of the present invention is to provide an automatic board loading/unloading device.

(allを解決するだめの手段) 本発明は上下に移動が可能であり、かつ下部に基′!!
11枚が通過で鼻る隙間を股!/を六基板取出[1を有
する供給マガジン部、上記と同様に上下VC#動が可能
であり、かつ下部に基板1枚が通過できる隙間を設は大
基板取入口を有する収納1ガジン部。
(Means for Solving All) The present invention is movable up and down, and is based on the bottom! !
11 pieces pass through the gap! A supply magazine section with a six-board ejector [1], and a housing magazine section with a large board intake port that can be moved up and down in the same manner as above, and has a gap at the bottom through which one board can pass.

該供給Tガジン部の最下部から取出し7た基板を吸着固
定する供給側吸着穴と加工が完了(,5た基板を吸着固
定する収納側吸着穴を有り、かつ供給−ンガジン部の下
部と収納マガジン部の下部との間を移動可能な搬送テー
ブル及び搬送デープルの供給・シガジン部から基板を移
し7替えて位置決めを行い吸着固定する位置合せ台を備
え、てなるレーザスクライパ基板の自動投入排出装置に
閣する。
Processing is complete with a suction hole on the supply side for suctioning and fixing the board taken out from the bottom of the supply T-gazine part. Equipped with a transfer table that can move between the lower part of the magazine section and a transfer table, and a positioning table that transfers the substrate from the magazine section, positions it, and fixes it by suction, it is equipped with a laser scraper that automatically loads and discharges substrates. Please pay attention to the equipment.

なお本発明におけるレーザスクライパの基板の自動投入
排出装置に用いられる基板としてはセラミック基板に用
いることが好ましAが、その他の基板に用いても差し支
えない。
The substrate used in the automatic substrate loading and unloading device of the laser scraper according to the present invention is preferably a ceramic substrate, but A may be used for other substrates.

(実施例) 以下本発明の実施例になるレーザスクライパ基板の自動
投入排出装置を図面により説明する。
(Embodiment) An automatic loading/unloading device for laser scraper substrates according to an embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明の実施例になるレーザスクライパ基板の
自動投入排出装置の斜視図。第2図、第3図、第4図及
び第5図は第1図の名1−ニットの拡大図並びV−第6
図7’7至第11図d本発明の実施例になるし・・−ザ
スクライバ基板の自動投入排出装置の動作を示す一部省
略断面図である。
FIG. 1 is a perspective view of an automatic loading/unloading device for laser scraper boards according to an embodiment of the present invention. Figure 2, Figure 3, Figure 4, and Figure 5 are the names of Figure 1 - enlarged view of knit and V - Figure 6.
FIGS. 7' to 11d are partially omitted cross-sectional views showing the operation of the automatic loading/unloading device for the scriber board according to an embodiment of the present invention.

本発明になるレーザスクライパ基板の自動投入排出装置
tは第1図に示すように、レーザスクライパ加工テーブ
ル12上のXY方向の任意の位置に架台13.さらにそ
の上部に供給マガジン部14゜搬送テーブル151位置
合せ台16及び収納ンガジ2・部17から構成されてい
る。なお第1図において23目、基板及び43は穴、ス
リットなどを加工するための加工lヘッドである。
As shown in FIG. 1, the automatic loading/unloading device t for laser scraper substrates according to the present invention is mounted on a pedestal 13. Furthermore, a supply magazine section 14, a conveyance table 151, an alignment table 16, and a storage magazine section 17 are arranged above the supply magazine section 14. In FIG. 1, 23 and 43 are a substrate and a processing head for processing holes, slits, etc.

第2図に供給マガジン部14の拡大図を示すが。FIG. 2 shows an enlarged view of the supply magazine section 14.

この供給マガジン部14は、レーザスクライパ加工テー
ブル12上の架台13上に固着された1対のステー18
と仁のステー18に暇付けられ六1対のり;アガイド1
9及びリニアガイド19に内蔵されたシリンダ(図示せ
ず)により上下方向に可動する供給マ・ガジン20から
構成さねている。
This supply magazine section 14 includes a pair of stays 18 fixed on a pedestal 13 on the laser scraper processing table 12.
And Jin's Stay 18 has left 61 pairs of glue; A guide 1
9 and a supply magazine 20 that is movable in the vertical direction by a cylinder (not shown) built into the linear guide 19.

第3図汀薪2図のA−Alli!断面図、詳1、〈は供
給マガジン部14の断面図を示すもので、供給マガジン
20i11:側板21.裏板22.下部に基板23が1
枚分だけ通過できる隙間りを設けた基板取出口を有する
表板24及び搬送テーブル15に接触しないように裏板
22の下部に取付けられた基板押え板25から構成され
ている。
A-Alli in Figure 3, Figure 2 of the firewood! Cross-sectional view, Detail 1, < shows a cross-sectional view of the supply magazine section 14, in which the supply magazine 20i11: side plate 21. Back plate 22. There is one board 23 at the bottom.
It is composed of a top plate 24 having a substrate ejection port with a gap that allows the substrate to pass through, and a substrate holding plate 25 attached to the lower part of the back plate 22 so as not to contact the transfer table 15.

第4図は搬送テーブル15の拡大図を示すもので、架台
13に固定されたガイドステー26.ガイドステー26
と共にボールネジ29上を水平方向に可動するリニアガ
イド27.ガイドステー26とIJ ニアガイド27を
可動させるためのモータ28及びフォトセンサ30によ
シ任意の位置に位置決め可能なテーブル部31から構成
されている。なおテーブル部31には供給マガジン部1
4から取出された基板23を吸着固定するための供給側
吸着穴32及び収納側吸着穴33が形成されており、こ
の供給側吸着穴32及び収納側吸着穴33には真空吸引
源(図示せず)までチューブ34が接続されている。ま
たテーブル部31の上面の先端にtlE1図に示す収納
マガジン部17の最下部の基板23の下面を滑り易くす
るため九合成樹脂板35が取付けられてもよい。
FIG. 4 shows an enlarged view of the transport table 15, and shows the guide stay 26 fixed to the pedestal 13. Guide stay 26
A linear guide 27 that moves horizontally on the ball screw 29 together with the linear guide 27. It is composed of a motor 28 for moving the guide stay 26 and the IJ near guide 27, and a table section 31 that can be positioned at any position using a photosensor 30. Note that the table section 31 has a supply magazine section 1.
A supply side suction hole 32 and a storage side suction hole 33 are formed to suction and fix the substrate 23 taken out from the substrate 4, and a vacuum suction source (not shown) is formed in the supply side suction hole 32 and storage side suction hole 33. The tube 34 is connected up to (1). Further, a synthetic resin plate 35 may be attached to the tip of the upper surface of the table portion 31 in order to make it easier to slide on the lower surface of the lowermost substrate 23 of the storage magazine portion 17 shown in FIG. tlE1.

第5図は位置合せ台16の拡大図を示す賜ので。FIG. 5 shows an enlarged view of the alignment table 16.

搬送テーブル15との接触を防止するため[2つに分か
れておシ、架台13に取付けた下ブロック36と垂直方
向に可動するリニアガイド37を介してシリンダー38
により上下動する上ブロック39及び該上ブロック39
に圧入され、基板位置決めの基準となる位置決めビン4
0.1N位置決めビン40に基板23を押付けて位置決
めを行う位置決めシリンダー41から構成されている。
In order to prevent contact with the transport table 15, the cylinder 38 is separated into two parts, and the cylinder 38
The upper block 39 moves up and down by
Positioning bin 4 that is press-fitted into the board and serves as a reference for board positioning.
It consists of a positioning cylinder 41 that positions the substrate 23 by pressing it against a 0.1N positioning bottle 40.

なお上ブロック39には基板反シ修正、基板固定のため
の吸着穴42が形成されている。
Incidentally, the upper block 39 is formed with a suction hole 42 for correcting the substrate warp and fixing the substrate.

本発明では上記の他に収納マガジン部を有するが、収納
マガジン部は第2図に示す供給マガジン部14とほぼ同
じ構成のため省略する。
Although the present invention has a storage magazine section in addition to the above, the storage magazine section is omitted because it has almost the same configuration as the supply magazine section 14 shown in FIG.

以下第6図乃至第11図によシ本発明の実施例[するレ
ーザスクライパ基へ自動投入、s出itO動作について
説明する。
6 to 11, an embodiment of the present invention [automatic input and output operations into and out of the laser scraper base will be described.

先ず第6図に示すように供給マガジン部14及び収納マ
ガジン部17を第2図に示すリニアガイド19に内蔵さ
れたシリンダ(図示せず)で上昇させ、一方位置合せ台
16t−第5図に示すシリンダ38で下降させ、さらに
搬送テーブル15を供給マガジン部14側に合せ、供給
マガジン部14内に基板23をセットする(初期位置)
First, as shown in FIG. 6, the supply magazine section 14 and storage magazine section 17 are raised by a cylinder (not shown) built into the linear guide 19 shown in FIG. The cylinder 38 shown in FIG.
.

この後第7図に示すように供給マガジン部14を搬送テ
ーブル15の供給側吸着穴32の部分まで下降させ、か
つ収納マガジン部17を搬送テーブル15の第4図に示
す合成樹脂板35上に下降し、基板23′の最下部を合
成樹脂板35に接触させる。このとき搬送時の基板位置
ずれを防止するため取出す基板23を供給側吸着穴32
で、また収納する基板23′を収納側吸着穴33でしっ
かりと吸着固定する。
Thereafter, as shown in FIG. 7, the supply magazine section 14 is lowered to the supply side suction hole 32 of the transport table 15, and the storage magazine section 17 is placed on the synthetic resin plate 35 of the transport table 15 shown in FIG. The lowermost part of the substrate 23' is brought into contact with the synthetic resin plate 35. At this time, the substrate 23 to be taken out is placed in the suction hole 32 on the supply side in order to prevent the substrate position from shifting during transportation.
Then, the substrate 23' to be stored is firmly suctioned and fixed by the storage side suction hole 33.

次に第8図に示すように搬送テーブル15上に供給マガ
ジン部14内の最下段の基板23を取出し、加工位置に
移動させる。一方加工済みの基板23′を収納マガジン
部17内の最下部に第4図に示す合成樹脂板35に続い
て滑り込ませ収納する。
Next, as shown in FIG. 8, the lowermost substrate 23 in the supply magazine section 14 is taken out onto the transport table 15 and moved to a processing position. On the other hand, the processed board 23' is slid and stored in the lowest part of the storage magazine section 17 following the synthetic resin plate 35 shown in FIG.

ついで第9図に示すように位置合せ台16.詳しくは第
5図に示す上ブロック39を加工高さまで上昇させ、搬
送テーブル15から基板23を受けとり9位置決めを行
い真空吸着すると同時に供給マガジン部14及び収納マ
ガジン部17を元の位置に戻す(上昇させる)。
Next, as shown in FIG. 9, the alignment table 16. In detail, the upper block 39 shown in FIG. 5 is raised to the processing height, the substrate 23 is received from the transfer table 15, the substrate 23 is positioned, vacuum suction is performed, and the supply magazine section 14 and the storage magazine section 17 are returned to their original positions (raised). ).

さらに第10図に示すように加工ヘッド43などを用い
て基板23に所定の穴、スリットなどを加工して形成す
ると同時に搬送テーブル15を元の位置(供給マガジン
部14側)に戻し待機する。
Furthermore, as shown in FIG. 10, predetermined holes, slits, etc. are processed and formed in the substrate 23 using a processing head 43, etc., and at the same time, the transfer table 15 is returned to its original position (on the side of the supply magazine section 14) and stands by.

この後第11図に示すように位置決め及び真空吸着を解
除し1位置合せ台16の第5図に示す上ブロック39を
下降して第6図に示す初期状態に戻す。
Thereafter, as shown in FIG. 11, the positioning and vacuum suction are canceled, and the upper block 39 shown in FIG. 5 of the first positioning table 16 is lowered to return to the initial state shown in FIG. 6.

(発明の効果) 本発明になるレーザスクライパ基板の自動投入排出装置
によれば、レーザスクライパ加工テーブルへの基板供給
を確実に行うことができ、基板搬送時の基板の位置ずれ
、基板の落下がなく、また基板の投入、取出しの高速化
を図ることができる。
(Effects of the Invention) According to the automatic loading/unloading device for laser scraper substrates of the present invention, it is possible to reliably supply the substrates to the laser scraper processing table, and to prevent the positional deviation of the substrates during substrate transfer. There is no fall, and it is possible to speed up the loading and unloading of substrates.

この九め基板1枚当シの加工時間を短縮することができ
、製品を安価に製造することができる。
It is possible to shorten the processing time for one of the nine substrates, and to manufacture the product at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

s1図は本発明の実施例になるレーザスクライパ基覧自
動投入、排出装置の斜視図、第2図乃至第5図は第1図
の拡大図を示すもので、第2図は供給マガジン部の拡大
図、第3図は第2図のA−Ail!断面図、第4図は搬
送テーブルの拡大図及び篤5図は位置合せ台の拡大図を
示し。第6図乃至第11図は本発明の実施例になるレー
ザスフライの バ基9動投入戸排出装置の動作を示す図であり。 第6図は初期状態を示す一部省略断面図、第7図は基板
を吸着した状態を示す一部省略断面図、第8図は基板の
取出し、収納を示す一部省略断面図。 第9図は位置合せ台を上昇させ、供給マガジン部及び収
納マガジン部を元の位置に戻す状態を示す一部省略断面
図、第10図は加工時の搬送チーフルの移動状態を示す
一部省略断面図及び第11図は位置合せ台が下降し、初
期状態に戻る状態を示す一部省略断面図並びに第12図
の(alけ従来のレーザスクライパめ基板府勧投入排出
装置を示す平面図及びfb)はその正面図である。 符号の説明 1・・・供給側マガジン 2・・・供給側昇降モータ3
・・・吸着バッド   4・・・回転装置5・・・XY
子テーブル 6・・・位置決めビン7°°゛押し当てボ
アシリンダー・ 8・・・加工治具    9・・・排出側マガジン10
・・・排出側昇降モータ 11・・・制御用シーケンサ 12・・・レーザスクライパ加工テーブル13・・・架
台     14・・・供給マガジン部15・・・搬送
テーブル 16・・・位置合せ台17−−・収納マガジ
ン部18・・・ステー19・・・リニアガイド 20・
・・供給マガジン21・・・側板     22・・・
長板23・・・基板     24・・・表板25・・
・基板押え板  26・・・ガイドステー27・・・リ
ニアガイド 28・・・モータ29・・・ボールネジ 
 30・・・フォトセンサ31・・・テーブル部  3
2・・・供給側吸着穴33・・・収納側吸着穴 34・
・・チューブ35・・・合成樹脂板  36・・・下ブ
ロック37・・・リニアガイド 38・・・シリンダー
39・・・上ブロック  40・・・位置決めビン41
・・・位置決めシリンダー 42・・・吸着穴    43・・・加工ヘッド■ ヒ) 2ざ七−y Y 回 め Δ 口 図 第 図 第 口 ■ /ρ 磨 ■ 図 z 曙
Figure s1 is a perspective view of a laser scraper reference automatic loading and unloading device according to an embodiment of the present invention, Figures 2 to 5 are enlarged views of Figure 1, and Figure 2 is a supply magazine section. An enlarged view of Figure 3 is A-Ail! of Figure 2. A sectional view, FIG. 4 is an enlarged view of the transport table, and FIG. 5 is an enlarged view of the alignment table. FIGS. 6 to 11 are diagrams showing the operation of a nine-motion loading/unloading device of a laser fly according to an embodiment of the present invention. FIG. 6 is a partially omitted cross-sectional view showing an initial state, FIG. 7 is a partially omitted cross-sectional view showing a state in which a substrate is sucked, and FIG. 8 is a partially omitted cross-sectional view showing the removal and storage of a substrate. Fig. 9 is a partially omitted cross-sectional view showing the state in which the alignment table is raised and the supply magazine section and the storage magazine section are returned to their original positions, and Fig. 10 is a partially omitted cross-sectional view showing the state in which the conveyance chiffle is moved during processing. The sectional view and FIG. 11 are a partially omitted sectional view showing a state in which the alignment table is lowered and returned to the initial state, and FIG. 12 is a plan view showing a conventional laser scraper substrate loading/unloading device. and fb) are its front views. Explanation of symbols 1... Supply side magazine 2... Supply side lifting motor 3
...Suction pad 4...Rotating device 5...XY
Child table 6... Positioning bin 7°° Pressing bore cylinder 8... Processing jig 9... Discharge side magazine 10
... Discharge side lifting motor 11 ... Control sequencer 12 ... Laser scraper processing table 13 ... Frame 14 ... Supply magazine section 15 ... Transport table 16 ... Positioning table 17- -・Storage magazine section 18...Stay 19...Linear guide 20・
...Supply magazine 21...Side plate 22...
Long plate 23... Board 24... Top plate 25...
・Board holding plate 26...Guide stay 27...Linear guide 28...Motor 29...Ball screw
30...Photo sensor 31...Table part 3
2... Supply side suction hole 33... Storage side suction hole 34.
...Tube 35...Synthetic resin plate 36...Lower block 37...Linear guide 38...Cylinder 39...Upper block 40...Positioning bin 41
...Positioning cylinder 42...Suction hole 43...Processing head■ H) 2za7-y Y Turn Δ Mouth diagram Figure Diagram mouth ■ /ρ Polish■ Figure z Akebono

Claims (1)

【特許請求の範囲】[Claims] 1、上下に移動が可能であり、かつ下部に基板1枚が通
過できる隙間を設けた基板取出口を有する供給マガジン
部、上記と同様に上下に移動が可能であり、かつ下部に
基板1枚が通過できる隙間を設けた基板取入口を有する
収納マガジン部、該供給マガジン部の最下部から取出し
た基板を吸着固定する供給側吸着穴と加工が完了した基
板を吸着固定する収納側吸着穴を有し、かつ供給マガジ
ン部の下部と収納マガジン部の下部との間を移動可能な
搬送テーブル及び搬送テーブルの供給マガジン部から基
板を移し替えて位置決めを行い吸着固定する位置合せ台
を備えてなるレーザスクライパ基板の自動投入排出装置
1. A supply magazine section that can be moved up and down and has a substrate ejection port with a gap at the bottom that allows one board to pass through; a supply magazine that can be moved up and down in the same way as above and has one board at the bottom. a storage magazine section with a substrate intake port with a gap through which the substrate can pass; a supply side suction hole for suctioning and fixing the substrate taken out from the bottom of the supply magazine section; and a storage side suction hole for suctioning and fixing the substrate that has been processed. and a transport table that is movable between the lower part of the supply magazine section and the lower part of the storage magazine section, and a positioning table that transfers and positions the substrate from the supply magazine section of the transport table and fixes it by suction. Automatic loading and unloading device for laser scraper boards.
JP2152376A 1990-06-11 1990-06-11 Automatic feeding and discharge apparatus of laser scriber substrate Pending JPH0444804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2152376A JPH0444804A (en) 1990-06-11 1990-06-11 Automatic feeding and discharge apparatus of laser scriber substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2152376A JPH0444804A (en) 1990-06-11 1990-06-11 Automatic feeding and discharge apparatus of laser scriber substrate

Publications (1)

Publication Number Publication Date
JPH0444804A true JPH0444804A (en) 1992-02-14

Family

ID=15539175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2152376A Pending JPH0444804A (en) 1990-06-11 1990-06-11 Automatic feeding and discharge apparatus of laser scriber substrate

Country Status (1)

Country Link
JP (1) JPH0444804A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106312495A (en) * 2015-06-30 2017-01-11 万润科技股份有限公司 Flow channel mechanism and conveying method and device using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106312495A (en) * 2015-06-30 2017-01-11 万润科技股份有限公司 Flow channel mechanism and conveying method and device using the same

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