JPH0444885B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an injection molding apparatus for printed circuit boards, and more particularly to a mold in a molding apparatus using a circuit film on which a circuit pattern made of an electrical conductor is formed. Concerning improvements to equipment.

(Prior art) Printed circuit boards are generally plate-shaped, but in recent years, irregularly shaped or three-dimensional ones are often required for storage in equipment and for mounting other parts such as switches. There is.

The present applicant first applied a circuit film on the mold parting surface of an injection molding apparatus for molding a substrate, on which a circuit pattern made of conductors constituting a printed circuit was formed, so that the circuit pattern was on the cavity side. By injection molding the
We proposed a method for manufacturing printed circuit boards that allows the formation of circuit patterns as well as the molding of the board. Of course, the present invention has the advantage that it can be easily implemented even when the shape of the substrate is not limited to a plate shape but any shape.

However, when molding, for example, a crank-shaped substrate or a box-shaped substrate with a hook-shaped cross section as shown in FIG.
However, when the circuit film 65 is placed on the mold surface and the mold is closed, the surface of the film is strongly rubbed against the corners of the mold, resulting in damage to the circuit pattern 60. It turned out that there was a problem with receiving the information. Such a problem is particularly noticeable at the opening corner edge 93 of the cavity mold 91 when the fixed side is the cavity mold 91 and the movable side is the core mold 92, as indicated by arrow C in FIG.

(Problems to be Solved by the Invention) Therefore, the present invention provides an injection mold for a printed circuit board having a pair of cavity mold and core mold as described above, in which a circuit film is disposed on the mold surface. The purpose of the present invention is to propose a structure of a mold device that prevents the circuit film from being damaged by the corners of the mold when the mold is closed.

(Means for Solving the Problems) That is, the present invention includes a pair of cavity mold and core mold that define the shape of a substrate molded product, and a pair of cavity molds and a core mold that are movably disposed between the cavity mold and the core mold. It consists of a frame, the frame holds a circuit film on the surface of which a circuit pattern made of conductors constituting a printed circuit is formed,
A print characterized in that the circuit film is configured to be moved relative to the core mold prior to closing of the cavity mold and the core mold, and to place the circuit film at a predetermined position on the surface of the core mold. Relating to injection molds for circuit boards.

(Example) Examples of the present invention will be described below with reference to the drawings.
Figure 1 of the accompanying drawings is a sectional view of the main parts of an injection mold for a printed circuit board showing an embodiment of the present invention when the mold is opened, and Figure 2 shows a state in which the circuit film is set in the core mold. 3 is a sectional view of the main part showing the molded state, and FIG. 4 is a sectional view of the main part showing the state of taking out the molded product.
FIG. 5 is a perspective view of the frame, FIG. 6 is a perspective view of the film holding member, FIG. 7 is an enlarged sectional view of the portion 7 in FIG. 2, and FIG. 8 is an enlarged view of the portion 8 in FIG. 3. FIG. 9 is a cross-sectional view of the main part of the frame shape showing a state in which the film is removed.

As shown in FIG. 1, the injection mold for a printed circuit board of the present invention has a pair of cavity mold 15 and core mold 25 for molding a printed circuit board. A frame mold 30 for holding a circuit film 65 having a circuit pattern 60 formed of a conductor on its surface is disposed between the cavity mold 15 and the core mold 25 so as to be movable with respect to the core mold 25. It is characterized by the fact that

That is, first, the cavity mold 15 has a cavity 15A for molding a box-shaped printed circuit board with a hook-shaped cross section, and in the embodiment, it is held on a fixed platen 10 via a fixed mold mounting plate 11. . Reference numeral 17 in FIG. 1 represents a sprue bushing.

On the other hand, the core 2 corresponding to the cavity 15A
A core mold 25 having a diameter of 5A is held on a movable platen 20 via a movable mold mounting plate 21.

The frame 30 is made of circuit film 65 as described above.
As can be better understood from the perspective view of FIG. 5, the main body frame member 31 is provided with a cavity 32 approximately in the center into which the core mold 25 is inserted. The core mold 2 is inserted into the hole 36 of the flange 35 provided on both sides of the main body frame member 31.
A connecting rod 38 extending from the 5th side is connected,
The frame mold 30 is configured to reciprocate toward or away from the core mold 25 together with the rod 38, which is expanded and contracted by controlling hydraulic pressure or the like.

As shown in FIG. 1, a circuit film 65 is placed on the side surface of the core mold 25 of the frame mold 30 so that the circuit pattern 60 faces the cavity mold 15 side. This circuit film 65 is sequentially rolled from the top to the bottom in the drawing by a feed roller (not shown) installed above the frame 30 and a take-up roller (not shown) installed below the frame 30. configured to be sent.

In order to guide this circuit film 65, as shown in FIG.
Relatively shallow and wide film guide grooves 33 are formed above and below the empty space 32. A guide roller 40 is further disposed within the film guide groove 33.
41, 42, and 43 are rotatably mounted on shafts.

Furthermore, a lock bar 45 is provided at the bottom of the frame 30 to fix the positioned circuit film 65. In FIG. 1, a reference numeral 39 detects the position of the circuit pattern 60,
This is a positioning sensor that determines the amount of feed. This lock bar 45 is configured to be moved forward and backward by a cylinder device 46, as understood from the sectional view of FIG. The reference numeral 47 in the figure is a hydraulic oil inflow port (or air inflow port), and 48 is a return spring.

A film presser 50 can be provided on the frame mold 30 if necessary. This film presser 50 is
As shown in FIG. 1, it is disposed at the upper and lower opening edges of the hollow part 32 of the frame mold 30 on the side of the cavity mold 15 so as to be able to slide diagonally upward and downward as indicated by the arrow a in the figure. In the embodiment, a part of the fixed mold side outer surface 55 of the film presser block 50 forms a part of the mold when the mold is clamped.

This film presser 50 has an engaging groove 51 and a flange 52 on an inclined surface 50A of a block-like main body as shown in the perspective view of FIG. It is slidably fitted into a mounting member 57 having a corresponding inclined slide groove 57A. As shown in FIGS. 7 and 8, the holding member 50 is biased outward by a return spring 59 interposed between the holding member 50 and the frame 30. As shown in FIGS. Reference numeral 53 in the figure is a stopper stepped portion provided within the engagement groove portion 51. Figure 8 shows the film presser 5
2 is a diagram showing a state in which the circuit film 65 is pressed against the core mold 25 by the bottom surface 56 of the block 0 in contact with the cavity mold 15. FIG.

(Operation) Next, the operation of the injection mold of this embodiment will be explained with reference to the drawings.

As shown in FIG. 1, before the cavity mold 15 and the core mold 25 are closed, a feed roller and a take-up roller (not shown) are required on the side surface of the core mold side of the frame mold 30 located between them. One circuit film 65 required for molding by rotating the angle
is supplied. When supplying the circuit film 65, the positioning sensor 39
It goes without saying that the predetermined position is confirmed by detecting the circuit pattern 60. When the circuit pattern 60 is placed in a predetermined position, the lock bar 45 at the bottom of the frame 30 is moved back by the operation of the cylinder device 46 to fix the circuit film 65 to the frame 30.

Next, as shown in FIG. 2, the frame mold 30 is moved to the core mold 25 side by the rod 38, and the core 2
The circuit film 65 is set at a predetermined position of 5A. At this time, since the lower side of the circuit film 65 is fixed by the lock bar 45 as described above, the circuit film 65 is sequentially fed out from the feed roller (not shown) disposed above.
The circuit film 60 is placed on the core 25A with the circuit pattern 60 facing the cavity mold 15. When setting the circuit film 65, it is preferable to reversely rotate the feed roller at a smaller angle to apply tension to the circuit film 65 and improve its adhesion to the core mold 25.

Next, as shown in FIG. 3, the core mold 25 is moved together with the frame mold 30 toward the cavity mold 15, and the mold is closed.

When closing the mold, the film presser 50 provided on the frame mold 30 is slid by the cavity mold 15 against the urging force of the return spring 59, as shown in FIG. The film 65 is tightly pressed onto the core mold 25.

After the mold is closed, molten resin constituting the substrate is injected into the cavity, and a substrate of a predetermined shape is molded integrally with the circuit pattern 60 formed on the circuit film 65. Reference numeral 19 in FIG. 3 is an injection nozzle.

When the injection molding is completed, the frame mold 30 is separated from the core mold 25 after the mold is opened, and the molded product 80 is taken out from the core mold 25, as shown in FIG. At this time, the tightening of the circuit film 65 by the lock bar 45 at the bottom of the frame 30 is released, and the film winding roller (not shown) at the bottom of the frame 30
The circuit pattern 60 is attached to the molded product and the unnecessary portion of the film body is peeled off from the molded product 80.

In order to facilitate the removal of the circuit film 65, as shown in FIG.
One or both of the film parts 42 may be advanced by the cylinder device 70 to peel off the unnecessary film body portion from the molded product in a perpendicular direction.

(Effects) As illustrated and explained above, the injection mold for printed circuit boards according to the present invention uses a cavity mold and a core mold to produce crank-type or box-type printed circuits having a hook-shaped cross section. When molding a circuit board integrally with a circuit film, even when the circuit film is placed on the mold surface and the mold is closed, the circuit film will not be damaged by the corners of the mold. This has made it possible to perform extremely efficient and reliable molding.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the main part of an injection mold for printed circuit boards showing an embodiment of the present invention, showing the mold opening state, and Fig. 2 is a main part of the injection mold for printed circuit boards in a state where the circuit film is set in the core mold. 3 is a sectional view of the main part showing the molded state, FIG. 4 is a sectional view of the main part showing the state of taking out the molded product, FIG. 5 is a perspective view of the frame, and FIG. 6 is a sectional view of the main part showing the molded product. FIG. 7 is an enlarged sectional view of the portion 7 in FIG. 2, FIG. 8 is an enlarged sectional view of the portion 8 in FIG. 3, and FIG. 9 is a perspective view of the holding member. FIG. 10 is a sectional view of essential parts showing a conventional mold apparatus when the mold is closed. DESCRIPTION OF SYMBOLS 10... Fixed plate, 15... Cavity type, 20... Movable plate, 25... Core type, 30... Frame type, 31... Body frame member, 32... Hollow part, 33... Guide groove, 40, 4
1, 42, 43... Guide roller, 50... Circuit film presser, 60... Circuit pattern, 65... Circuit film, 80... Molded product.

Claims (1)

[Scope of Claims] 1. Consists of a pair of cavity mold and core mold that define the shape of the substrate molded product, and a frame movably disposed between the cavity mold and the core mold, the frame mold being , holds a circuit film on which a circuit pattern made of conductors constituting a printed circuit is formed, and moves it relative to the core mold prior to closing the cavity mold and core mold, and holds the circuit film. An injection mold for a printed circuit board, characterized in that the circuit film is arranged at a predetermined position on a core mold surface.