JPH04458U - - Google Patents
Info
- Publication number
- JPH04458U JPH04458U JP4116390U JP4116390U JPH04458U JP H04458 U JPH04458 U JP H04458U JP 4116390 U JP4116390 U JP 4116390U JP 4116390 U JP4116390 U JP 4116390U JP H04458 U JPH04458 U JP H04458U
- Authority
- JP
- Japan
- Prior art keywords
- pressing side
- bonding tool
- featured
- sectional area
- equal intervals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案によるボンデイングツールの一
実施例を示す斜視図、第２図は本考案によるボン
デイング・ツールに給電するための一実施例を示
す斜視図、第３図及び第４図は従来のボンデイン
グ・ツールの斜視図、第５図は押圧面の温度分布
図である。
１……ボンデイングツール、２……押圧辺、３
……給電脚部、４……押圧面、５……給電端子、
６……熱電対、７……シヤンク、８……給電口。
FIG. 1 is a perspective view showing an embodiment of the bonding tool according to the present invention, FIG. 2 is a perspective view showing an embodiment for supplying power to the bonding tool according to the present invention, and FIGS. 3 and 4 are conventional FIG. 5 is a perspective view of the bonding tool, and FIG. 5 is a temperature distribution diagram of the pressing surface. 1... Bonding tool, 2... Pressing side, 3
...Power supply leg, 4...Press surface, 5...Power supply terminal,
6...Thermocouple, 7...Shank, 8...Power supply port.
Claims (1)
した押圧辺と、前記押圧辺上に一体化して断面積
が等しい給電脚部を４個以上かつ偶数個を等間隔
に設けることを特徴としたリフロソルダリング用
ボンデング・ツール。 A pressing side formed of a rectangular frame made of a conductive plate material having a uniform thickness, and an even number of four or more power feeding legs integrally formed on the pressing side and having the same cross-sectional area are provided at equal intervals. Featured bonding tool for reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4116390U JPH04458U (en) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4116390U JPH04458U (en) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04458U true JPH04458U (en) | 1992-01-06 |
Family
ID=31551594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4116390U Pending JPH04458U (en) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04458U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186269A (en) * | 1988-01-19 | 1989-07-25 | Toshiba Corp | Soldering device |
| JPH026052A (en) * | 1988-06-21 | 1990-01-10 | Toshiba Corp | Electric heating member |
-
1990
- 1990-04-19 JP JP4116390U patent/JPH04458U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186269A (en) * | 1988-01-19 | 1989-07-25 | Toshiba Corp | Soldering device |
| JPH026052A (en) * | 1988-06-21 | 1990-01-10 | Toshiba Corp | Electric heating member |