JPH0445902A - Laminating method for multi-layer ceramic base - Google Patents

Abstract

PURPOSE:To manufacture a multi-layer ceramic base with small inner-surface deformation by carrying a green sheet mounted on a picture frame type frame positioned accurately together with a positioning table, boring a guide hole and simultaneously cutting off the frame, punching, making the same vacuum sucked on the top force side of said cutting mechanism, carrying the laminating table and laminating on a lower jig. CONSTITUTION:A green sheet 1 mounted on a picture frame 2 is positioned by a positioning table 8 which is positioned in conformity with the reference line on a monitor television set 1 by means of two reference holes 5 on said sheet. Then, the sheet is positioned mechanically to a mold of a guide hole boring outer periphery cutting mechanism 29, and a guide hole 1a is bored and a picture frame section is cut. The sheet is vacuum sucked to the side of a top force 17 of said cutting mechanism 29 without moving the position and laminated on a bonding lower jig 31 within the cutting mechanism, and the laminating state is confirmed again by a monitor television set 24. At the bonding bime, the slidings among the layers to be generated by the pressure force in the sheet thickness direction are almost prevented by making a guide pin 22 and the guide hole 1a optimum, and the deformation in the surface is prevented by controlling the material flow by means of a side wall 31a of the bonding lower jig.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a multilayer ceramic ivy substrate by a sheet lamination method, and a method for manufacturing a multilayer ceramic ivy substrate by a sheet lamination method. The present invention relates to a laminating device and an adhesive force method, and in particular to a laminating method suitable for manufacturing a multilayer ceramic substrate with extremely small interlayer deviations and edge bulges.

[Conventional technology]

Conventionally, as a method of manufacturing a multilayer ceramic substrate, a plurality of clean sheets 1-- each made by filling a conductor into a pie hole and printing a wiring pattern on each sheet (fIL), are produced by heating and pressing the sheets. Lamination method huh? As a method for improving the positioning accuracy of the lamination of the clean sheet 1- in this manufacturing method, that is, the lamination accuracy, for example, as described in Japanese Patent Application Laid-Open No. 1249473/1983, There is a known method for positioning and stacking clean sheets 1 with high precision using a positioning chiffle, a monitor TV, and a stacking table.

For the horns θ, by optimizing the number of kite bins drilled in the clean sea 1 in the holes 1 and ′f and the clearance between the guide bins and the kite holes in the green sea I~, the problem that occurs during adhesion can be avoided. Maximum layer gap 1
It has been shown that the effect of

By the way, the method d\ in -1- is effective in minimizing the glabellar deviation, but it is effective in preventing the in-plane deformation of the clean sea I- that occurs when the pressure applied during adhesion is large. or small3. This problem becomes more pronounced as the number of layers increases in multilayer ceramics, and the in-plane deformation
Due to the shrinkage of the sintered A'1 during the sintering process after adhesion, the short shape becomes smaller, but it is still a large value for Iro 1, and becomes a problem when mounting an IC on the multilayer ceramic substrate of the rear element P1. 3゜ [Problem to be solved by the invention] The above-mentioned conventional technology does not take into account the prevention of in-plane deformation during adhesion of Green Sea 1 to 1 in the manufacturing method of multilayer ceramic substrates, and As the bonding pressure increases, the in-plane deformation increases, leading to the problem of electrical connection failure when mounting an IC on a multilayer ceramic substrate.

An object of the present invention is to provide a lamination method suitable for manufacturing a multilayer ceramic substrate with small in-plane deformation.

[Means to solve the problem]

The structure of the laminating apparatus according to the present invention is such that a kite hole is drilled in the clean sheet-1, and the kite hole is inserted into the kite bin set up on the lower bonding jig, so that the clean sheet I
A multilayer ceramic substrate is manufactured by sequentially laminating the first and second layers, and then bonding the second one with the jig plate placed on it and applying heat and pressure while restricting the material flow in the lateral direction of the Green Sea. The laminated seal used for lamination in the method for manufacturing multi-jC1 ceramic substrates by the lamination method
In the apparatus, a clean sheet 1, which has an image taken in the frame and at least two reference holes drilled therein, is placed in the picture frame 1. A positioning table that can be finely adjusted in the X, yy, and 0 directions, and a positioning table that can place and fix the Clean Sea 1- in contact with the JIT surface, and a positioning table on the positioning stage. ', 'l iij, L 1st person Chiful Sea North Clean Sea 1.l'11j A TV camera that can observe the Otomi reference hole, and a monitor that monitors the image of the base frame I hole from this TV camera. TV and
The kite hole has a laminated chiffle with fine adjustment @ 11f in two directions, which can place and fix the adhesive F jig with the guide bin upright, and a laminated chiffle that can cut the outer periphery and lamination stage, and this stage can cut and fix the positioning chiffle. Drilling a guide hole in the clean sheet 1-, which is placed and fixed on the mold, simultaneously performs machining and punching of the outer shape, and places the punched clean sheet 1 on the upper die side l.
A mold consisting of an upper mold and a lower mold that can be adsorbed and that can be stacked by inserting the kite hole of the adsorbed Clean Sea i into the kite bin of the lower bonding jig of the lamination table. The kite hole puncher is equipped with a peripheral cutting mechanism, a television camera that can observe the reference holes in the punched green sheet on the forward-bent stacking table in the stacking preparation stage, and a (!
A monitor TV that monitors the image of the 4 holes and the front position 11
The positioning table can be moved between the positioning stage and the hole cutting and laminating stage, and the old and laminated Add the chifur to the anti-layer I (1 (
A general feeding device (5) that can be used for general feeding between the prepared stainless steel and the guide hole (71 layers) can be used to cut the outer periphery and cut the guide hole.
Furthermore, during adhesion, the side walls of the lower adhesion tool are used to restrict the flow of the material in the lateral direction of the clean sheet due to pressurizing force.

In more detail, we will explain the positioning stage for positioning the green sea 1 attached to the picture frame, and the positioning stage for positioning the green sea 1, which is attached to the picture frame, and the positioning stage for positioning the green sea 1, which is attached to the picture frame, and the positioning stage for positioning the green sea 1, which is attached to the picture frame, and the positioning stage for positioning the green sea 1, which is attached to the frame-like frame, and the positioning stage for positioning the green sea 1, which is attached to the frame-like frame, and the positioning stage for positioning the green sea 1, which is inserted into the clean sea 1. A separate peripheral cutting and laminating stage is provided, and the Clean Sea I is placed on the frame-shaped frame that is accurately positioned on the positioning stage, together with the positioning table.
The guide/hole hole is provided in the outer circumferential cutting mechanism.The kite hole is fixed to the outer circumferential cutting/dead bed stage (transferred to A1, and here the kite hole is cut in the green sheet described in l'+ii). In step 1j, 'I, separate the clean sheet 1~ from the picture frame and punch it out 11', and at the same time punch out the clean sheet i. Fix it to the upper mold side with the vacuum mold 1, and move the mold to the upper mold side, and l) move the nail positioning table to the curved position H.
Return to i, t)'x stage and glue 1.
The jig is placed and fixed on the product 1i'j chifur into the chi l, and the hole is cut around the outer circumference l'lr (Guy in IIIli) -
To make the hole, accurately transport it to the outer periphery cutting and laminating stage, lower the upper die, and 1) 11.
The green sheet 1- is constructed so that it can be laminated. Furthermore, after peeling and laminating the green sheet 1- on the adhesive sheet ↓L during adhesion, the top plate of the adhesive jig is attached. is combined with the above-mentioned Adhesion-1 jig to form a set of jigs, and when bonding by heating and pressurizing this with a bonding nozzle for welding 71, in the thickness direction of Clean Sea I. The adhesion-1 jig is equipped with a side wall for restraining the green sheet from flowing in the plane and blistering due to the pressure applied to the green sheet.

[Operation] Green sea 1- to be laminated is monitored by at least two reference holes drilled in sea 1-j-.
The base 1 (:! positioning according to the line.
1' is determined, then the kite hole drill is mechanically positioned with respect to the mold of the outer circumference cutting machine No. 1, the frame part is cut, and the guide hole drill is placed on the F type side of the outer circumference cutting mechanism by vacuum suction. The guide holes are fixed to the gluing jig and the guide holes are laminated within the outer circumferential cutting mechanism, and the laminated state is checked again by the monitor, so misalignment during lamination can be almost prevented. . Furthermore, during bonding, deviations between 11 due to pressurizing force in the board thickness direction are almost prevented by optimizing the chi 1 (bin and chi) and holes, and in-plane deformation is prevented by material flow due to the side walls of the lower gluing fixture. 1. These can prevent interlayer displacement and in-plane deformation of the multilayer printed circuit board.

〔Example〕

In the following, the present invention will be explained with reference to Examples.

No. 1 is a schematic front view showing a laminating apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of Clean Sea I in FIG. 1, and No. 31 is No. 1. [The mold in A1 and the punching state of the clean sheet I~ by this,
Baz[11i11111tli'but it's huge.

First, Clean Sea 1.1 will be explained using FIG. 2.

This clean seal 1 is attached to a picture frame 2 with adhesive, and four reference holes 5 are drilled therein. Thickness 0
, 25 x 200 x 200 mm alumina clean sheet, and after gluing this clean sheet I- to the picture frame frame 2, it was drilled to a diameter of 0.2 mm with an NC drilling machine.
Via hole 3 with a diameter of 0.2 mm and 4 with a diameter of 0.2 mm. (Mold hole 5
(The installation position of 4 pieces is 4 of 100 x 1.0 Onlln.
Drill a hole in the corner) 3, Picture frame frame 2 (230X 23
The surface roughness of the end faces 6 and 7 of
, 5 μm to F, and the perpendicularity to ±3′ or less, and the positional accuracy of the reference hole 5 with respect to the end faces 6 and 7 is 3 μrn. 1 Wakuki Anaaki is behind, via hole 3
Filling printing and printing of wiring pattern 4 are performed to obtain Green Sea 1-1.

Next, the configuration of the laminating apparatus will be explained using FIGS. 1 and 3. .

8, as shown in detail in FIG. 3, the end surface of the picture frame frame 2 is attached to two orthogonal reference planes 8d, 8d.

Clean Sea 1~] can be placed and fixed by attaching 7 to 1.
This is a positioning table that is equipped with fine movement tables 8a, 8b, and 8c that are adjustable and have built-in stepping motors (not shown). For more details, see X fine movement table 8 a j
Clamp mechanism fixed to : ); Place the picture frame 2 made of clean sheet soil on the picture frame holding part 33cmH of the fixing part 33a of 3. Part: 331) , :i3 'b is brought into contact and splash J 5
) :', by the compressive force of IJ (movable part 331:
l, spring; I5 has 2 threads in the direction of marriage), the base of 2-) perpendicular to the fixed part 33a (I"1llj 8
The end surfaces 6 and 7 of the picture frame 2 are brought into contact with the ends 6 and 8 d, and the clean seal 1-1 can be clamped. And 0 fine movement table t's c
A slide bearing link 28 is attached to the lower surface of the slider.

Above the positioning stage 40, there is a There are four television cameras 10 that can be moved, and these cameras 0 have four cursor lines 12 that can monitor the image 13 of the reference hole 5 from the camera 10. A certain 12-inch monitor TV 1] is attached.

Reference numeral 21 is for mounting and fixing the adhesive F jig 1, 31 on which the guide bin z2 is erected, and is equipped with a height adjustment mechanism (171 not shown) with a built-in stepping motor.
\Fine adjustment fA possible product Jφ11 chifur. Further, on the lower surface of this laminated chiffle 21, a bearing holder (not shown) for the stays 1 to 1 is attached. There are 16 chisels 1 to 22 in a jar in the adhesive 1 and jig 31.
The diameter of so-\ (1 is the diameter to be drilled in Green Sea 1-1)
The hole is thick enough to have a clearance C of about 10 μm on one side. Also, the side wall of the bonding lower jig 31 has one side clearance/IQμrn with respect to the green sea 1.
In addition, in order to facilitate the insertion of the stopper mold 17 and the upper adhesive jig plate 12, a tlzi cut is applied to the opening.

29 comprises a mold consisting of a mold 17 and a mold 1z 16; cutting machine 1i172
The kite hole provided in the hole 9 is used for positioning the positioning chiffle 8 in the outer circumferential cutting 5+1 (the stacking stage 41 (see Fig. 3)).
(Guy 1 - Hole holes are positioned on the outer periphery cutting and stacking stage 41. Ribbon positioning and positioning will be described later) Guy 1 is placed and fixed on green sheet 1.
Hole] A hole drilling process and external punching process are performed at the same time, and the punched Green Sea 1-1 can be adsorbed to the vacuum suction plate 20 of the mold 2 17, and the adsorbed Green Sea 1 -4 guide 5' 1a laminated chiffle 21
(The holes can be made by inserting them into the pins 22 of the gluing jig plate 31 on the lamination table 21 positioned on the outer circumferential cutting and lamination stage 4) and laminating them. 1.For more details, please refer to "For the second type 17, the guide hole is punched by the punch 14.
, the outer circumferential cutting die part 15, the guide hole is a hole on which the punch 14 slides ("j punch sliding hole giiQ"), and the stripper brakes 1 to 27 and the stripper brake 1
・Vacuum suction reference hole 39 attached to the 1 side of 27
3, consisting of a vacuum suction plate 20 with a perforated
This -h type 17 is connected to the lower end of the rod 1 of the air cylinder 18 which is also used for pushing and pulling.
(It is attached to i! It is leaking and can be moved by the expansion and contraction of the front δ body. Lower mold) 6.

A scrap hole: 38 is provided for dropping downward the punching scraps 37 produced when punching the guide hole L L+ of Green Sea]-1. The kite hole 1a can be moved downward by the operation of the stepping motor 1 [6], and the guide hole 1a is punched by the punch 4 and the lower die 16. The lower mold 1 is squeezed by the outer peripheral cutting die part 15 and the outer shape punching force II i
T, can be made 1J at the same time.

Above the stage 42, the reference hole 5 of the punched clean sheet 1-I+ on the laminated chiffle 21 on the stage 42 can be observed.
There are 4 TV cameras 2 and 3 on the TV camera 2; 2 inch monitor with cursor line 25
or connected.

9 is placed and fixed on the frame 30, the positioning stage 40 and the guide hole connect the outer circumferential cutting and lamination stage 41 and the lamination preparation stage 42, and the positioning stage 8. The laminated kite rail 21 is a kite rail that can slide smoothly. Each of the above stages 40.4]
,, 42 has a fffi determining plate 40a,
41a and 42a are provided. flame:
At 30-, an air cylinder (not shown) for a positioning table is provided to the left of the positioning stage 40 (left side in FIG. 1), and the tip of the rod (not shown) of the air cylinder It is connected to the left side of the positioning chifur 8. Then, the rotor 1 is retracted and the positioning table 8 is manually moved on the guide Knoll 9 to bring the left side of the positioning table 8 into contact with the positioning plate 40a (the state shown in FIG. 1). By doing so, the positioning chiffle 8 can be positioned on the positioning stage 40. Also, by extending the target rod 1-, pushing the positioning table 8, and bringing its right side into contact with the positioning plate 4]i+ (state shown in Fig. 3), the positioning table 8 The chi I-hole can be positioned on the outer periphery cutting and stacking J (Gage stage 4I).

On the frame 30, on the right side of the lamination preparation stage 42 (the first
An air cylinder (not shown) for the front layer chifur is installed on the first side (71 mm), and the tip of the air cylinder F (not shown) is connected to the laminated chifur 21.
0 right side 1n1. Then, in the same manner as described above, the product J1 Guchiful 21 Wokaido hole is made on the outer periphery (
17i' and lamination stage 4], lamination preparation stage 4
2. It is possible to position each of them.

The conveying device is composed of an air cylinder for the positioning table (r'+if) 1 to rail 92, and an air cylinder for the stacked table.

The operation of the stacking device configured as above will be explained.

The air cylinder for positioning table 8 is operated, its rod is retracted, and the left side of positioning table 8 is brought into contact with positioning plate 40ti, and the positioning table 8 is positioned on positioning stage 40 (the state shown in FIG. 1).

The frame-shaped frame is attached to the frame-shaped frame, and the frame-shaped frame described above is attached to the frame-shaped frame holding section of the positioning table 8, and the four bases (1! I of the metal mask (not shown) with holes drilled therein) are attached to the designed positions. 33c, and movable parts 33b, :l are mounted on two sides of the picture frame.
', l b (spring: 3J1: With a compressive force of 15, the two ends of the frame-like frame are brought into contact with the reference surfaces 8d, 8d of the fixed part; 33a, and the metal mask is clamped. .

The reference hole of this metal mask is observed with a television camera]0, and the images are projected on a television monitor 12.

The cursor line 12 is placed on the outer periphery of this projected reference hole.

In addition, for the metal mask] 6 pieces (Clean Sea), 1
[Kai to drill a hole]・2 holes in the same places as a.

A kite hole with a size of 1'r, observe the 61st era standard 6 of this metal 4-1 master with the television camera 23, and display the images on the monitor 24-1-1. ``This is projected'' (Move the cursor line 25 to the outer periphery of the mold hole, 1st, move this gold Jsp, i sex master to the position ii Z face down chifur 8
and connection (11./frdan: (removed from 1, instead,
One Green Sea 1-1 to be stacked is placed and clamped in the same manner as before.

When the stacking device is turned on here, the reference hole 5 of the clean sheet 1-it on the positioning chiffle 8 is photographed by the television camera 10, and the image 13 is displayed on the monitor television 1.
], is projected on J2. Fine movement table 8a.

8b, 8c]) A. The Stetsvink motor is activated and adjusted so that the image 13 falls within the cursor line 12 within the predetermined error range 1. After this adjustment is completed, the fine movement chifur 8
;i, 8b, 8c are clamped. The air cylinder for the positioning table is extended,
Move the positioning table 8 or guide rail 9'' on which the clean sheets 1 to 1 are placed to the right (right side in Figure 1) (), and remove the kite hole in the outer circumference cutting mechanism 2 [] is the positioning plate 41εl of the outer periphery cutting and laminating stage 41
The positioning table 8 comes into contact with the positioning table 8 and stops 1].

The stevening motor 19 operates, and the lower die 16 moves forward until its upper surface contacts the lower surface of the green sea 1-1 and stops. , air cylinder 1B, 1", -] (1!17 is lowered, and the guide hole 1a is punched in the green sheet 1 using the punch 14 and the lower die 10. At the same time, the outer shape of the clean sheet is punched out by the outer periphery cutting tie part 15 and the lower die Ifi, and separated from the picture frame 2. At the same time,
The vacuum suction λ'i plate 20 of the mold 17 is activated, and the punched clean sheet 1-] is attracted to the vacuum suction plate 20, and the scraps 37 from the hole 13 are drawn downward through the pit hole 38. drop down. , and - ] type 2] 7 is -L : t'l
' and return to the initial position.

l'l'l it+4++ The lot of the air cylinder for the positioning table is shrunk, the positioning table 8 moves to the left on the guide rail 9-1-, and the positioning stage 4 is moved to positioning stage 4).
When it comes to the positioning plate 110r, it comes into contact with the positioning plate 110r and stops.

, and the separated picture frame-like frame 2 remaining in the positioning chiffle 8]- is removed. The lower die 16 descends to the initial position.

1'114' Recording 11 The lot of air cylinder for cutiful is extended, and the gluing lower jig:) 1 is placed ii' (fixed laminated chifur 2] or chi I-1 knoll ε)] is moved to the left horn]
V-cut, guide hole clear +-J outer periphery cutting and stacking 1i'l stage 711 position 11-j loss plate (not shown) thick laminated chiffle z1 or 4 and stop 1-1, 1 -Type 17 or +
: ++>L,,'-L air suction J+N20 Ni suction ff7
[Sat L tail,]] Removed clean sea - 1, 1 chi) - hole + 8 or glue - 2;
21\1 Mari Hagi, and the chi 1 ~ pin 22 or lower mold 1
The hole of 7 is drawn into the punch sliding hole and -C row<3. When the Clean Sheet 1 comes into contact with the upper surface of the adhesive lower jig plate (from next time onwards, the upper surface of the Clean Sheet 1 laminated last time), it will stop. (a ``l'' that joins the vacuum suction +, ``J 扛,'') (empty suction is discharged from the empty suction hole 39, and the clean sheet 1-1 separates from the vacuum suction plate 20 and adheres. The upper bar 117 returns to the initial position. The lot of the air cylinder for the stacking table shrinks,
The stacking table 2] moves to the right on the kite rail 9-'-, comes into contact with the positioning plate 42++ of the stacking stage 4, and stops. .

fA J? W Chiful 2
1+ clean sea 1, 1 of 1, and 5 were taken, I
1, the image 26 is displayed on the monitor television 24'-1, and the error between the image 2G and the cursor line 25 is a predetermined error. Then, the height of the laminated chiffle 21 or clean sea 1
The thickness of -1 is 3°.Next, place the second green sheet 1 on the positioning chiffle 8.
-Place the soil and clamp the soil using the clamp mechanism: +3). Thereafter, by the same operation as before, the two green sheets 1 of "I" are stacked on the adhesive jig 3I, and the odor is repeated.The image 26 and the cursor line 25
If the error is outside the predetermined error range, the clean sheet 1 is sweetened. When the predetermined number of green sheets have been laminated in this manner, the laminating apparatus returns to 01.■.

Product) Take out the jig 31 from the f-glue full 21-1 and glue the predetermined number of clean sheets 1.1 in four layers, and touch the seventh part: i? By placing the jig plate 32 (see FIG. 4) and heating and pressurizing it using a hot plate, a desired multi-JP't ceramic substrate can be obtained.

The bonding conditions were a pressure of 40 tl:l and a heating temperature of 40°.

Above all, when we talk about the lamination accuracy when carrying out the lamination JFI using the actual lamination force d and the wood lamination device, the main components of this lamination JFI 1 equipment・Mi's talent means that the mechanical stop is ±4μ+11 or more.Monitor TV] I, 24 is designed to project a 100 times larger image onto a 12-inch cathode ray tube. (The cursor line 1.2.25 is 7 tubes l = te approximately 0.
6mm1i), so(7) resolution power becomes 0μm,
±6 μi Yl of positioning on the fluoroun tube
can be suppressed to Even including the mechanical stop 1 saving, lamination! +'i degree is ±10μm' 2° tangent λ'
Regarding i′ accuracy, the number of kite pins 22 is 16 (using ζ jig handling: 31, )″[side clearance C was set to approximately 10 μIn, so the maximum interlayer deviation during bonding δ ] is 0 μm or less.

Therefore, the interlayer misalignment, which is the sum of the misalignment during layering and the misalignment during heat pressurization, can be suppressed to 20 μm or more.

In addition, conventionally, the final entry point in t'l after adhesion as shown in FIG.
ΔQ is about 2111111 when there is no side wall of the adhesive jig 31, and the side rfr in FIG.
However, by using the bonding jig '11 according to the present invention, the bulge was smaller than 30 μm as shown in Figure 7. Large 1+
The accuracy has been improved by ++, and the barrel-shaped bulge has almost disappeared as shown in Figure 8.

According to the described embodiment, the number of kite pins 22 on the lower bonding jig plate is 31, and the number of kite pins 22 on the lower bonding jig plate is
~Choose appropriate values for the hole 1a and the 1 side clearance C of the holes 1~bin 22, and stack the green sheet 1 on the gluing lower jig plate: (l) at the position where the guide hole 1a is drilled. Since it is made to be J-, it has the effect that it is possible to manufacture a small multi-J~ceramic plate with very small in-plane deformation of just 110 mm.

Oven failure (adjacent clean sheet) -
Therefore, there is a defect in which conduction cannot be established between the via hole 8), or a defect in which the via hole 33 and the wiring pattern 4 are short-circuited in the clean sheet 1 which is connected to the 11th micrometer). ': <A multilayer ceramic ivy substrate with an ultra-high density pattern].

Further, since the green sheet 1 is handled separately in the frame-like frame 2, there is no risk of breakage during conveyance to the crystal green sheet 1, and the yield is improved. In addition-C, after making sure that the scraps 37 in the kite hole 1a do not fall downward, the green sea [・
” has the advantage of not damaging the surface.

In this embodiment, four reference holes 5 are drilled in the clean sea 1. However, the number of reference holes 5 does not necessarily have to be four, and it is sufficient if there are two or more holes to the north. But 1. i, (The greater the number of K+465, the better the lamination accuracy.

In addition, according to this embodiment, Jj of Clean Sea-1-f,
(Since positioning is done using mold holes, each m
This has the effect of absorbing the deformation of individual sheets during the final lamination process, and ultimately reducing interlayer misalignment.

Also, in this embodiment, whether a trilled reference hole is used for positioning or not, iI! ;The hole in the mold can be a hole punched out (, Manoto, Green Sea 1).
It doesn't really depend on the shape as long as it can be recognized by a television camera.

Furthermore, in this embodiment, the cursor line at 1° on the monitor TV and the reference hole of the subject image were visually aligned, but this was automatically aligned by image processing using a computer. In addition, it is easy for those skilled in the art to minimize the positioning error by using a statistical method such as the least squares method, and using such a step. Automation further enhances the economic effectiveness of the present invention.

Furthermore, in one embodiment of the present invention, l'
Adding a mechanism for supplying L'isu (J' + Jta green sea) - in a 11ilJ manner according to the stacking order,
Also, J(-1N++,
'='r using Harney-1-Kasa's method3711
What's more, it's useful for automating layers, especially if there's a new feature in that part.

As another embodiment of the present invention, the embodiment shown in FIG. It is assembled into a mold for cutting the outer periphery.The method for reaching the lamination n in this example is not much different from the previous example shown in Fig. 1.At this time, the kite Saves drilling B<
L, but it doesn't matter. Accuracy"-, it's better to use 1 x bin.

Furthermore, as another embodiment of the present invention, kite drilling is omitted and only the outer circumference is cut, a television camera for positioning and lamination position confirmation is installed in the outer circumference cutting mold, and a positioning stage is further installed. The aforementioned outer periphery cutting mold l
The lower gluing jig is installed under the tie side of the outer circumference cutting type, positioning, outer circumference cutting,
Product Jl'711. The product 1e1 (the force that causes the 1゛dnin to end within the first herota of the bu1nos, is the force 'θt, and due to this talent, the time required for stacking 1 is significantly reduced by 11 or older, However, since there is a possibility that small scraps generated when punching the outer periphery of the green sheet 1- may get caught up in the green sheet 1-, the green sheet 1- should be made somewhat thicker to prevent scraps from getting into the wiring patterns 1-4. [Effects of the Invention] According to the present invention, the deviation between Wt1 of the green sheet is reduced to 20
Since it can be reduced to less than .mu.m, the yield of multi-W) ceramic substrates can be greatly improved compared to the conventional method, and yield defects can be reduced to .

Further, according to the present invention, the in-plane blowout after proofreading is performed 3 times.
Since it can be made to be less than 0 μrn, the number of mounting defects during IC chip mounting can be reduced to 3°.Furthermore, since the interlayer positional accuracy can be made highly accurate, the wiring pattern spacing of the clean sea j can be reduced to less than 1/2 of the conventional one. As a result, the overall mounting density is four times that of conventional methods! 3° that can be achieved with a multilayer ceramic substrate with high y

[Brief explanation of the drawing]

FIG. 1 shows a schematic diagram 1-1', track 1'!, of a laminating apparatus according to an embodiment of the present invention. , 1, 1st), 1 is the 11th me 1
1. This J-9 clean sea 1, diagonal C 1 (Fig.
3 is a detailed sectional view showing the punched state of the Green Sea 1~ shown in FIG. 1 (with hanging metal 4111), and FIG. 1, the cross-sectional view of FIG. 5 is closer than the prior art. 1) ΔF tfii l) λ[, Fig. 6 shows the 5
Look at /\-8' of 1's j? lft, Figure i, and Figure 7 are the results of the present invention/>i! Multilayer ceramics bonded according to example i''1 (inner view of the plate, Figure H3 is 71''
A1's I'-1'l' arrow view 11] r mountain j figure 3゜1 To green sea 1, 1a...Guide hole, 2 Forehead forest frame, 5... Reference hole, 8 - Positioning chiffle , 8 a-x fine movement table, 8b ・y fine movement table, 8c ・0 fine movement table, 8(''...1k''+riji, 9...guy!-rail,]0・TV camera, 1] Monitor TV Hi, Guy 1 hole is punched, tie part for punching the outer shape, lower 4+, il, 17/-1- type, vacuum suction plate, 21/JFi chiffle, guide pin,
23. TV camera, monitor TV, chi 1 hole light is outer circumferential cut... "machine t(1'?, gluing jig board, 32... contact upper ♂i tool board,... Tsukuda (wall,
40... place 1? : i trick stage, guy 1 - hole light is outer circumferential cutting and 'M', layer stage, lamination 711 (bi stage,. 4th Akime Yuotokuni)

Claims (1)

[Claims] 1. By drilling a guide hole in the green sheet and inserting the guide hole into the guide pin set on the lower bonding jig plate, the green sheets are sequentially stacked, and the upper bonding jig plate is placed on top of the green sheets and heated. In a method for manufacturing a multilayer ceramic substrate by a sheet lamination method in which the multilayer ceramic substrate is manufactured by applying pressure, the green is attached to a picture frame and has at least two reference holes. a positioning table that can be finely adjusted in the x, y, and θ directions and that can place and fix the green sheet by bringing the frame-like frame of the sheet into contact with a reference surface; A television camera that can observe the reference hole of the green sheet, a monitor television that monitors the image of the reference hole taken by the television camera, and a guide pin that is installed to prevent bulges on the edge of the green sheet when bonding the green sheet. An adhesive lower jig plate having side surfaces that can be restrained can be placed and fixed. It has a lamination table that can be finely adjusted in the z direction and a lamination stage that also performs guide hole drilling and outer periphery cutting, and this stage performs guide hole drilling and outline cutting on the green sheet that is placed and fixed on the positioning table. At the same time, the punched green sheet can be adsorbed to the upper mold side, and the guide holes of the adsorbed green sheet can be inserted into the guide pins of the lower adhesion jig plate on the lamination table for lamination. a guide hole-cutting mechanism equipped with a mold consisting of an upper mold and a lower mold; a television camera capable of observing the reference hole of the punched green sheet on the lamination table in the lamination preparation stage; A monitor television that monitors an image of the reference hole captured by the television camera, and the positioning table and the stacking table are movably mounted;
The positioning table can be transported between the positioning stage and the guide hole drilling outer circumference cutting and lamination stage, and the lamination table can be transported between the lamination preparation stage and the guide hole drilling outer circumference cutting and lamination stage. 1. A method for laminating a multilayer ceramic substrate, the method comprising: a conveying device capable of carrying out a multilayer ceramic substrate;