JPH0446401A - Coupling structure of integrated forming dielectric filter and method for coupling adjustment - Google Patents

Abstract

PURPOSE:To attain a desired coupling coefficient without manufacture cost increase and to easily adjust a coupling coefficient after forming a dielectric block by inserting a conductor member in a coupling hole of the dielectric block and varying the inserted length and its size or the like. CONSTITUTION:A couple of resonators 7, 7 are formed by forming an outer conductor film 5 and a short circuit conductor film 6 and a coupling hole 9 is formed between throughholes 3 of a dielectric block 2. Moreover, a copper- made conductive tape 10 being almost in U-shape is inserted into the hole 9 and both ends 10a, 10a of the tape 10 are connected to the film 6 of the block 2 by soldering or the like. Then the conductive tape 10 is placed on the block 2 so that its center part is placed on the hole 9 and it is pressed into the hole 9 by using an insert part 11b of an adjustment jig 11 while adjusting the inserted length and the size or the like to adjust the coupling. Thus, a desired coupling coefficient is obtained without manufacture cost increase and the coupling coefficient is easily adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an integrally molded dielectric filter that is used, for example, in the several 100 MHz range, and in which a desired coupling coefficient can be obtained without increasing manufacturing costs, and , relates to a bonding structure that allows the degree of bonding to be easily adjusted and a method for adjusting the bonding structure.

[Conventional technology]

For example, there is a conventional integrally molded dielectric filter having a structure shown in FIG. 6 that has the function of passing signals in a specific frequency range. This dielectric filter 1 has two through holes 3 formed in parallel in a dielectric block 2 having a rectangular parallelepiped shape, and an inner diameter m1) M4 formed on the inner peripheral surface of the through hole 3. Four sides ff12b excluding the open side end surface 2a.

And outer grooves on the bottom 20! F1) 5, and conductive II for short circuit! 16 to form a pair of resonators 7, 7. Further, a resin bottle 8 is inserted into each of the through holes 3, and the resin bottle 8 enters the axis of the resin rod 8a, and the output bottle 8b is inserted thereinto. Furthermore, there is a resonance H7 between the through holes 3 of the dielectric block 2,
A bonding hole 9 is formed to obtain a bond between 7.
This causes resonance! s7 are configured to be magnetically coupled to each other.

Further, in the L dielectric filter 1, since the coupling coefficient is determined by the size and shape of the coupling hole 9,
When the dielectric block 2 is press-molded using a metal mold, the size of the coupling holes 9 and the like are set so as to obtain a desired coupling coefficient. In other words, a large number of molds are prepared according to the size and shape of the coupling hole, thereby obtaining a coupling coefficient according to the application.

[Problem that the invention seeks to solve]

By the way, multi-MWI dielectric filters with different coupling coefficients are required to accommodate various uses.

However, in order to meet such demands in the conventional dielectric filter, it is necessary to create a large number of molds depending on the size of the coupling hole, which causes a problem in that the manufacturing cost increases accordingly.

Furthermore, in the conventional dielectric filter described above, the dielectric block is molded in a mold and then fired, so it is difficult to adjust the coupling coefficient by processing the coupling holes in the sintered dielectric block. Therefore, improvements in this respect are required.

The present invention has been made in order to solve the above-mentioned conventional problems, and it is possible to obtain a desired coupling coefficient without increasing manufacturing costs, and 1) integrally mold the dielectric block so that the coupling coefficient can be easily adjusted after molding. The purpose of this paper is to provide a coupling structure and a coupling degree adjustment method for type filters.

Means for Solving Problem c] The present inventors focused on the fact that the degree of coupling changes by inserting, for example, a conductive member into the coupling hole of a dielectric block, and determined the amount of insertion of the conductive member.

The present invention was developed based on the idea that the coupling coefficient can be flexibly controlled by changing dimensions and the like.

Therefore, the invention of item 1 of the present application forms a plurality of through holes in parallel in a dielectric block, forms an inner groove t* in each of the through holes, and also forms a part of the open end surface of the dielectric block. At least a pair of resonators are formed by forming an outer groove electrical film 1 and a short-circuiting electrically conductive film on the outer surface excluding the outer surface and the bottom surface, and forming a coupling hole between both through holes of the dielectric block. This is a coupling structure of an integrally molded dielectric filter in which the resonators are coupled together, and is characterized in that a conductive tape is inserted into the coupling hole.

Further, the invention of item 2 of the present application is a method for adjusting the degree of coupling in the integrally molded dielectric filter, wherein a conductive tape is placed over the coupling hole. KL, that tape! III.It is characterized in that the degree of bonding is adjusted by pushing it into the bonding hole while adjusting the insertion depth using the inspection jig.

[Effect]

According to the coupling structure of the integrally molded dielectric filter according to the invention of Item 1 of Zero W, since the STL tape is inserted into the coupling hole, the magnetic field and electric field coupling between the resonators are changed by this GT tape. Therefore, the desired coupling coefficient can be obtained without changing the size of the coupling hole, etc.
It is possible to provide many types of dielectric filters that can be used for various purposes.

As a result, there is no need to prepare a large number of molds corresponding to the coupling holes as in the past, and manufacturing costs can be reduced accordingly.

In addition, in the invention of item 2 of the present application, since the conductive tape is pushed into the coupling hole by an adjustment jig to adjust the coupling coefficient, for example, by changing the dimensions and shape of the adjustment jig, the conductivity can be adjusted. You can easily change the amount of tape inserted, shape, etc., and easily and reliably set the coupling coefficient to the desired value!
[Can be adjusted and bonded after firing! It can improve the alignment work.

r Example] Embodiments of the present invention will be described below with reference to the drawings.

1 to 4 are diagrams for explaining the coupling structure and coupling degree adjustment method of an integrally molded dielectric filter according to an embodiment of the present invention. In the figures, the same reference numerals as in FIG. or a corresponding portion.

The integrally molded dielectric filter 1 of this embodiment has two through holes 3 formed in parallel in a dielectric block 2, an inner thick electric film 4 formed on the inner circumferential surface of the through holes 3, and the dielectric Outer door electrical films 5. A short-circuit conductive film 6 is formed to form a pair of resonators 7.7, and a coupling hole 9 is formed between the through holes 3 of the dielectric block 2 for coupling the resonators 7.7 to each other. The basic structure is the same as the conventional one.

The coupling structure of this embodiment has approximately U in the coupling hole 9.
Insert the copper conductive tape 10 bent into a letter shape, and solder the ends 10a, 10a of this child-1) 0 to the short-circuiting conductive film 6 of the dielectric block 2 or apply a conductive adhesive. It is connected and configured by.

Next, a method for adjusting the degree of coupling according to an embodiment of the invention of Section 2 of the present application will be described.

First, the adjustment jig 1) employed in this embodiment will be explained. This adjustment jig 1) is constructed by connecting a plate-shaped insertion part 1)b extending downward to the lower surface of a support part 1)a.

This insertion part 1) length of b! .

The width W and the thickness t are set so as to obtain a target coupling coefficient.

To adjust the coupling coefficient using the adjustment jig 1), as shown in FIG.
It is pushed into the coupling hole 9 using the insertion part 1) b of the adjustment jig 1), and when the support part 1) a comes into contact with the dielectric block 2, both ends of the conductive tape 10 are inserted. Part 10a,
10a to the short-circuiting conductive film 6 (see FIG. 4), thereby connecting the conductive film 1 to the conductive film 1 corresponding to the dimensions of the insertion part 1)b.
)0 will be inserted into the coupling hole 9.

Further, in order to change the coupling coefficient, an adjusting jig having insertion portions with different dimensions may be used. Furthermore, the coupling coefficient can also be adjusted by changing the width dimension or thickness of the conductive tape 10.

According to this embodiment, since the conductive tape 10 is inserted into the coupling hole 9, the magnetic field coupling between the resonators 7 can be increased by the amount that the conductive tape 10 is inserted. A desired coupling coefficient can be obtained without changing the size of the hole 9, and a wide band can be achieved. As a result, there is no need to prepare a large number of molds as in the past, and manufacturing costs can be reduced accordingly.

Furthermore, according to the adjustment method of this embodiment, the adjustment jig 1)
Since the adjustment is made by pushing the conductive tape 10 into the bonding hole 9 using the insertion portion 1)b, the bonding can be performed simply by forming the insertion portion 1)b in advance to a size that corresponds to the target coupling coefficient. Coefficients can be easily adjusted and adjustment work after assembling parts can be improved.

Although the above embodiment has been explained using the plate-shaped insertion portion 1)b as an example, the adjustment jig of the present invention is not limited to this.For example, the adjustment jig shown in FIG. ! The jig 12 is an example in which a triangular insertion part 12b is connected to a support part 12a, and the conductive tape 10 is pushed into the coupling hole 9 by the insertion part 12b to adjust the coupling coefficient. In this case, the insertion portion of the conductive tape has a triangular shape, and a coupling coefficient different from that of the above embodiment can be obtained.

Alternatively, the conductive tape may be inserted into the bonding hole together with an adhesive and fixed to the dielectric block.

Further, the conductive tape may be inserted from either the open side end face or the short circuit side end face. In this case, the coupling coefficient increases when inserted from the short-circuited end face, and decreases when inserted from the open end face. Further, when the conductive tape is connected to the ground, the coupling coefficient becomes large, and when it is not connected, the coupling coefficient becomes small.

Further, in the above embodiments, a rectangular coupling hole is taken as an example, but the present invention can of course be applied to a coupling hole having a shape other than the above, for example, a columnar shape. Furthermore, the coupling holes do not need to penetrate through the dielectric block, and if there are two or more coupling holes, an IT tape may be inserted into at least one of them.

An electrode for frequency adjustment, etc. may be formed on the open end surface of the dielectric block, or the electrode and either or both of the open ground, the short-circuited end surface, or both of the surfaces of the dielectric block and the dielectric block may be shaved. Alternatively, it can be applied to those with adjusted coupling coefficients.

〔Effect of the invention〕

As described above, according to the coupling structure of the integrally molded dielectric filter according to the present invention, a conductive tape is inserted into the coupling hole of the dielectric block, and in the coupling degree adjustment method, the conductive tape is inserted into the adjustment jig. Since it is inserted into the coupling hole, there is an effect that a desired coupling coefficient can be obtained without increasing the manufacturing cost, and there is also an effect that the coupling coefficient can be easily adjusted.

[Brief explanation of the drawing]

1 to 4 are diagrams for explaining the coupling structure and coupling degree adjustment method of an integrally molded dielectric filter according to an embodiment of the present invention, and FIG. 1 is a diagram for explaining the coupling structure. 2 is an exploded perspective view for explaining the coupling degree adjustment method, FIG. 3 is a sectional view, FIG. 4 is a partially enlarged sectional view, and FIG. 5 is a modified example of the adjustment jig. FIG. 6 is a partially enlarged sectional view showing a conventional dielectric filter. In the figure, 1 is an integrally molded dielectric filter, 2 is a dielectric block, 2a is an open end face, 2b is the four sides of the dielectric block, 2c is a bottom face, 3 is a through hole, 4 is an inner groove electric film, 5
is an outer conductive film, 6 is a conductive film for short circuit, 7 is a resonator, 10 is a conductive tape, 10m is an end, 1). 12 is an adjustment jig. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Tsutomu Shimofu Figure 1 Figure 2” 2a

Claims (2)

[Claims] (1) At least two through holes are formed in the dielectric block in parallel, and an inner conductive film is formed in each of the through holes, and the outer surface and bottom surface of the dielectric block except for a part of the open end surface. A pair of resonators are formed by forming an outer conductive film and a short-circuiting conductive film on each of the dielectric blocks, and a coupling hole is formed between both through holes of the dielectric block to couple the resonators to each other. 1. A joint structure for a molded dielectric filter, characterized in that a conductive tape is inserted into the joint hole. (2) At least two through holes are formed in parallel in the dielectric block, and an inner conductive film is formed in each of the through holes, and the outer surface and bottom surface of the dielectric block except for a part of the open end surface. A pair of resonators are formed by forming an outer conductive film and a short-circuiting conductive film on each of the dielectric blocks, and a coupling hole is formed between both through holes of the dielectric block to couple the resonators to each other. A method for adjusting the degree of bonding of a molded dielectric filter, the degree of bonding being adjusted by placing a conductive tape over the bonding hole and pushing the tape into the bonding hole while adjusting the insertion depth using an adjustment jig. A method for adjusting the degree of coupling of an integrally molded dielectric filter.