JPH0446536U - - Google Patents
Info
- Publication number
- JPH0446536U JPH0446536U JP8991990U JP8991990U JPH0446536U JP H0446536 U JPH0446536 U JP H0446536U JP 8991990 U JP8991990 U JP 8991990U JP 8991990 U JP8991990 U JP 8991990U JP H0446536 U JPH0446536 U JP H0446536U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- aluminum electrolytic
- diameter
- spacer wires
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す構成斜視図、
第２図はスペーサ線３０の装着状態の説明図、第
３図は取付状態を説明する正面図、第４図は半田
付け工程の説明図、第５図は本考案の変形実施例
の説明図、第６図はスペーサ線３０の塗布状態の
説明図である。第７図は従来の実装手順の説明図
、第８図はハンダ不良の説明図である。
１０……アルミ電解コンデンサ、１４……リー
ド部、２０……プリント基板、２２……貫通孔、
３０……スペーサ線。
FIG. 1 is a perspective view showing an embodiment of the present invention;
Fig. 2 is an explanatory diagram of the spacer wire 30 installed, Fig. 3 is a front view illustrating the installation state, Fig. 4 is an explanatory diagram of the soldering process, and Fig. 5 is an explanatory diagram of a modified embodiment of the present invention. , FIG. 6 is an explanatory diagram of the application state of the spacer wire 30. FIG. 7 is an explanatory diagram of the conventional mounting procedure, and FIG. 8 is an explanatory diagram of solder failure. 10... Aluminum electrolytic capacitor, 14... Lead portion, 20... Printed circuit board, 22... Through hole,
30...Spacer wire.
Claims (1)
傍に、このアルミ電解コンデンサの直径の５割乃
至８割程度の間隔でこの直径とほぼ等しい長さの
スペーサ線を平行に設置し、若しくはこのアルミ
電解コンデンサの取付中心から放射状に長さがこ
の直径の５割程度のスペーサ線を少なくとも３本
以上設置し、 当該アルミ電解コンデンサをこのスペーサ線を
介在させてプリント基板に搭載し、半田付けした
ことを特徴とする電解コンデンサの実装構造。[Claim for Utility Model Registration] In the vicinity of the through hole in which the aluminum electrolytic capacitor is mounted, spacer wires with a length approximately equal to the diameter of the aluminum electrolytic capacitor are placed in parallel at intervals of approximately 50% to 80% of the diameter of the aluminum electrolytic capacitor. or install at least three spacer wires with a length of about 50% of this diameter radially from the installation center of this aluminum electrolytic capacitor, and mount the aluminum electrolytic capacitor on a printed circuit board with these spacer wires interposed. An electrolytic capacitor mounting structure characterized by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8991990U JPH0446536U (en) | 1990-08-28 | 1990-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8991990U JPH0446536U (en) | 1990-08-28 | 1990-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446536U true JPH0446536U (en) | 1992-04-21 |
Family
ID=31824244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8991990U Pending JPH0446536U (en) | 1990-08-28 | 1990-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446536U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227179A (en) * | 2007-03-13 | 2008-09-25 | Toshiba Mach Co Ltd | Printed-circuit board |
| WO2013179403A1 (en) * | 2012-05-30 | 2013-12-05 | 三洋電機株式会社 | Wiring substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH025497A (en) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | Component mounting structure |
-
1990
- 1990-08-28 JP JP8991990U patent/JPH0446536U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH025497A (en) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | Component mounting structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227179A (en) * | 2007-03-13 | 2008-09-25 | Toshiba Mach Co Ltd | Printed-circuit board |
| WO2013179403A1 (en) * | 2012-05-30 | 2013-12-05 | 三洋電機株式会社 | Wiring substrate |
| EP2688374A4 (en) * | 2012-05-30 | 2015-09-02 | Sanyo Electric Co | WIRING SUBSTRATE |
| JPWO2013179403A1 (en) * | 2012-05-30 | 2016-01-14 | パナソニックＩｐマネジメント株式会社 | Wiring board |
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