JPH0446908B2 - - Google Patents
Info
- Publication number
- JPH0446908B2 JPH0446908B2 JP58230279A JP23027983A JPH0446908B2 JP H0446908 B2 JPH0446908 B2 JP H0446908B2 JP 58230279 A JP58230279 A JP 58230279A JP 23027983 A JP23027983 A JP 23027983A JP H0446908 B2 JPH0446908 B2 JP H0446908B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- temperature
- sio
- alkali
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
- Glass Compositions (AREA)
Description
本発明は連続製板可能な電子機材基板ガラスに
適したアルミノシリケートガラスに関する。
液晶用等の基板ガラスは0.3〜1.0mmの薄板が使
用されているが、これらの厚味の板ガラスをガラ
ス溶解室から連続的に生産性よく製造するには、
コルバーン法、フルコール法、フロート法による
製板方式が採用されている。上記方式による製板
法に最も適したガラス組成は、従来から建築用、
車輌用等に用いられてきたソーダライムシリカガ
ラスであるが、この組成のガラスはアルカリ含有
量が大きいために、液晶基板等電子、電気製品部
材の基板ガラスとして用いる時には、基板ガラス
からのアルカリの溶出が性能を劣化させるという
欠点があつた。この欠点を改善するためにソーダ
ライムシリカガラス基板表面にエチルシリケート
を用いてSiO2の膜を生成させて、基板ガラスか
らのアルカリ溶出を防止する方法がとられてい
る。一方アルカリ含有量が少なく、アルカリ溶出
の少ないSiO2膜のコーテイングが不要なガラス
組成もあるが、前記3方式による製板は困難であ
り、ロールアウト法で製板した後、表面を研磨し
て基板ガラスとなすか、ロールアウト法で製板し
た後研磨した厚板ガラスを再加熱して引伸ばし、
0.3〜1mm厚のガラスを作り基板ガラスとなすか、
或いは非常に特殊な、しかも大量生産向きでない
製板法(例えば特公昭46−24909の流下法)を採
用して0.3〜1.0mm厚のガラスを作るとかしてい
る。しかしこれらの場合、SiO2膜のコーテイン
グが不要であるにしても、基板ガラスの生産性の
低さによりそのメリツトは半減する。
本発明はかかる不都合を解消してフルコール
法、コルバーン法、フロート法による大量連続生
産が可能で、かつアルカリ溶出防止コーテイング
を不要とするアルミノシリケートガラスを提供す
るものである。
本発明に係るアルミノシリケートガラスは重量
%で表示して
SiO2 50〜62%
B2O3 2〜5%
Al2O3 10.5〜18%
MgO 0.5〜7%
CaO 4〜13%
BaO 0〜7%
ZnO 3〜10%
Li2O 0〜2%
Na2O 0〜10%
K2O 0〜10%
但し、Li2O+Na2O+K2O=3.8〜11%を基本成
分として有し、TW−TL>−30℃であるものであ
る。
本発明に於ける組成限定理由は次の通りであ
る。
SiO2は本発明のガラスに於て主たるガラス形
成酸化物であるが、62%をこえるとガラスの粘度
が高くなり、溶解性が悪くなる。又、50%より少
ない場合はガラスの化学的耐久性を著しくそこな
うので50%を下限とする。好ましい範囲は54〜58
%である。
B2O3はガラスの高温粘度を下げて溶解を容易
にするが、B2O3単独で、或いはアルカリ成分と
結合してガラス素地から容易に揮発してガラスを
成形した時に脈理、フシなどの欠点を生じること
がある。B2O3の含有量が増大する程、ガラス素
地からの揮発も激しくなるので、B2O3の上限は
5%とする。B2O3が2%未満ではガラスの溶解
が困難となるので、2%を下限とする。好ましい
範囲は4〜5%である。
Al2O3はアルミノシリケートガラスの場合、ガ
ラスの安定性と化学的耐久性を良化する。18%を
こえると、ガラスの粘度が高くなり溶解性が悪く
なり、10.5%未満では化学的耐久性が悪くなる。
ガラスが安定化するためのAl2O3の好ましい範囲
は13〜15%である。MgOはガラスの化学的耐久
性を向上させ、熱膨張率を低下させるが、MgO
が7%をこえるとガラスの失透温度が上昇し、か
つ溶解性が悪くなる。
又、0.5%未満ではガラスの化学的耐久性が低
下する。好ましくは0.5〜4%である。CaOはガ
ラスの高温粘度を低下させ、ガラスの溶解を容易
にするが、CaOが13%をこえるとガラスの失透温
度が上昇し、4%未満ではガラスの溶解が困難に
なる。BaOは必須成分ではないが、BaOを5%
程度入れるとガラスの失透温度が著しく低下し、
成形を容易にする。但し7%をこえるとガラスの
化学的耐久性を悪くする。ZnOはガラスの高温粘
度を低下させ、ガラスの溶解を容易にするが、10
%をこえるとガラスの温粘曲線勾配がきつくな
り、微小温度変化で大きく粘度が変り、成形を困
難にする。又、3%未満では高温粘度の低下が十
分でなく、溶解が困難になる。好ましく範囲は5
〜7%である。Li2O,Na2O,K2Oはいずれもガ
ラスの溶解を促進するが、Li2Oは原料が高価で
あることも考え合せ、2%を上限とする。Na2O
とK2Oはそれぞれ10%をこえるとガラスの化学的
耐久性を低下させ、かつアルカリ溶出量が増える
ので各々10%を上限とする。但し、Li2O+Na2O
+K2Oが3.8%未満ではガラスの溶解が悪くなる
ので3.8%を下限とする。又、3者の合計量が11
%をこえると化学的耐久性を悪くし、アルカリ溶
出量が多くなるので、11%を上限とする。3.8〜
9%が好ましい。
以上の基本成分の他に、ガラス原料から不可避
的に混入してくる不純物、例えばTiO2,Fe2O3な
どは0.5以下含まれていても差しつかえない。又
通常の清澄剤としてSb2O3,As2O3,So3,F2,
Cl2などが各々1%以下入つても良い。更にガラ
スを着色する目的で通常使用される酸化物、例え
ばMnO2,Cr2O3,CoO,NiO,CuOなどが少量
入つていても良い。
以上各成分の限定理由について述べたが、本発
明によるアルミノシリケートガラスは、フルコー
ル法、コルバーン法、フロート法による連続製板
に適したガラスであり、そのためには失透温度
(TL)と作業温度(TW)関係がTW×TL>−30℃
が必要で、TW≧TLであることが好ましい。
次に実施例にもとづいて本発明の効果を説明す
る。第1表に示すNo.1ないしNo.12及び比較例1,
2の各目標組成のガラスを得るに必要な調合割合
のバツチを造り、白金ルツボで1450℃で溶解し、
ステンレス鋳型に流し込み、成型した後徐冷し
た。上記各種ガラスの失透温度(TL)、作業温度
(TW)及びTW−TLの値は表に示した通りであり、
本発明による実施例はいずれも耐アルカリ溶出性
に優れ、かつ温度特性としてもTW−TL>−30℃
であるのに対し、従来の代表的な耐アルカリ溶出
ガラスは比較例1,2に示されるようにTW−TL
<−30℃であり、大量連続製板には不向きな温度
特性であり、比較例3の市販のフロートガラス組
成はアルカリ溶出量が約10倍に達する。よつて本
発明のガラスが大量に連続製板されうるもので、
かつ耐アルカリ溶出性に優れたものであり、電子
機材の基板用ガラスとして優れたものであること
が明らかとなつた。
尚、以上の説明に用いた失透温度TLは次のよ
うにして求めた。
ガラスを粉砕して1680μmのフルイを通り
1190μmのフルイ上にとどまつたガラス粒を、白
金ボード上に1列にあけた1mm径の多数の穴の上
におき、ボート長さ方向に適当な温度勾配をもつ
ように温度設定された炉中で1時間保持する。炉
から取出した白金ボートを、自然放冷させた後、
顕微鏡によつて白金ボート上のガラス粒を観察
し、失透が発生している最高温度をもつて失透温
度とした。又、作業温度(TW)はガラスの粘度
が104ポイズになる温度である。
アルカリ溶出量の測定はJISR−3502に準じて
行い試料ガラス1mlを粒径250〜420μmに粉砕し、
100℃、50mlの水中でも60分煮沸して、水中に溶
出したアルカリ量を分析した値である。
The present invention relates to an aluminosilicate glass suitable for electronic equipment substrate glass that can be manufactured continuously. Thin plates of 0.3 to 1.0 mm are used for substrate glass for LCDs, etc., but in order to continuously and efficiently manufacture these thick plate glasses from a glass melting chamber, it is necessary to
The plate manufacturing methods used are the Colburn method, the Fourcor method, and the float method. The glass composition most suitable for plate manufacturing using the above method has traditionally been used for architectural,
Soda-lime silica glass has been used for vehicles, etc., but since glass with this composition has a high alkali content, when used as substrate glass for electronic and electrical product parts such as liquid crystal substrates, it is difficult to remove alkali from the substrate glass. The drawback was that elution deteriorated performance. In order to improve this drawback, a method has been adopted in which ethyl silicate is used on the surface of a soda lime silica glass substrate to form a SiO 2 film to prevent alkali elution from the substrate glass. On the other hand, there are glass compositions that have a low alkali content and do not require coating with SiO 2 film, which has low alkali elution, but it is difficult to make plates using the three methods mentioned above, and after making plates using the roll-out method, the surface must be polished. The substrate glass is made using the roll-out method, then polished and then reheated and stretched.
Make 0.3-1mm thick glass and use it as substrate glass,
Alternatively, glass with a thickness of 0.3 to 1.0 mm is made using a very special plate-making method that is not suitable for mass production (for example, the flow-down method of Japanese Patent Publication No. 46-24909). However, in these cases, even if SiO 2 film coating is not necessary, the benefits are halved due to the low productivity of the substrate glass. The present invention solves these disadvantages and provides an aluminosilicate glass that can be produced continuously in large quantities by the Fourcor method, the Colburn method, or the float method, and does not require a coating to prevent alkali elution. The aluminosilicate glass according to the present invention is expressed in weight percent: SiO 2 50-62% B 2 O 3 2-5% Al 2 O 3 10.5-18% MgO 0.5-7% CaO 4-13% BaO 0-7 % ZnO 3-10% Li 2 O 0-2% Na 2 O 0-10% K 2 O 0-10% However, Li 2 O + Na 2 O + K 2 O = 3.8-11% as the basic component, T W −T L >−30°C. The reasons for limiting the composition in the present invention are as follows. SiO 2 is the main glass-forming oxide in the glass of the present invention, but if it exceeds 62%, the viscosity of the glass increases and its solubility deteriorates. Moreover, if it is less than 50%, the chemical durability of the glass will be significantly impaired, so 50% is set as the lower limit. Preferred range is 54-58
%. B 2 O 3 lowers the high-temperature viscosity of glass and makes it easier to melt, but B 2 O 3 alone or in combination with an alkali component easily volatilizes from the glass base, causing striae and stent formation when glass is formed. This may result in disadvantages such as: As the content of B 2 O 3 increases, the volatilization from the glass substrate becomes more intense, so the upper limit of B 2 O 3 is set at 5%. If B 2 O 3 is less than 2%, it will be difficult to melt the glass, so 2% is the lower limit. The preferred range is 4-5%. In the case of aluminosilicate glass, Al 2 O 3 improves the stability and chemical durability of the glass. If it exceeds 18%, the viscosity of the glass will increase and its solubility will deteriorate, and if it is less than 10.5%, its chemical durability will deteriorate.
The preferred range of Al2O3 for glass stabilization is 13-15%. MgO improves the chemical durability of glass and reduces the coefficient of thermal expansion, but MgO
If it exceeds 7%, the devitrification temperature of the glass increases and the solubility deteriorates. Moreover, if it is less than 0.5%, the chemical durability of the glass will decrease. Preferably it is 0.5-4%. CaO lowers the high-temperature viscosity of glass and makes it easier to melt the glass, but when CaO exceeds 13%, the devitrification temperature of the glass increases, and when it is less than 4%, it becomes difficult to melt the glass. BaO is not an essential ingredient, but 5% BaO
When added to a certain degree, the devitrification temperature of the glass decreases significantly,
Makes molding easier. However, if it exceeds 7%, the chemical durability of the glass will deteriorate. ZnO reduces the high-temperature viscosity of glass and facilitates glass melting, but 10
%, the slope of the temperature-viscosity curve of the glass becomes steeper, and the viscosity changes significantly with minute temperature changes, making molding difficult. Moreover, if it is less than 3%, the high temperature viscosity will not be lowered sufficiently and dissolution will become difficult. Preferably the range is 5
~7%. Li 2 O, Na 2 O, and K 2 O all promote glass melting, but considering that Li 2 O is an expensive raw material, the upper limit is set at 2%. Na2O
If the content of K and K 2 O exceeds 10%, the chemical durability of the glass will decrease and the amount of alkali elution will increase, so the upper limit for each is set at 10%. However, Li 2 O + Na 2 O
If +K 2 O is less than 3.8%, the melting of the glass will deteriorate, so 3.8% is set as the lower limit. Also, the total amount of the three parties is 11
If it exceeds 11%, the chemical durability will deteriorate and the amount of alkali elution will increase, so the upper limit is set at 11%. 3.8~
9% is preferred. In addition to the above-mentioned basic components, impurities inevitably mixed in from the glass raw materials, such as TiO 2 and Fe 2 O 3 , may be contained in a content of 0.5 or less. In addition, Sb 2 O 3 , As 2 O 3 , So 3 , F 2 ,
Cl 2 or the like may be contained in an amount of 1% or less. Furthermore, a small amount of oxides commonly used for coloring glass, such as MnO 2 , Cr 2 O 3 , CoO, NiO, CuO, etc., may be included. The reasons for limiting each component have been described above, but the aluminosilicate glass according to the present invention is a glass suitable for continuous sheet manufacturing using the Fourcor method, the Colburn method, and the float method. Temperature (T W ) relationship is T W ×T L >−30℃
is required, and it is preferable that T W ≧ T L . Next, the effects of the present invention will be explained based on Examples. No. 1 to No. 12 shown in Table 1 and Comparative Example 1,
Make batches with the proportions necessary to obtain glasses with each of the target compositions in 2, melt them in a platinum crucible at 1450℃,
It was poured into a stainless steel mold, molded, and then slowly cooled. The values of devitrification temperature (T L ), working temperature (T W ), and T W - T L of the various glasses mentioned above are as shown in the table.
All of the examples according to the present invention have excellent alkali elution resistance and also have temperature characteristics of T W −T L >−30°C.
On the other hand, as shown in Comparative Examples 1 and 2, the conventional typical alkali elution-resistant glass has T W −T L
<-30° C., which is a temperature characteristic unsuitable for large-scale continuous plate manufacturing, and the commercially available float glass composition of Comparative Example 3 has an alkali elution amount reaching about 10 times. Therefore, the glass of the present invention can be manufactured continuously in large quantities,
It has also been found to be excellent in alkali elution resistance, making it an excellent glass for substrates of electronic equipment. The devitrification temperature T L used in the above explanation was determined as follows. Crush the glass and pass it through a 1680 μm sieve.
The glass particles held on a 1190 μm sieve were placed over a number of 1 mm diameter holes drilled in a row on a platinum board, and placed in a furnace whose temperature was set to have an appropriate temperature gradient in the length direction of the boat. Hold for 1 hour. After taking the platinum boat out of the furnace and letting it cool naturally,
The glass grains on the platinum boat were observed using a microscope, and the highest temperature at which devitrification occurred was defined as the devitrification temperature. Further, the working temperature (T W ) is the temperature at which the viscosity of the glass becomes 10 4 poise. The amount of alkali elution was measured according to JISR-3502, and 1 ml of sample glass was crushed to a particle size of 250 to 420 μm.
This is the value obtained by analyzing the amount of alkali dissolved in water after boiling it in 50 ml of water at 100°C for 60 minutes.
【表】【table】
【表】【table】
Claims (1)
%、MgO0.5〜7%、CaO4〜13%、BaO0〜7
%、ZnO3〜10%、Li2O0〜2%、Na2O0〜10%、
K2O0〜10%、Li2O+Na2O+K2O=3.8〜11% の基本的成分を有し、TW−TL>−30℃(但し、
TWは作業温度を、TLは失透温度を示す。)であ
ることを特徴とするアルミノシリケートガラス。 2 重量%で表示して SiO254〜58%、B2O34〜5%、Al2O313〜15
%、MgO0.5〜4%、CaO7〜11%、BaO0〜5
%、ZnO5〜7%、Li2O0〜1%、Na2O3〜9%、
K2O0〜3%、およびLi2O+Na2O+K2O3.8〜9
%の基本的成分を有する特許請求の範囲第1項に
記載のアルミノシリケートガラス。[Claims] 1. SiO 2 50 to 62%, B 2 O 3 2 to 5%, Al 2 O 3 10.5 to 18% by weight.
%, MgO0.5~7%, CaO4~13%, BaO0~7
%, ZnO3~10%, Li2O0 ~2%, Na2O0 ~10%,
It has basic components of K 2 O 0 to 10%, Li 2 O + Na 2 O + K 2 O = 3.8 to 11%, and T W −T L > −30°C (however,
T W indicates the working temperature, and T L indicates the devitrification temperature. ) Aluminosilicate glass. 2 Expressed in weight%: SiO 2 54-58%, B 2 O 3 4-5%, Al 2 O 3 13-15
%, MgO0.5-4%, CaO7-11%, BaO0-5
%, ZnO5~7%, Li2O0 ~1%, Na2O3 ~9%,
K2O0 ~3%, and Li2O + Na2O + K2O3.8 ~9
Aluminosilicate glass according to claim 1 having a basic composition of %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23027983A JPS60122748A (en) | 1983-12-06 | 1983-12-06 | Aluminosilicate glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23027983A JPS60122748A (en) | 1983-12-06 | 1983-12-06 | Aluminosilicate glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60122748A JPS60122748A (en) | 1985-07-01 |
| JPH0446908B2 true JPH0446908B2 (en) | 1992-07-31 |
Family
ID=16905310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23027983A Granted JPS60122748A (en) | 1983-12-06 | 1983-12-06 | Aluminosilicate glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60122748A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62128944A (en) * | 1985-11-27 | 1987-06-11 | Sharp Corp | optical memory element |
| FR2678604B1 (en) * | 1991-07-02 | 1993-11-12 | Saint Gobain Vitrage Internal | GLASS COMPOSITION FOUND APPLICATION IN THE FIELD OF ELECTRONICS. |
| US5578103A (en) * | 1994-08-17 | 1996-11-26 | Corning Incorporated | Alkali metal ion migration control |
| JP3831957B2 (en) * | 1994-09-14 | 2006-10-11 | 旭硝子株式会社 | Glass composition and substrate for plasma display |
| JP2001172042A (en) | 1999-10-08 | 2001-06-26 | Ohara Inc | Transparent glass and method of producing the same |
| JP2011141568A (en) * | 2005-10-03 | 2011-07-21 | Nippon Electric Glass Co Ltd | Protective plate for portable apparatus display device |
| JP4793756B2 (en) * | 2005-10-03 | 2011-10-12 | 日本電気硝子株式会社 | Protection plate for portable device display device |
| WO2008050500A1 (en) * | 2006-09-29 | 2008-05-02 | Nippon Electric Glass Co., Ltd. | Protective plate for portable equipment display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS496012A (en) * | 1972-05-10 | 1974-01-19 | ||
| JPS6042247A (en) * | 1983-08-16 | 1985-03-06 | Asahi Glass Co Ltd | Low expansion glass |
-
1983
- 1983-12-06 JP JP23027983A patent/JPS60122748A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60122748A (en) | 1985-07-01 |
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