JPH0447255A - Inspecting apparatus for minute connection of electronic component - Google Patents
Inspecting apparatus for minute connection of electronic componentInfo
- Publication number
- JPH0447255A JPH0447255A JP15522190A JP15522190A JPH0447255A JP H0447255 A JPH0447255 A JP H0447255A JP 15522190 A JP15522190 A JP 15522190A JP 15522190 A JP15522190 A JP 15522190A JP H0447255 A JPH0447255 A JP H0447255A
- Authority
- JP
- Japan
- Prior art keywords
- light beam
- circuit board
- electronic component
- electronic components
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は回路基板に電子部品を搭載した電子装置におけ
る微細接続検査装置並びにその検査機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a micro-connection inspection device and inspection mechanism for an electronic device in which electronic components are mounted on a circuit board.
従来の装置は、電子部品の側面に回路基板との接続部が
形成されるものについて接続不良を検出するものであり
、−例としては特開昭６２−７２００公報に記載のよう
に、フラットリード形の電子部品を回路基板に搭載した
場合にリードがポンディングパッドから浮いた接続不良
を、レーザ光をリードに照射させることにより検出する
ものがあげられる。Conventional devices detect connection failures in electronic components in which the connection portion with the circuit board is formed on the side surface of the electronic component. One example is a device that detects a connection failure in which a lead is lifted off a bonding pad when a shaped electronic component is mounted on a circuit board by irradiating the lead with a laser beam.
半導体技術の向上に伴い電子部品の人出ピン数が増大し
、フェースダウンボンディング方式の一つであるフリッ
プチップボンディングの電子部品や、ピングリッドアレ
イの電子部品が使用される頻度が高まってきた。As semiconductor technology has improved, the number of pins on electronic components has increased, and electronic components using flip-chip bonding, which is one of the face-down bonding methods, and electronic components using pin grid arrays are being used more frequently.
しかし上記従来技術は、フリップチップボンディングの
電子部品やピングリッドアレイの電子部品のように回路
基板との接続部が電子部品に隠れル場合、検査できない
という問題があった。However, the above-mentioned conventional technology has a problem in that it cannot be inspected when the connection portion to the circuit board is hidden behind the electronic component, such as in flip-chip bonding electronic components or pin grid array electronic components.
本発明の目的は、電子部品と回路基板との接続部が電子
部品に隠れる場合に接続部を検査することを可能とする
にある。An object of the present invention is to make it possible to inspect a connection between an electronic component and a circuit board when the connection is hidden behind the electronic component.
上記目的を達成するために、回路基板上に電子部品が搭
載されている側から光ビームを入射させ、反射鏡、ハー
フミラ−等により光ビームの伝搬経路を変えて、検査さ
れる電子部品と回路基板との微細接続部に光ビームを回
路基板と平行に入射させる機構を有し、光ビームの微細
接続部への入射側の映像及び微細接続部から透過側の映
像を検出するようにしたものである。In order to achieve the above objective, a light beam is incident on the circuit board from the side where electronic components are mounted, and the propagation path of the light beam is changed using a reflector, half mirror, etc., and the electronic components and circuits to be inspected are It has a mechanism that makes the light beam enter the micro-connection part with the circuit board parallel to the circuit board, and it detects the image of the side where the light beam enters the micro-connection part and the image of the side of the light beam transmitted from the micro-connection part. It is.
回路基板上の電子部品が搭載されている側から光ビーム
が入射し、反射鏡、ハーフミラ−によって前記光ビーム
の伝搬方向を変えて前記回路基板と前記電子部品との接
続部に前記光ビームが前記回路基板と平行に入射する。A light beam enters from the side on which electronic components are mounted on the circuit board, and the propagation direction of the light beam is changed by a reflecting mirror or a half mirror so that the light beam reaches the connection between the circuit board and the electronic component. The light is incident parallel to the circuit board.
前記光ビームが前記接続部によって反射された反射光は
前記伝搬経路を逆行して前記ハーフミラ−までもどり、
更に前記反射光がハーフミラ−を透過して伝搬する経路
上にテレビカメラまたは受光素子を配置することによっ
て前記反射光の映像を検出することができる。また一方
前記光ビームが前記接続部間を透過した透過光は別の反
射鏡によって前記透過光の伝搬方向を変えて、前記透過
光の伝搬経路上に配置されたテレビカメラまたは受光素
子を配置することによって、前記透過光の映像も検出す
ることができる。The reflected light from the light beam reflected by the connecting portion travels backward along the propagation path and returns to the half mirror;
Further, by placing a television camera or a light receiving element on the path through which the reflected light propagates through the half mirror, an image of the reflected light can be detected. On the other hand, the transmitted light of the light beam transmitted between the connecting parts changes the propagation direction of the transmitted light by another reflecting mirror, and a television camera or a light receiving element is arranged on the propagation path of the transmitted light. Accordingly, an image of the transmitted light can also be detected.
以下、本発明の一実施例を第１図により説明する。第１
図は本発明実施例である伝搬経路の微細検査装置のケー
ス５が検査されるべき電子部品６にセットされた状況を
示す縦断面図である。光ファイバー１によってケース５
内に光ビームが入射され、更に第１のテレビカメラ２ａ
、ハーフミラ−４，第２のテレビカメラ２ｂにより前記
電子部品６と回路基板８との接続部７に入射される。前
記光ビームが前記接続部７によって反射された反射光は
前記第２の反射鏡３ｂから前記ハーフミラ−４まで逆行
し、更に前記ハーフミラ−４を透過して第１のテレビカ
メラ２ａに入射することによって前記接続部７からの反
射光を検出することができる。一方、前記第２の反射鏡
３ｂによって前記回路基板８と平行に入射した光ビーム
が前記接続部７間を透過した透過光は第３の反射鏡３Ｃ
により反射され第２のテレビカメラ２ｂに入射すること
によって前記接続部７間を透過した透過光をも検出する
ことができる。An embodiment of the present invention will be described below with reference to FIG. 1st
The figure is a longitudinal cross-sectional view showing a case 5 of a propagation path microinspection apparatus according to an embodiment of the present invention set on an electronic component 6 to be inspected. Case 5 by optical fiber 1
A light beam is incident into the first television camera 2a.
, the half mirror 4, and the second television camera 2b enter the connection portion 7 between the electronic component 6 and the circuit board 8. The reflected light from the light beam reflected by the connecting portion 7 travels backward from the second reflecting mirror 3b to the half mirror 4, further transmits through the half mirror 4, and enters the first television camera 2a. The reflected light from the connecting portion 7 can be detected. On the other hand, the light beam incident parallel to the circuit board 8 by the second reflecting mirror 3b is transmitted between the connecting parts 7, and the transmitted light is transmitted to the third reflecting mirror 3C.
It is also possible to detect the transmitted light that is reflected by and incident on the second television camera 2b and transmitted between the connecting portions 7.
本発明によれば、電子部品と回路基板との接続部が電子
部品によって隠れていても前記接続部の映像を検出でき
るので前記接続部の欠陥を検出する効果がある。According to the present invention, even if the connecting portion between an electronic component and a circuit board is hidden by the electronic component, an image of the connecting portion can be detected, so that a defect in the connecting portion can be detected.
第１図は本発明の一実施例として電子部品の微細接続部
検査装置の縦断面図である。
ｌ・・・光ファイバ、２ａ、２ｂ・・・第１、第２のテ
レビカメラ、３ａ、３ｂ、３ｃｍ第１、第２、第３の反
射鏡、４・・・ハーフミラ−９５・・・ケース、６・・
・電子部品、７・・・接続部、８・・・回路基板。FIG. 1 is a longitudinal sectional view of an apparatus for inspecting minute connections of electronic components as an embodiment of the present invention. 1... Optical fiber, 2a, 2b... 1st, 2nd television camera, 3a, 3b, 3cm 1st, 2nd, 3rd reflecting mirror, 4... Half mirror 95... Case , 6...
・Electronic components, 7...Connection parts, 8...Circuit boards.
Claims (1)
後、前記回路基板と前記電子部品との機械的接続及び電
気的接続をなす金属リードまたはハンダで構成される微
細接続部を検査する装置において、前記回路基板上に前
記電子部品が搭載されている側より検査されるべき前記
電子部品に向けて垂直に投影される光ビームを反射鏡、
ハーフミラー等により伝搬経路を変え、検査されるべき
前記電子部品と前記回路基板との前記複数の微細接続部
に前記光ビームを前記回路基板と平行に入射させる機構
を有し、また前記光ビームの入射部の映像及び前光ビー
ムの透過部の映像を検出する機構を設けたことを特徴と
する電子部品の微細接続検査装置。1. A device that inspects minute connections made of metal leads or solder that make mechanical and electrical connections between the circuit board and the electronic components after mounting one or more electronic components on the circuit board. a mirror that reflects a light beam vertically projected toward the electronic component to be inspected from the side on which the electronic component is mounted on the circuit board;
The light beam has a mechanism that changes the propagation path using a half mirror or the like and causes the light beam to be incident on the plurality of microscopic connections between the electronic component to be inspected and the circuit board in parallel with the circuit board, and the light beam 1. A micro-connection inspection device for electronic components, comprising a mechanism for detecting an image of an incident part of the front light beam and an image of a transmitted part of the front light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15522190A JPH0447255A (en) | 1990-06-15 | 1990-06-15 | Inspecting apparatus for minute connection of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15522190A JPH0447255A (en) | 1990-06-15 | 1990-06-15 | Inspecting apparatus for minute connection of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0447255A true JPH0447255A (en) | 1992-02-17 |
Family
ID=15601173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15522190A Pending JPH0447255A (en) | 1990-06-15 | 1990-06-15 | Inspecting apparatus for minute connection of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447255A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6580501B2 (en) | 1998-10-19 | 2003-06-17 | Ersa Gmbh | Apparatus and method for the visual inspection in particular of concealed soldered joints |
| DE10244054A1 (en) * | 2002-09-21 | 2003-10-09 | Eads Deutschland Gmbh | Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture. |
| GB2519991A (en) * | 2013-11-04 | 2015-05-13 | Dave Hall Entpr Ltd | Apparatus and method |
-
1990
- 1990-06-15 JP JP15522190A patent/JPH0447255A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6580501B2 (en) | 1998-10-19 | 2003-06-17 | Ersa Gmbh | Apparatus and method for the visual inspection in particular of concealed soldered joints |
| DE19847913B4 (en) * | 1998-10-19 | 2005-09-22 | Ersa Gmbh | Apparatus and method for optical inspection, in particular concealed solder joints |
| EP1123525B2 (en) † | 1998-10-19 | 2007-02-14 | Ersa GmbH | Device and method for the optical inspection of concealed soldered connections |
| DE10244054A1 (en) * | 2002-09-21 | 2003-10-09 | Eads Deutschland Gmbh | Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture. |
| GB2519991A (en) * | 2013-11-04 | 2015-05-13 | Dave Hall Entpr Ltd | Apparatus and method |
| GB2519991B (en) * | 2013-11-04 | 2016-10-12 | Dave Hall Entpr Ltd | Optical inspection of soldered components |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0162683B1 (en) | A method for observing an object in a small gap and an apparatus for the same | |
| US6686993B1 (en) | Probe card for testing optical micro electromechanical system devices at wafer level | |
| JPH0656920B2 (en) | Board assembly method, board inspection method and device | |
| JPS6229737B2 (en) | ||
| JP2897754B2 (en) | Inspection method for semiconductor device | |
| JP2001155160A (en) | Appearance inspection equipment for electronic components | |
| JPH0447255A (en) | Inspecting apparatus for minute connection of electronic component | |
| US6765185B2 (en) | Computer vision recognition of metallic objects against a poorly contrasting background | |
| JP2730526B2 (en) | BGA joint inspection apparatus and method | |
| JPH10153413A (en) | Appearance and dimension inspection device for ic lead | |
| US6177989B1 (en) | Laser induced current for semiconductor defect detection | |
| JPS59192902A (en) | Position checking device for parts attached to substrate | |
| TWI866724B (en) | Method and device of inspecting surface of interconnect structure | |
| KR100609603B1 (en) | Printed Circuit Board Inspection System with Integrated X-ray and Visual Inspection | |
| JP3366211B2 (en) | Mirror object imaging method | |
| JPS59137803A (en) | Device for detecting position of component part attached to substrate | |
| KR19980073992A (en) | PCB board inspection device and inspection method | |
| JP3341382B2 (en) | Apparatus for visual inspection of semiconductor devices | |
| JPH03215704A (en) | Bump inspection device | |
| JPH05288687A (en) | Lead inspection equipment | |
| JP3107070B2 (en) | Inspection device and inspection method | |
| JPH0631736Y2 (en) | Printed circuit board | |
| JPH04103145A (en) | Parts inspection equipment | |
| JPH03211404A (en) | Bend inspection device for connector pin | |
| JPH01265143A (en) | Inspection device for solder state |