JPH044782U

JPH044782U -

Info

Publication number: JPH044782U
Application number: JP4477190U
Authority: JP
Priority date: 1990-04-26
Filing date: 1990-04-26
Publication date: 1992-01-16

Description

[Brief explanation of the drawing]

第１図は本考案のリフローはんだ付用基板キヤ
リアの一実施例の縦断側側面図、第２図は第１図
のふたを外した状態の上面図、第３図は第１図の
ふたの上面図、第４図は本考案のリフローはんだ
付用基板キヤリアの他の実施例の縦断側面図であ
る。１，１ａ……基板、２，２ａ……キヤリア、３
……熱容量の大きい部品、４……熱容量の小さい
部品、５，５ａ，５ｂ……赤外線透過量を大きく
したフイルタ、６，６ａ，６ｂ……赤外線透過量
を小さくしたフイルタ、７，７ａ……ふた。 Figure 1 is a vertical side view of an embodiment of the reflow soldering board carrier of the present invention, Figure 2 is a top view of the lid shown in Figure 1 with the lid removed, and Figure 3 is the lid of Figure 1 removed. The top view and FIG. 4 are longitudinal sectional side views of another embodiment of the reflow soldering board carrier of the present invention. 1, 1a... Board, 2, 2a... Carrier, 3
...Parts with large heat capacity, 4...Parts with small heat capacity, 5, 5a, 5b... Filter with large amount of infrared transmission, 6, 6a, 6b... Filter with small amount of infrared transmission, 7, 7a... lid.

Claims

[Scope of utility model registration request]

In a reflow soldering board carrier for mounting a board on which parts are reflow soldered in an infrared reflow oven, infrared rays are applied to the carrier, which hits parts with a large heat capacity more than parts with a small heat capacity. A lid is provided with a filter that transmits a large amount of infrared rays so that the amount of infrared rays transmitted is large, and parts with a small heat capacity are equipped with a filter that transmits a small amount of infrared rays so that the amount of infrared rays that hits them is smaller than components with a large heat capacity. A board carrier for reflow soldering characterized by being provided with a lid.