JPH0447861U - - Google Patents

Info

Publication number
JPH0447861U
JPH0447861U JP9172790U JP9172790U JPH0447861U JP H0447861 U JPH0447861 U JP H0447861U JP 9172790 U JP9172790 U JP 9172790U JP 9172790 U JP9172790 U JP 9172790U JP H0447861 U JPH0447861 U JP H0447861U
Authority
JP
Japan
Prior art keywords
soldering
printed circuit
solder
circuit board
pairs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9172790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9172790U priority Critical patent/JPH0447861U/ja
Publication of JPH0447861U publication Critical patent/JPH0447861U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係るプリント基板の水平デイ
ツプ型半田付装置の縦断面図、第２図及び第３図
はそれぞれ従来例１及び従来例２の第１図相当図
である。 １……半田貯溜槽、２……熔融半田、３……プ
リント基板、４，４ａ，４ｂ……搬送ローラ対、
５……圧送路、６……半田付浴槽、１０……大気
放出部。 FIG. 1 is a longitudinal sectional view of a horizontal dip type soldering apparatus for printed circuit boards according to the present invention, and FIGS. 2 and 3 are views corresponding to FIG. 1 of conventional example 1 and conventional example 2, respectively. 1...Solder reservoir, 2...Melted solder, 3...Printed circuit board, 4, 4a, 4b...Transport roller pair,
5... Pressure feed path, 6... Soldering bathtub, 10... Atmospheric discharge section.

Claims (1)

【実用新案登録請求の範囲】 溶融した半田を貯溜する半田貯溜槽と、半田貯
溜槽の上方に配置され、プリント基板を水平搬送
する複数の搬送ローラ対と、前後の搬送ローラ対
とこのローラ対間に配設された熔融半田を圧送す
る圧送路とで形成される半田付浴槽とを具備して
成り、少なくとも２つの半田付浴槽を前後に連設
して構成したプリント基板の水平デイツプ型半田
付装置において、 ２つの半田付浴槽を前後に離間配置してその間
に大気放出部を形成し、前段の半田付浴槽内で水
平搬送されるプリント基板の下面に生成されるフ
ラツクス蒸気等を大気放出するように構成したこ
とを特徴とするプリント基板の水平デイツプ型半
田付装置。[Claim for Utility Model Registration] A solder reservoir for storing molten solder, a plurality of pairs of conveyor rollers disposed above the solder reservoir for horizontally conveying a printed circuit board, pairs of front and rear conveyor rollers, and this pair of rollers. A horizontal dip-type solder for a printed circuit board, comprising a soldering bath formed by a pressure feeding path for feeding molten solder disposed between them, and at least two soldering baths arranged in series in front and back In the soldering device, two soldering baths are spaced apart from each other to form an atmospheric release section between them, and flux vapor, etc. generated on the lower surface of a printed circuit board that is horizontally conveyed in the previous soldering bath is released into the atmosphere. 1. A horizontal dip type soldering device for printed circuit boards, characterized in that it is configured to do so.
JP9172790U 1990-08-31 1990-08-31 Pending JPH0447861U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9172790U JPH0447861U (en) 1990-08-31 1990-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9172790U JPH0447861U (en) 1990-08-31 1990-08-31

Publications (1)

Publication Number Publication Date
JPH0447861U true JPH0447861U (en) 1992-04-23

Family

ID=31827611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9172790U Pending JPH0447861U (en) 1990-08-31 1990-08-31

Country Status (1)

Country Link
JP (1) JPH0447861U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159264A (en) * 1983-02-28 1984-09-08 Sharp Corp Soldering device
JPH01228667A (en) * 1988-03-10 1989-09-12 Matsushita Electric Ind Co Ltd Soldering device
JPH025021A (en) * 1988-06-24 1990-01-09 Toshiba Corp Liquid crystal display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159264A (en) * 1983-02-28 1984-09-08 Sharp Corp Soldering device
JPH01228667A (en) * 1988-03-10 1989-09-12 Matsushita Electric Ind Co Ltd Soldering device
JPH025021A (en) * 1988-06-24 1990-01-09 Toshiba Corp Liquid crystal display device

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