JPH0447972Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a rectifying device for rectifying the output of an alternating current generator in a vehicle such as a motorcycle.

[Conventional technology]

A conventional three-phase full-wave rectifier mounted on a motorcycle has an Al heat dissipation board 1, as shown in FIG.
It consists of an insulating layer 2 made of epoxy resin, a band-shaped metal piece 3 made of Ni-coated Cu material, a rectifying element 4, and a sealing material 5 made of epoxy resin. The rectifying element 4 has a silicon diode chip 6 fixed to the band-shaped metal piece 3 with solder (not shown), a lead wire 7 made of a Ni-coated Cu material fixed to the silicon diode chip 6 with solder (not shown), It is constructed by covering a portion of the silicon diode chip 6 with a protective resin 8 made of silicon rubber. Two rectifying elements 4 having different polarities are fixed to one strip-shaped metal piece 3 to form a rectifier 9. Although not shown, three rectifiers 9 are arranged in parallel. 7a is a connecting piece made of Ni-coated Cu material, which connects the lead wires 7 so as to bridge the parallel rectifying fluids 9 to form a three-phase full-wave rectifying circuit.

When assembling this three-phase full-wave rectifier, the 18th
As shown in the figure, uncured sticky epoxy resin 2a
is coated on the heat dissipation board 1, and this epoxy resin 2
A belt-shaped metal piece 3 of a separately prepared fluid regulator 9 is lightly pressed onto a and heated to harden the epoxy resin 2a. The insulating layer 2 formed by curing the epoxy resin 2a not only bonds the rectifying fluid 9 and the heat dissipating substrate 11, but also electrically insulates them.

[Problems to be solved by the invention] By the way, if the insulating layer 2 formed by the method described above is made too thin, the insulation properties will be reduced due to the effects of air bubbles remaining in the insulating layer 2. For this reason, the insulating layer 2 is actually formed to a thickness of about 300 μm, and it is difficult to make it thinner than this because the insulation properties will be impaired.

As a result, the thermal resistance of the insulating layer 2 becomes considerably large in the path through which the heat generated by the silicon diode chip 6 is transmitted to the heat dissipation substrate 1. The heat dissipation efficiency from the heat dissipation board 1 to the atmosphere is reduced due to the large thermal resistance of the insulating layer 2.
This is compensated for by using a large heat dissipation board 1 to provide the desired heat dissipation ability. That is, the heat dissipation board 1 is made of a fairly large aluminum die-cast product, and the heat dissipation surface area of the heat dissipation board 1 is increased by forming heat dissipation fins without using an external heat dissipation body, and the heat dissipation surface area of the heat dissipation board 1 is increased, and the heat dissipation surface area is increased from the heat dissipation fins to the atmosphere. dissipates heat. Therefore, it is not possible to satisfactorily meet the demands for smaller size and lighter weight of the full-wave rectifier.

In addition, as shown in FIG. 19, in order to reduce the size and weight, a thin plate-shaped heat dissipation board 1a is used, and this heat dissipation board 1a is attached to the existing metal component 10 of the motorcycle. A conceivable configuration is to use it as an external heat sink of a full-wave rectifier. However, as mentioned above, since the thermal resistance between the rectifying element 6 and the heat dissipation board 1a is large, the component 10 of the motorcycle needs to have a considerably large heat dissipation capacity. Therefore, the component parts 1b to which the rectifier can be attached in the motorcycle are limited to only a few (for example, the main frame), and the degree of freedom in design is low, making it difficult to put the rectifier into practical use.

There is also a demand for smaller size, lower cost, and improved reliability of rectifiers that combine diodes and thyristors.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a rectifier for a vehicle that has excellent heat dissipation properties and can be made smaller, lower in cost, and improved in reliability.

[Means for Solving the Problems] The present invention for achieving the above object will be described with reference to the reference numerals in the drawings showing the embodiments.
2, a plurality of strip-shaped thin metal layers 14b provided on the metal plate 12 via the insulating layer 13 and arranged in parallel with each other, and the plurality of strip-shaped thin metal layers 14b.
A plurality of band-shaped metal pieces 17 fixed by solder to
a plurality of first diode chips 21 each fixed on the plurality of strip-shaped metal pieces 17; and a plurality of first diode chips 21 fixed on each of the plurality of strip-shaped metal pieces 17 and having a polarity opposite to that of the first diode chips 21. A plurality of second diode chips 22 each have are fixed onto the plurality of strip metal pieces 17 so as to have the same polarity as the first diode chips 21, and the second diode chips 22 have the same polarity as the first diode chips 21. The chip is connected to a plurality of adjacent thyristor chips 27, the first diode chip 21, the second diode chip 22, and the thyristor chip 27, respectively, and is perpendicular to the main surface of the strip metal piece 17. A plurality of first, second, and third lead wires 23, 24, each extending upwardly.
28, electrically connected to the gate electrode of the thyristor chip 27, and arranged in a region closer to the second diode chip 22 and the thyristor chip 27 than the first diode chip 21 in plan view. The thyristor control circuit board 31 and the first connection piece 32 interconnecting the plurality of first lead wires 23 and the plurality of second and third lead wires 24 and 28 are connected to each other. A second connecting piece 33 is connected, one end is connected to the first connecting piece 32, and the other end is connected to the circuit board 31.
A first connection line 39 is connected to the circuit board 31 and is connected to the circuit board 31 at one end and connected to the second connection piece 33 and arranged to cross over the second connection piece 33 . a second connection line 40 connected;
A plurality of AC input lines 34, 35, 36 connected to the plurality of strip-shaped metal pieces 17, respectively, and a plurality of DC output lines 37, 38 connected to the first and second connection pieces 32, 33, respectively. , the rectifier for a vehicle includes the first and second diode chips 21 and 22 and a sealing resin 42 provided so as to surround the thyristor chip 27.

[Function] In the present invention, the heat dissipation board is configured with a three-layer structure of the metal plate 12, the insulating layer 13, and the metal thin layer 14b. First and second diode chips 2
1, 22 and the thyristor chip 27 are the thin metal layer 1.
It is not fixed directly to the metal strip 4b, but is fixed on the band-shaped metal piece 17. The strip-shaped metal piece 17 has a function as a support plate for the first and second diode chips 21 and 22 and the thyristor chip 27, as well as a common AC terminal member. First connection piece 3
2 has a function as a direct current output terminal in addition to the function of interconnecting the first lead wires 23. The second connection piece 33 connects the second and third wires 24 and 28
In addition to the function of interconnection, it also functions as a DC output terminal.

〔Example〕

Next, a three-phase full-wave rectifier for a motorcycle according to an embodiment of the present invention will be explained along with its assembly process with reference to FIGS. 1 to 16.

First, a large-area heat dissipation substrate 11 shown in FIG. 4 is manufactured. As shown in FIG. 5, the cross-sectional structure of the heat dissipation board 11 has a three-layer structure including a heat dissipation metal plate 12 made of Al material, an insulating layer 13 made of epoxy resin, and a metal thin film 14 made of Cu material. To create this three-layer structure, as shown in FIG.
Heat while pressing lightly all over. The epoxy resin film 13a is once melted and then thermally hardened to become the insulating layer 13, which adheres the metal plate 12 and the metal thin film 14 and electrically insulates them. At this time, the 18th
Mucus-like epoxy resin 2 as shown in the conventional case
Since a is not locally compressed and thinned by the strip metal piece 3, the epoxy resin equivalent to the thickness of the epoxy resin film 13a directly forms the thickness of the insulating layer 13. The epoxy resin film 13a can be obtained with a thin, uniform thickness and good insulation properties. Therefore, these advantages of the epoxy resin film 13a are inherited by the insulating layer 13, and an insulating layer 13 having a thickness of, for example, 80 μm and having no problems in both adhesion and insulation is formed.

In addition, in order to produce the heat dissipation board 11, the metal plate 1
Form an epoxy resin layer on 2 by a printing method,
On top of that, Cu is deposited using high-frequency ion plating method.
There are also methods of forming layers. In any case,
If the heat dissipation substrate 11 is manufactured as a three-layer structure of the metal plate 12 - the insulating layer 13 - the metal thin film 14, the insulating layer 13 can be formed much thinner than the insulating layer 2 of the conventional example without impairing the insulation properties. can.

Next, as shown in FIG. 7, the metal thin layer 14 is partially etched away, leaving three separated island-shaped metal thin layers 14b in parallel for one full-wave rectifier. This island-like metal thin layer 14b is formed into a rectangular planar shape.

Next, as shown in FIGS. 8 and 9, this large-area heat dissipation board 11 is cut to produce a heat dissipation board 11a having the size of one full-wave rectifier. 15 is a mounting hole. Incidentally, after dividing into the heat dissipating substrates 11a, the thin metal layer 14 may be partially etched to obtain the island-shaped thin metal layer 14b.

On the other hand, apart from the fabrication of the heat dissipation substrate 11a, the 10th
The rectifier 16 shown in the figure and FIG.
Make 3 pieces for each piece. 17 is a band-shaped metal piece made of Ni-coated Cu material, 18 and 19 are rectifying elements, and 20 is a thyristor, the polarities of which are as shown in FIG. The rectifying elements 18 and 19 are made by fixing silicon diode chips 21 and 22 to the strip metal piece 17 with solder (not shown), and connecting lead wires 23 and 24 made of Ni-coated Cu material to the silicon diode chips 21 and 22 with solder (not shown). (not shown),
Furthermore, protective resin 25, 26 made of silicone rubber
It is constructed by covering portions of silicon diode chips 21 and 22 with . The thyristor 20 is similarly constructed by fixing a thyristor chip 27, fixing a lead wire 28, and covering it with a protective resin 29. In addition, the thyristor 20
has a thin Ag wire 30 fixed to the thyristor chip 27 to serve as a gate electrode lead.

Next, as shown in FIG. 12, the separately prepared heat dissipating substrate 11a and three rectifiers 16 are integrated to form an assembly shown in FIG. 13. Each of the three flow regulators 16 has three island-like metal thin layers 1.
4b by solder (not shown).

Next, as shown in FIG. 14, wiring and the like are performed to configure a three-phase full-wave rectifier circuit. 31 is a hybrid in which a control circuit for the thyristor 20 is configured.
Since it is an IC board, its details will be omitted. 32 is a connecting piece for commonly connecting three lead wires 23 of the rectifying element 18. Reference numeral 33 denotes a connection piece for commonly connecting three lead wires 24 of the rectifying element 19 and three lead wires 28 of the thyristor 20, a total of six lead wires. Each connecting piece 32, 33 is made of Ni-coated Cu material. Connection wires 34, 35, and 36 are made of insulator-coated Cu wires connected to the strip metal piece 17, respectively. Reference numerals 37 and 38 are connection wires connected to the connection pieces 32 and 33, respectively. 39 and 40 are the connection pieces 32 and 33, respectively, and the hybrid IC board 3
This is a connection line that connects 1 to 1. A thin wire 30, which is a gate electrode lead of the thyristor 20, is connected to a hybrid IC substrate 31. These connections are
All are fixed by solder (not shown).

FIG. 15 is a circuit diagram after the wiring shown in FIG. 14 is connected.
The connecting lines 34, 35, 36 serve as AC input terminals and are connected to the three-phase AC output of the alternator. Connection lines 37 and 38 serve as DC output terminals and are connected to a battery. The circuit consisting of the thyristor 20 and the hybrid IC board 31 is added to prevent overcharging of the battery.
That is, when the battery becomes overcharged, the hybrid IC 31 detects this, turns on all three thyristors 20, and stops the DC output from the connection lines 37 and 38.

Note that when adopting a method of stopping the power generation of the generator to prevent overcharging, the thyristor 20 is not necessary, so the number of the island-like metal thin layer 14b and the flow regulator 16 is usually two. That is,
Three rectifier elements 18 in FIG. 15 are formed on a strip-shaped metal piece 17 to produce one rectifier 16,
Another rectifier 16 is made by forming three rectifying elements 19 on another strip-shaped metal piece 17, and these two
Each of the flow regulators 16 is fixed to the island-shaped metal thin layer 14b. In this case, the strip metal piece 17 is on the DC output terminal side, and the three sets of connection pieces connecting the lead wires 23 and 24 are on the AC input terminal side. However, with regard to the present invention, these differences in circuit layout are not essential differences.

Next, the case 41 made of epoxy resin is fixed to the heat dissipation board 11a with an epoxy adhesive (not shown), and the inside of the case 41 is filled with a sealing resin 42 made of epoxy resin, and the full wave as shown in FIG. Rectifier 4
Complete 3.

The full-wave rectifier 43 manufactured in this way has thermal resistance between the rectifying elements 18, 19, the thyristor 20, and the heat dissipation substrate 11a because the insulating layer 13 is formed much thinner than the conventional insulating layer 2. is small, and the efficiency of heat dissipation from the metal plate 12 is high. Therefore, even if this full-wave rectifier 43 is used without being attached to an external heat sink like in the past, the heat capacity of the heat sink 11a is smaller than that of the conventional heat sink 11a.
Something much smaller than this will suffice. However, this does not fully utilize the features of the full-wave rectifier 43. Therefore, as shown in Fig. 1, a full-wave rectifier 4
3 to the rear cover 45 of the starter motor 44, which is an existing metal component of the motorcycle,
Configure a full-wave rectifier.

FIGS. 2 and 3 show how the full-wave rectifier 43 is attached to the starter motor 44. FIG. The rear cover 45 is made of an aluminum die-cast product and is also called an end bracket. 46 is the outer main surface of the rear cover (side surface of the motor), which is a flat surface;
47 is a body case made of Fe material, 48 is a front cover made of die-cast aluminum, 49 is a gear part at the tip of the shaft, and 50 and 51 are rubber O.
ring, 52 is a pedestal part formed integrally with the rear cover 45 for fixing the starter motor 44 to a predetermined part of the motorcycle with screws, 53 is a hole for passing a bolt through, and 54 is a pedestal part for fixing the full-wave rectifier 43 to the outside. This is a protective cover made of Al material to prevent exposure. As shown in the figure, the full wave rectifier 43 connects the bolt 55 to the washer 56 and the mounting hole 1.
5 into the screw hole 57, it is attached to the outer main surface 46 of the rear cover 45. The protective cover 54 is attached to the rear cover 45 with washers 58 and bolts 59. bolt 5
9 is screwed into a screw hole 62 provided in the front cover 48 through holes 60 and 61 provided in the protective cover 54 and rear cover 45, respectively. The bolts 59 are used to assemble the starter motor 44 by pulling the front cover 48 and the rear cover 45 together, but are also used here to attach the protective cover 54. By changing the shape of the heat dissipation board 11a so that the mounting hole 15 of the full-wave rectifier 43 is located at a position where the bolt 59 is passed, the bolt 59 can also be used for mounting the full-wave rectifier 43.

When the starter motor 44 is energized to rotate the motor and generate heat, the engine starts for a very short time and the engine rotates at a very low speed, so the alternator generates almost no power, and the full-wave rectifier 43 fever is negligible. After the engine is started, the starter motor 44 is mainly used as an external heat radiator for the full-wave rectifier 43 using the rear cover 45, but heat generated by energizing the motor is not applied at the same time. The starter motor 44 has a relatively large heat radiating capacity as a heat radiator, and is convenient as an external heat radiator of the full-wave rectifier 16. Further, since both the starter motor 44 and the alternator are connected to the engine crankshaft via gears, they are located close to each other. This is advantageous in connecting the full-wave rectifier 43 attached to the starter motor 44 and the alternator because the wiring is short and power loss due to the wiring is reduced.

In this way, the starter motor 44 is suitable as an existing component to which the full-wave rectifier 43 is attached. As a mounting location for the starter motor 44, the rear cover 45 as in the embodiment is preferred because of its suitability as a main heat radiator and ease of mounting.

The present invention is not limited to the embodiments described above, but can be modified. For example, the rectifier 43
The heat dissipation capacity required of the component to which the rectifier 43 is attached may be low, and the installation space may be small, so a variety of components can be selected.For example, the rectifier 43 can be attached to a step holder, emblem, chain case, alternator, etc. be able to. In this case, the metal plate 12 itself may be of a size that can maintain the strength of the rectifier 43. For example, it is sufficient if the metal plate 12 is an Al plate with a thickness of 2 mm. If the metal plate 12 is thin, press working is possible, so even if there is a request to change the planar shape of the metal plate 12, it can be easily met.

[Effect of idea]

As is clear from the above, the present invention has the following effects.

(a) Since the first and second diode chips 21, 22 and the thyristor chip 27 are not directly fixed on the strip metal thin layer 14b but are fixed on the metal piece 17, heat dissipation is improved. In other words, both the absorption of heat generated by a transient large current and the efficient heat dissipation in steady state can be performed satisfactorily.

(b) Since the AC input lines 34, 35, and 36 are connected to the metal piece 17, and the DC output lines 37, 38 are connected to the first and second connection pieces 32, 33,
The main current does not flow through the circuit board 31. Therefore, the heat dissipation of the main current path can be increased.

(C) Since the first connection line 39 is arranged to cross over the second connection piece 33, the first connection line 39
The drooping of the diode chips 21, 22 and the thyristor chip 2 is limited by the second connection piece 33.
The resin sealing of No. 7 can be performed satisfactorily.

(d) Electrical isolation is achieved by the insulating layer 13, and the first, second and third lead wires 23, 24, 28 are interconnected by the first and second connection pieces 32, 33. Therefore, not only miniaturization is achieved, but also robustness and improved reliability are achieved.

[Brief explanation of the drawing]

Figures 1 to 16 show a full-wave rectifier for a motorcycle according to an embodiment of the present invention.
The figure is a sectional view of the rectifier part, Figure 2 is an exploded perspective view showing the relationship between the starter motor and rectifier, Figure 3 is a partially cutaway front view showing the relationship between the starter motor and rectifier, and Figure 4 is heat dissipation. FIG. 5 is a partial cross-sectional view of the heat dissipation board shown in FIG. 4, FIG. 6 is a cross-sectional view showing a method for manufacturing the heat dissipation board, and FIG. 7 is a perspective view showing the heat dissipation board with the metal layer etched. , FIG. 8 is a perspective view showing the heat dissipation board after cutting, FIG. 9 is a sectional view taken along the line - - in FIG. 8, FIG. 10 is a perspective view showing the flow regulator, and FIG. 12 is a cross-sectional view showing the relationship between the heat dissipation board and the fluid rectifier, FIG. 13 is a perspective view showing the combined structure of the heat dissipation board and the fluid rectifier, and FIG. 14 is the full-wave rectifier before exterior packaging. Fig. 15 is a circuit diagram of a full-wave rectifier;
Fig. 16 is a perspective view showing the full-wave rectifier after packaging, Fig. 17 is a sectional view showing the conventional full-wave rectifier,
FIG. 8 is a sectional view showing a method of assembling the full-wave rectifier shown in FIG. 17. FIG. 19 is a sectional view showing another conventional full-wave rectifier. 11a... Heat dissipation board, 12... Metal plate, 13...
...Insulating layer, 14b... Metal thin layer, 16... Rectifier, 17... Metal piece, 18, 19... Rectifying element,
20...thyristor, 43...rectifier, 44...
starter motor.

Claims (1)

[Claims for Utility Model Registration] A metal plate 12, a plurality of band-shaped metal layers 14b provided on the metal plate 12 via an insulating layer 13 and arranged in parallel with each other, and the plurality of band-shaped metal layers 14b. A plurality of strip-shaped metal pieces 17 fixed by solder; a plurality of first diode chips 21 fixed respectively on the plurality of strip-shaped metal pieces 17; and a plurality of first diode chips 21 fixed on the plurality of strip-shaped metal pieces 17, respectively. and a plurality of second diode chips 2 each having a polarity opposite to that of the first diode chip 21.
2, a plurality of thyristor chips 27 each fixed on the plurality of strip-shaped metal pieces 17 so as to have the same polarity as the first diode chip 21 and arranged next to the second diode chip 22; The plurality of first diode chips 21, the second
diode chip 22 and thyristor chip 2
A plurality of first, second, and third lead wires 2 are respectively connected to 7 and led upward so as to extend perpendicularly to the main surface of the strip-shaped metal piece 17.
3, 24, 28, which are electrically connected to the gate electrode of the thyristor chip 27 and which are closer to the second diode chip 22 and the thyristor chip 27 than the first diode chip 21 in plan view. Thyristor control circuit board 3 placed in a nearby area
1, a first connection piece 32 interconnecting the plurality of first lead wires 23, and the plurality of second and third lead wires 24, 28.
a second connection piece 33 that interconnects the first connection piece 32, one end of which is connected to the first connection piece 32, the other end of which is connected to the circuit board 31, and a second connection piece 33 that is a first connection line 39 arranged across; and a second connection line 4 whose one end is connected to the second connection piece 33 and the other end is connected to the circuit board 31.
0, a plurality of AC input lines 34, 35, 36 connected to the plurality of strip metal pieces 17, respectively, and a plurality of DC output lines 37 connected to the first and second connection pieces 32, 33, respectively. , 38, and the first and second diode chips 21, 2
2 and a sealing resin 42 provided so as to surround the thyristor chip 27.