JPH0448041A - Copper alloy low in constant mass temperature coefficient of electric resistance - Google Patents
Copper alloy low in constant mass temperature coefficient of electric resistanceInfo
- Publication number
- JPH0448041A JPH0448041A JP15571290A JP15571290A JPH0448041A JP H0448041 A JPH0448041 A JP H0448041A JP 15571290 A JP15571290 A JP 15571290A JP 15571290 A JP15571290 A JP 15571290A JP H0448041 A JPH0448041 A JP H0448041A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- weight
- temperature coefficient
- constant mass
- electric resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 7
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 230000007257 malfunction Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- FWFGVMYFCODZRD-UHFFFAOYSA-N oxidanium;hydrogen sulfate Chemical compound O.OS(O)(=O)=O FWFGVMYFCODZRD-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は自動車及び温度変化が激しい環境において使用
される電子機器等に組み込まれる電気回路の通電材料と
して好適の電気抵抗の定質ｆｆｔ温度係数が小さい銅合
金に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Fields] The present invention relates to a method for determining a constant fft temperature coefficient of electrical resistance suitable as a current-carrying material for electrical circuits incorporated in automobiles and electronic devices used in environments with rapid temperature changes. Regarding copper alloys with small values.
［従来の技術］
従来、−殻内に、自動車、電子機器及び電気機器等に組
み込まれる電気回路においては、通電材料として、無酸
素銅又はリン脱酸銅等が使用されている。[Prior Art] Conventionally, oxygen-free copper, phosphorus-deoxidized copper, or the like has been used as a current-carrying material in electrical circuits built into automobiles, electronic equipment, electrical equipment, etc. in a shell.
［発明が解決しようとする課題］
しかしながら、上述した無酸素銅及びリン脱酸銅は電気
抵抗の定質量温度係数が大きいという欠点がある。この
ため、例えば自動車及び温度変化が激しい環境で使用さ
れる電子機器等のように、温度が著しく変動するような
場合には、それに組み込まれている電気回路の電気抵抗
が変動しやすく、回路中の電圧及び電流が安定しにくい
という欠点がある。その結果、機器が誤動作する場合が
ある等、通電材料の特性が電気回路の信頼性を低下させ
る要因になっている。また、このような不都合を回避す
るために制御回路を設け、この制御回路により電気回路
の動作を安定化させることもできるが、そうすると回路
が複雑になるという欠点がある。[Problems to be Solved by the Invention] However, the above-mentioned oxygen-free copper and phosphorus-deoxidized copper have a drawback that the constant mass temperature coefficient of electrical resistance is large. For this reason, in cases where the temperature fluctuates significantly, such as in automobiles or electronic devices used in environments with rapid temperature changes, the electrical resistance of the electrical circuits built into them tends to fluctuate, causing damage to the circuit. The disadvantage is that the voltage and current are difficult to stabilize. As a result, the characteristics of current-carrying materials have become a factor that reduces the reliability of electrical circuits, such as equipment malfunctioning in some cases. Further, in order to avoid such inconveniences, a control circuit can be provided and the operation of the electric circuit can be stabilized by this control circuit, but this has the disadvantage that the circuit becomes complicated.
本発明はかかる問題点に鑑みてなされたものであって、
電気抵抗の定置量温度係数が小さくて環境温度の変化に
よる抵抗値の変動が少なく、電子機器等に組み込まれた
電気回路等の信頼性を向上させることができる電気抵抗
の定置量温度係数が小さい銅合金を提供することを目的
とする。The present invention has been made in view of such problems, and includes:
The fixed quantity temperature coefficient of electrical resistance is small, so there is little variation in resistance value due to changes in environmental temperature, which can improve the reliability of electrical circuits incorporated in electronic devices, etc. The fixed quantity temperature coefficient of electrical resistance is small. The purpose is to provide copper alloys.
［課題を解決するための手段］
本発明に係る電気抵抗の定置量温度係数が小さい銅合金
は、０．５０乃至０．７５重量％のＮｉ、０．１０乃至
０．１６重量％の５ｉ１０．００１乃至０．０１重量％
のＭｇ及び０．００５乃至０．２０重量％のＭｎを含有
すると共に、Ｃｒ１Ｔｉ及びＺｒからなる群から選択さ
れた少なくとも１種の成分を総量で０．００を乃至０．
０１重量％含有し、残部がＣｕ及び不可避的不純物から
なることを特徴とする。[Means for Solving the Problems] The copper alloy according to the present invention, which has a small stationary temperature coefficient of electrical resistance, contains 0.50 to 0.75% by weight of Ni, 0.10 to 0.16% by weight of 5i10. 001 to 0.01% by weight
of Mg and 0.005 to 0.20% by weight of Mn, and at least one component selected from the group consisting of CrTi and Zr in a total amount of 0.00 to 0.00% by weight.
01% by weight, with the remainder consisting of Cu and unavoidable impurities.
また、上記成分に加えて、０．１０乃至１．０重量％の
Ｚｎを含有してもよい。Further, in addition to the above components, 0.10 to 1.0% by weight of Zn may be contained.
［作用コ
以下、本発明に係る電気抵抗の定置量温度係数が小さい
銅合金の成分添加理由及び組成限定理由について説明す
る。[Function] The reason for adding a component of a copper alloy having a small fixed amount temperature coefficient of electrical resistance and the reason for limiting the composition according to the present invention will be explained below.
瓦Ｌ
Ｎ１は後述するＳｉと共に鋼中に固溶して、銅合金にお
ける電気抵抗の定置量温度係数を低下させると共に、銅
合金の強度を向上させる作用がある。しかしＮ Ｎ ｒ
含有量がθ、５０重量％未満の場合は、上述の作用効果
が不十分である。一方、Ｎｉ含有量が０．７５重量％を
超えると、導電率が３５％ｌＡｃ５ （純銅焼鈍材の導
電率を１００とした場合のもの）以下に低下すると共に
、冷間加工性も損なわれる。従ってＮ Ｎ ｉ含有量は
０．５０乃至０．７５重量％とする。The roof tile L N1 forms a solid solution in the steel together with Si, which will be described later, and has the effect of lowering the fixed amount temperature coefficient of electrical resistance in the copper alloy and improving the strength of the copper alloy. But N N r
When the content is less than θ, 50% by weight, the above-mentioned effects are insufficient. On the other hand, when the Ni content exceeds 0.75% by weight, the electrical conductivity decreases to 35% lAc5 (when the electrical conductivity of pure copper annealed material is 100) or less, and the cold workability is also impaired. Therefore, the N N i content is set to 0.50 to 0.75% by weight.
Ｓｊには、前述の如＜ 、Ｎ ｒと共に鋼中に固溶して
、銅合金における電気抵抗の定置量温度係数を低下させ
ると共に、銅合金の強度を向上させる作用がある。しか
し、Ｓｉ含有量が０．１０重量％未溝の場合は、上述の
作用効果が不十分である。As mentioned above, Sj forms a solid solution in steel together with Nr, and has the effect of lowering the stationary temperature coefficient of electrical resistance in the copper alloy and improving the strength of the copper alloy. However, when the Si content is 0.10% by weight without grooves, the above-mentioned effects are insufficient.
方、Ｓｉ含有量が０．１Ｇ重量％を超えると、導電率が
３５％ｌＡＣ３以下に低下すると共に、冷間加工性（特
に、製管時の加工性）が阻害される。従って、Ｓｌ含有
量は０．ｌＯ乃至０．１Ｔｉ重量％とする。On the other hand, when the Si content exceeds 0.1G% by weight, the electrical conductivity decreases to 35%lAC3 or less, and cold workability (particularly workability during pipe manufacturing) is inhibited. Therefore, the Sl content is 0. 1O to 0.1% by weight of Ti.
故左
Ｍｇには、銅合金の熱間加工性を向上させる作用がある
。即ち、銅合金の溶製Φ造塊時に、この銅合金中に不可
避的に混入される低融点の硫黄（Ｓ）とＭｇとが反応し
て高融点のＭｇＳを生成することにより、銅合金の熱間
加工性を向上させる。しかし、Ｍｇ含有量が０．００１
重量％未満の場合は、上述の作用効果が不十分である。Mg has the effect of improving the hot workability of copper alloys. That is, during the melting and ingot production of copper alloys, Mg reacts with low-melting point sulfur (S), which is inevitably mixed into the copper alloy, to produce high-melting point MgS. Improves hot workability. However, the Mg content is 0.001
When the amount is less than % by weight, the above-mentioned effects are insufficient.
一方、Ｍｇ含有量がθ、旧重量％を超えると、ＭｇとＣ
ｕとが反応して低融点の共晶を生成するため、銅合金の
熱間加工性が低下する。更に、この場合、銅合金の溶湯
が酸化されやすくなり、その流動性が低下して、健全な
鋳塊を得ることが困難になる。On the other hand, when the Mg content exceeds θ, old weight%, Mg and C
Since the copper alloy reacts with u to produce a low melting point eutectic, the hot workability of the copper alloy decreases. Furthermore, in this case, the molten copper alloy becomes easily oxidized, its fluidity decreases, and it becomes difficult to obtain a sound ingot.
従って、Ｍｇ含有量は０．００１乃至０．０１重量％と
する。Therefore, the Mg content is set to 0.001 to 0.01% by weight.
ｘ
Ｍｎを添加すると、鋳塊の粒界が強化されるため、銅合
金の熱間加工性を向上させることができると共に、中高
温度における脆性に対する耐性を改善して銅合金の強度
を向上させることができる。x Adding Mn strengthens the grain boundaries of the ingot, so it can improve the hot workability of the copper alloy, and it also improves the strength of the copper alloy by improving its resistance to brittleness at medium and high temperatures. I can do it.
しかし、Ｍｎ含有量が０．００５重量％未満の場合は、
上述の作用効果が不十分である。一方、Ｍｎ含有量が０
．２０重量％を超えると、上述の効果が飽和して、それ
以上の効果が得られない。従って、Ｍｎ含有量は０．０
０５乃至０．２０重量％とする。However, when the Mn content is less than 0.005% by weight,
The above effects are insufficient. On the other hand, Mn content is 0
．． If it exceeds 20% by weight, the above-mentioned effects will be saturated and no further effects will be obtained. Therefore, the Mn content is 0.0
05 to 0.20% by weight.
Ｃｒ５Ｔｆ及びＺｒには、いずれも、鋳塊の粒界を強化
し、銅合金の熱間加工性を向上させる作用がある。これ
らの成分はいずれも同様の作用効果を有し、単独又は複
合添加のいずれでもよい。Both Cr5Tf and Zr have the effect of strengthening the grain boundaries of the ingot and improving the hot workability of the copper alloy. All of these components have similar effects and may be added alone or in combination.
しかし、Ｃｒ、Ｔｉ及びＺｒの総合有量がｏ、ｏｏｔ重
量％未横の場合は、上述の作用効果が不十分である。一
方、Ｃｒ、 Ｔ Ｈ及びＺｒの総合有量が０．０１重量
％を超えると、銅合金の溶湯が酸化されやすくなるため
、健全な鋳塊を得ることが困難になる。従って、Ｃｒ１
Ｔｉ及びＺｒからなる群から選択された少なくとも１種
の成分を含有し、その総合有量は０．００１乃至０．旧
重量％とする。However, when the total amount of Cr, Ti, and Zr is less than o, oot weight percent, the above-mentioned effects are insufficient. On the other hand, if the total content of Cr, T H and Zr exceeds 0.01% by weight, the molten copper alloy becomes easily oxidized, making it difficult to obtain a healthy ingot. Therefore, Cr1
Contains at least one component selected from the group consisting of Ti and Zr, the total amount of which is from 0.001 to 0.000. It is the old weight %.
Ｚｎは銅合金により形成した電気回路の配線路に電子部
品等を半田付けする場合に、半田の密着性を向上させる
作用がある。このため、前述のＮｉ及びＳｉを含有する
銅合金中にＺｎを含有させてもよい。しかし、Ｚｎ含有
量が０．１０重量％未滴の場合は、上述の効果を得るこ
とができない。Zn has the effect of improving solder adhesion when soldering electronic components and the like to wiring paths of an electric circuit formed of a copper alloy. For this reason, Zn may be included in the copper alloy containing Ni and Si. However, if the Zn content is 0.10% by weight, the above-mentioned effects cannot be obtained.
一方、ｚｎを１．０重量％を超えて添加しても、上述の
効果はそれ以上増大せず無駄であるばかりでなく、導電
率が著しく低下する。従って、Ｚｎを含有する場合は、
その含有量を０．１０乃至！、０重量％とする。On the other hand, even if more than 1.0% by weight of zn is added, the above-mentioned effects will not increase any further, which is not only useless, but also the electrical conductivity will drop significantly. Therefore, when containing Zn,
Its content is 0.10~! , 0% by weight.
また、本発明においては、上述した成分の外に、必要に
応じて、ＦｅＸＣ０Ｎ Ｓｎ又はＡ！を含有することが
できる。この場合、Ｆｅ１ＣＯ１Ｓｎ及びＡノからなる
群から選択された１８Ｉ！又は２種以上の成分の総合有
量を０．５重量％以下に規制すれば、銅合金の熱間加工
性はもとより、通電材として必要な特性、即ち電気抵抗
の定置量温度係数及び導電率は、実用上問題なく維持さ
れる。Furthermore, in the present invention, in addition to the above-mentioned components, FeXC0N Sn or A! can contain. In this case, 18I! selected from the group consisting of Fe1CO1Sn and A! Alternatively, if the total content of two or more components is regulated to 0.5% by weight or less, not only the hot workability of the copper alloy but also the properties necessary as a conductive material, such as the fixed amount temperature coefficient of electrical resistance and conductivity, can be improved. is maintained without any practical problems.
なお、本発明に係る電気抵抗の定置ａｍ度係数が小さい
銅合金は、電気部品及び電子部品に組み込まれた電気回
路並びに各部品間を接続する配線材等のような通電材と
しての適用の外に、磁場又は電場に対するシールド材と
しても適用することができる。Note that the copper alloy of the present invention, which has a small stationary am coefficient of electrical resistance, is not applicable to electrical circuits incorporated in electrical parts and electronic parts, and as a current-carrying material such as wiring material connecting each part. It can also be applied as a shielding material against magnetic or electric fields.
また、本発明に係る銅合金は、リード等の外、コイル状
を始めとして、管、欅、線、板、条及び箔等のいずれの
形状で電気回路に使用してもよく、形状により限定され
るものではない。In addition, the copper alloy according to the present invention may be used in electrical circuits in any shape such as a coil shape, a tube, a wire, a plate, a strip, a foil, etc., in addition to a lead, etc., and there are limitations depending on the shape. It is not something that will be done.
［実施例コ
次に、本発明の実施例について、その特許請求の範囲か
ら外れる比較例と比較して説明する。[Examples] Next, examples of the present invention will be described in comparison with comparative examples that fall outside the scope of the claims.
先ず、下記第１表に示す成分組成の銅合金を大気溶解炉
で溶解した後、厚さが５０１！１Ｉ１１１幅が８５鳳閣
、長さが２００ｍａ＋の鋳塊を製造した。そして、これ
らの鋳塊を９００°Ｃに加熱した後、厚さ力月５１１１
１１１になるように熱間圧延処理を施して、熱間圧延材
を得た。First, a copper alloy having the composition shown in Table 1 below was melted in an atmospheric melting furnace, and then an ingot with a thickness of 50111111, a width of 85 mm, and a length of 200 ma+ was produced. After heating these ingots to 900°C, the thickness of the ingots was 5111°C.
A hot-rolled material was obtained by hot-rolling the material so that it had a diameter of 111.
但し、比較例１及び比較例２は夫々純度が９９．９９重
量％の純銅及びリン脱酸銅であり、いずれも従来電気回
路用材料として使用されているものである。However, Comparative Examples 1 and 2 are pure copper and phosphorus-deoxidized copper with a purity of 99.99% by weight, respectively, and both are conventionally used as materials for electric circuits.
次に、これらの熱間圧延材を硫酸水（濃度が２０容量％
）で酸洗して表面の酸化物を除去した後、冷間圧延加工
を施して、厚さが１ｍｍの板材を得た。Next, these hot rolled materials were mixed with sulfuric acid water (concentration 20% by volume).
) to remove oxides on the surface, cold rolling was performed to obtain a plate material with a thickness of 1 mm.
そして、この板材を６００℃の温度に１時間加熱し、そ
の後１５°Ｃ／秒以上の冷却速度で水冷した。Then, this plate material was heated to a temperature of 600° C. for 1 hour, and then water-cooled at a cooling rate of 15° C./second or more.
次いで、この板材を前記硫酸水で酸洗した後、冷間圧延
加工を施して、その厚さを０．５Ｈにした。Next, this plate material was pickled with the sulfuric acid water, and then cold rolled to a thickness of 0.5H.
このようにして得た実施例１乃至６及び比較例１．２の
各圧延材の導電率をＪＩＳ Ｈ０５０５に基づく４端子
法により測定した。このときの試料温度は０°Ｃｌ２Ｏ
℃、４０°Ｃ９６０°Ｃ及び８０℃である。その結果を
下記第２表に示す。The electrical conductivity of each of the thus obtained rolled materials of Examples 1 to 6 and Comparative Example 1.2 was measured by a four-probe method based on JIS H0505. The sample temperature at this time was 0°Cl2O
℃, 40°C, 960°C and 80°C. The results are shown in Table 2 below.
第２表
この第２表から明らかなように、本発明に係る実施例１
乃至６はいずれも比較例１，２に比して電気抵抗の定質
量温度係数が約！／２乃至１／３と低い。従って、この
実施例１乃至６の銅合金は温度変化に対して電気抵抗値
の変動が少なく、このため温度変化が激しい環境下で使
用される機器の電気回路用材料等として好適である。Table 2 As is clear from this Table 2, Example 1 according to the present invention
In all of 6 to 6, the constant mass temperature coefficient of electrical resistance is about 100% compared to Comparative Examples 1 and 2! It is as low as /2 to 1/3. Therefore, the copper alloys of Examples 1 to 6 have little variation in electrical resistance with respect to temperature changes, and are therefore suitable as materials for electrical circuits of devices used in environments with severe temperature changes.
［発明の効果コ
以上説明したように本発明によれば、Ｎ１ｚＳ ｉｚ
Ｍ ｇ及びＭｎを夫々所定の組成で含有すると共に、ｃ
ｒｖＴｉ及びＺｒを所定量含有し、更に必要に応じてＺ
ｎを所定量添加したから、電気抵抗の定質量温度係数が
小さい銅合金を得ることができる。そして、この銅合金
を自動車及び温度変化が大きい環境において使用される
電子機器等の電気回路構成材料として使用すると、機器
の誤動作を抑制することができ、機器の信頼性を向上さ
せることができる。従って、本発明に係る銅合金は、例
えば自動車に搭載される電子機器及び温度変化が激しい
環境下で使用される電子機器等に組み込まれた電気回路
の構成材料として極めて有益である。[Effects of the Invention] As explained above, according to the present invention, N1zS iz
Contains Mg and Mn in predetermined compositions, and c
Contains a predetermined amount of rvTi and Zr, and further contains Z as necessary.
Since a predetermined amount of n is added, a copper alloy with a small constant mass temperature coefficient of electrical resistance can be obtained. When this copper alloy is used as an electric circuit constituent material for automobiles and electronic devices used in environments with large temperature changes, malfunctions of the devices can be suppressed and the reliability of the devices can be improved. Therefore, the copper alloy according to the present invention is extremely useful as a constituent material of electric circuits incorporated in, for example, electronic devices installed in automobiles and electronic devices used in environments with severe temperature changes.
Claims (2)
至０．１６重量％のＳｉ、０．００１乃至０．０１重量
％のＭｇ及び０．００５乃至０．２０重量％のＭｎを含
有すると共に、Ｃｒ、Ｔｉ及びＺｒからなる群から選択
された少なくとも１種の成分を総量で０．００１乃至０
．０１重量％含有し、残部がＣｕ及び不可避的不純物か
らなることを特徴とする電気抵抗の定質量温度係数が小
さい銅合金。(1) 0.50 to 0.75 wt% Ni, 0.10 to 0.16 wt% Si, 0.001 to 0.01 wt% Mg, and 0.005 to 0.20 wt% Mn and at least one component selected from the group consisting of Cr, Ti, and Zr in a total amount of 0.001 to 0.
．． A copper alloy having a small constant mass temperature coefficient of electrical resistance, characterized by containing 0.1% by weight and the remainder consisting of Cu and unavoidable impurities.
至０．１６重量％のＳｉ、０．００１乃至０．０１重量
％のＭｇ、０．００５乃至０．２０重量％のＭｎ及び０
．１０乃至１．０重量％のＺｎを含有すると共に、Ｃｒ
、Ｔｉ及びＺｒからなる群から選択された少なくとも１
種の成分を総量で０．００１乃至０．０１重量％含有し
、残部がＣｕ及び不可避的不純物からなることを特徴と
する電気抵抗の定質量温度係数が小さい銅合金。(2) 0.50 to 0.75 wt% Ni, 0.10 to 0.16 wt% Si, 0.001 to 0.01 wt% Mg, 0.005 to 0.20 wt% Mn and 0
．． Contains 10 to 1.0% by weight of Zn and Cr
, Ti and Zr.
A copper alloy having a small constant mass temperature coefficient of electrical resistance, characterized in that it contains 0.001 to 0.01% by weight of seed components in total, and the remainder consists of Cu and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571290A JP2756021B2 (en) | 1990-06-14 | 1990-06-14 | Copper alloy with low constant mass temperature coefficient of electrical resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15571290A JP2756021B2 (en) | 1990-06-14 | 1990-06-14 | Copper alloy with low constant mass temperature coefficient of electrical resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0448041A true JPH0448041A (en) | 1992-02-18 |
| JP2756021B2 JP2756021B2 (en) | 1998-05-25 |
Family
ID=15611853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15571290A Expired - Lifetime JP2756021B2 (en) | 1990-06-14 | 1990-06-14 | Copper alloy with low constant mass temperature coefficient of electrical resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2756021B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0949343A1 (en) * | 1998-03-26 | 1999-10-13 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Copper alloy sheet for electronic parts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5551504B2 (en) | 2010-05-07 | 2014-07-16 | Ｊｆｅスチール株式会社 | Steel plate end face heating device |
-
1990
- 1990-06-14 JP JP15571290A patent/JP2756021B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0949343A1 (en) * | 1998-03-26 | 1999-10-13 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Copper alloy sheet for electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2756021B2 (en) | 1998-05-25 |
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