JPH0448537A - Flat image display device - Google Patents

Abstract

PURPOSE:To get an electron beam which is simple and good in mass-productivity and cost performance by covering a crystallized glassy electric insulating layer with an electron beam control means and forming an electrode body on the layer by printing. CONSTITUTION:A back container 1, a back plate 2 where an electrode body 12 is formed by printing on the crystallized glassy surface 11 of an electric insulating layer covered on a metal substrate, a linear cathode 3 as a beam source, grid electrodes 4-7, a horizontal deflection electrode 8, a vertical deflection electrode 9 and a screen 10 emitting light due to irradiation-collision of electron beams are arranged, and these are housed in the evacuated inside of a flat glass bulb. As a metal base substance, a metal substrate of back plate is selected from various types of alloys, such as steel for hollow, stainless steel, silicon steel, nickel-chrome -iron, covar, invar, etc., and clad material. The electric insulating layer is made up taking into consideration the electric insulation and heat resistance, and the glassy layer is made up of no-alkali crystallized glass.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to an image display device in which an electron beam emitted from a flat electron source is controlled by an electron beam control electrode, accelerated, and projected onto a phosphor surface to display an image. As we enter a new era of displays in the fields of AV represented by television and OA represented by personal computers, there is a need to develop new displays that meet these demands.
For example, in personal/home information devices such as laptop computers and word processors, large screens with good visibility and lightweight displays are required, but conventional matrix-type flat display devices are
Devices using EL plasma, liquid crystal, etc. have been developed, but they have advantages and disadvantages in terms of larger size, etc., and none of them have become the main method. I, b-4 How to solve the above problems Although attempts have been made to construct a flat image display device using an electron beam, which is expected to be a method that can solve the problem, the basics of a conventional flat image display device using an electron beam have not yet been put into practical use. An example of the configuration is shown in FIG. 2 and will be explained.In order from the rear to the front, this display element includes a rear container 1, a rear electrode 2 for controlling the electron beam, a line cathode 3 as a beam source,
Grid electrodes 4 to 7 that accelerate the electron beam, horizontal deflection electrodes 8 and vertical deflection electrodes 9 that deflect the electron beam, and a screen 10 that emits light when the electron beam strikes are arranged, and these are arranged on a flat surface. Although the back electrode 2, the grid electrodes 4 to 7, the horizontal deflection electrode 8, and the vertical deflection electrode 9 are made of flat metal substrates, these metal materials are press-processed even though they are housed inside the vacuumed interior of the glass bulb. Even if slit processing and hole processing are performed using methods such as etching processing and laser processing, problems that the invention attempts to solve. The present invention is based on the above-mentioned conventional technology and aims to solve the problems by providing a flat image display device using an electron beam that is easy to mass produce and has excellent cost efficiency. Means for controlling the present invention & above A means for controlling an electron beam from an electron source of linear beam sources arranged in a plurality of rows is a means for controlling an electron beam from an electron source of linear beam sources arranged in a plurality of rows. This flat panel image display device is characterized by being coated with an electrically insulating layer and having an electrode body printed thereon.By having the above structure, the electron beam is simpler, mass-produced, and more cost-effective than conventional methods. Embodiment FIG. 1 is a block diagram of a flat panel image display device according to an embodiment of the present invention.In order from the rear to the front, the back container 1, A back electrode in which an electrode body 12 is printed on the surface 11 of a crystallized glass-based computer insulating layer coated on a metal substrate; a line cathode 3 as a beam source; grid electrodes 4 to 7; and a horizontal deflection electrode 8.
, a vertical deflection electrode 9, and a screen 10 that emits light upon impact of an electron beam are arranged, and even if these are housed inside a flat glass bulb made into a vacuum, (a) Metal substrate: Back side The metal base of the electrode is a steel plate for hollow holes, a stainless steel plate, a silicon steel plate, and a nickel-chrome base.
To each cover such as nickel - kover (kover) k invar etc.
Once a cladding material etc. is selected 4. Once the base material is determined, the desired shape machining, hole machining, etc. can be performed by ordinary machining, etching, laser machining, etc. These metal substrates are used for the purpose of improving the adhesion of the hollow layer. , surface degreased, various types of plating such as nickel and cobalt are applied, and an oxide coating layer is formed by thermal oxidation treatment (
b) Electrical insulation layer: Electrical insulation method for electrical insulation layer From the viewpoint of heat resistance, it is better for the vitreous layer to be composed of alkali-free crystallized glass (at least 2Mg0-B crystalline phase is precipitated by firing). Preferably the glass composition (for example 5ide 7-23% by weight Bool 10-34% by weight Mg0 16-50% by weight Ca0 0-20% by weight Ba0 0-50% by weight Zr0e O-5% by weight Pros O-5% by weight La5hs has a composition of 0 to 40% by weight.With this glass composition range (a), the heat resistance due to printing and firing of the electrode body layer described later and heating of the wire cathode is improved. Methods include the usual spray method, electrostatic powder coating method, electrophoretic electrodeposition method, etc. Electrophoretic electrodeposition method is most preferable due to reasons such as film density and electrical insulation properties.This method uses glass, alcohol, and a small amount. of water and mix thoroughly in a ball mill for about 20 hours until the average particle size of the glass is about 1 to 5 μm.The resulting slurry is placed in an electrolytic tank and the liquid is circulated. The base,
By dipping in this slurry and cathodically polarizing it at 100 to 400 V, glass particles can be deposited on the surface of the metal substrate. Even if this electrical insulating layer is obtained, it is necessary to precipitate at least an LMgO-based crystal phase by firing.The reason for this is that, as shown in the thermal expansion curve in Figure 3, the above composition is glass-like! ! !
In the case of (a) of (amorphous 1m), 600 to 7
However, if this is heat-treated (sintered) to precipitate at least 4 MgO-based crystal phases, the yield point will increase to 900°C or higher, as shown in (0), and the heat resistance will improve. C0 electrode body layer: As shown in FIG. 1, even though the electrode body pattern 12 is formed on the crystallized glass electrical insulating layer, the material of the conductor pattern is silver-palladium-silver-whiteff
1ffi Comparative material such as copper Even if a material with low resistivity is selected, the pattern forming method may be plating method, thermal spraying method, screen printing method, etc., but from the viewpoint of adhesion between the crystallized glass electrical insulating layer and the electrode body layer. A screen printing method is preferable. This method (& printing a mesh screen with a desired pattern shape). Even though the electrode body layer is formed by printing the conductor ink 1 and baking, the electrode body pattern layer is still intact. *500
The electrical insulating layer is required to be heat resistant, as the 8-wire cathode is heated to 600 to 900°C, which is fired in a firing furnace at ~850°C. Since fine patterns are required, the surface properties of the electrically insulating layer are important and affect the printing yield. Synthesize the glass and follow the above steps to prepare CXSU3430 base material (300IIa+x 300
nmx O, 5s+m) (7) Surface i'-= A crystallized glassy layer with a thickness of 100 μm was electrophoretically deposited L 8
The surface roughness of the sample after baking at 80℃ for 10 minutes. The waviness is determined by the heat resistance Perform a polling test to check the state of cracks and peeling of the sample.If there are any small cracks, dip them in red ink and wipe the surface. ○
Force < L after 10 cycles or more No abnormality was observed Q △ indicates that it occurred in 5 to 9 cycles X indicates that it occurred in 4 cycles or less.

Printing accuracy was evaluated using a sample decoy using the thick film printing method.
A m-wide silver electrode pattern is formed, and 90 indicates continuity and fulfills the electrode function. For Nos. 1 to 5, other components are constant,
S10! and those with changed BtO- No. 6 to 12
1, SiOs/Beds is kept almost constant, L MgO amount is changed. No. 13 to 16 are the same, CaO amount is changed. @No'17 to 211. Similarly, Ba
To those with different O amounts No. 22 to 26 (like my friend, L
To change the amount of apOs Nos. 27 to 41 show the influence of hZrot, Tide, Snug, Pros, and ZnO, respectively.

As is clear from the table, increasing the amount of BsOs by 5ins will improve the heat resistance, but the surface properties will deteriorate, making it unsuitable for fine printing.On the contrary, increasing the amount of BsOs will improve the surface properties. However, the heat resistance is reduced. Therefore, in the present invention, the heat resistance is reduced.
The amount of MgO is preferably within the range of 10 to 34% by weight, but the amount of MgO is correlated with crystallinity, and if it is less than 16% by weight, crystal precipitation will be insufficient and the heat resistance will be poor. CaO precipitates easily and easily crystallizes during glass melting, making it difficult to obtain a homogeneous glass, increasing surface roughness, and impairing printability of fine patterns. Surface method printability deteriorates and is undesirable (X).

The amount of BaO is less than 50% by weight (℃) The heat resistance deteriorates and is undesirable.The amount of La5hs (more than 40% by weight (Table) , S n
Strength including O*, P t Os, ZnO, etc.
It can be added up to 5% by weight (Example 2) 5US430 with 10 through holes (100mm x
100 mm x 0. 5 mm) On the surface of the base material Example 1, using glass with composition No. 3, a film thickness of 100 μm was formed by electrophoretic electrodeposition, spray method, and powder electrostatic method.A fired sample was prepared. The insulation properties of the 1 mA breakdown voltage were measured using a dielectric strength meter. The results are shown in Table 2.

As is clear from the table, although the electrophoretic electrodeposition method used in the present invention has excellent electrical insulation properties, Table 2 (Example 3) SUS430 (300znx300mg+xO15!
I → Substrate surface Example 1. A sample was made using No. 3 composition glass in the same manner as in Example 1, and a silver-palladium paste was screen printed on its surface, and heated in a firing furnace for 600-20 minutes to form an electrode body.
As shown in Fig. 2, the conventional example shown in Fig. 1 mounted on a flat panel image display device was prototyped and compared, and the number of grid electrodes was changed from 4 to 3 & the substrate shape was also simplified.9 Effects of the invention As described above, moving to C. With the configuration of the present invention, the number of grid electrodes used can be reduced compared to the conventional one, the shape can be simplified, and a flat image display device using an electron beam that can be mass-produced and is cost-effective can be realized. Even if it can be done

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a main part of a flat image display device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a main part of a conventional flat image display device. The linear expansion curve diagram of the crystallized glass material, which is a constituent element, shows Muto, back container 2, back electric maple 3, line shadow maple 4.5
, 6, 7...Grid electrode 8...Horizontal deflection electrode 9...
Vertical deflection electrode 10...Screen that emits light upon impact of electron beams, 11...Crystallized glass electrical insulation Ji coated on metal substrate! 2. Electrodeization

Claims (3)

[Claims] (1) Linear electron beam sources arranged in multiple rows, electron beam extraction means for extracting electron beams from the electron beam sources, and electron beams arranged in a direction intersecting the linear electron beam sources. In a flat panel image display device comprising an electron beam control means for controlling the electron beam, an electron beam deflection means for deflecting the electron beam, and a light emitting means for emitting light by the impact of the electron beam, the electron beam control means A flat plate type image display device, characterized in that a metal substrate is coated with a crystallized glass-ceramic electrical insulating layer in which at least an MgO-based crystal phase is precipitated, and an electrode body is printed on the metal substrate. (2) The main components of the crystallized glass electrical insulating layer are at least MgO; 16 to 50%; BaO; 0 to 50% by weight;
50%, CaO; 0-20%, La_2O_3: 0-4
0%, B_2O_3; 10-34%, SiO_2; 7-
23%, MO_2 (M is at least one of Zr, Ti, and Sn): 0 to 5%, and P_2O_5: 0 to 5%. (3) The flat panel image display device according to claim 1 or 2, wherein the crystallized glass electrical insulating layer is formed by electrophoretic electrodeposition and fired.