JPH0448627A - Method and apparatus for removing sheet of wafer in slicing machine - Google Patents

Abstract

PURPOSE:To effectively cut out a wafer by cutting a dummy material by lifting a member to be cut, forming a notch except part of the material to be mounted on the lower surface of the member to be cut from the upper end of an inner peripheral cutter, then returning it to an intermediate space of the inner cutter in which the inner cutter and the member to be cut are not overlapped, and then sucking to deliver the wafer by a sucking mechanism. CONSTITUTION:A member W to be cut is fed at a predetermined distance. In this case, a sucking mechanism 11 is disposed at a retracted position. The member W is lifted by known means, cut by the upper edge of an inner peripheral cutter 2, cut to the midway of a dummy material D, stopped to be lifted in a state that the residue remains, and moved down to a central space of the cutter 2 of the previous position. The mechanism 11 is erected, advanced to suck a wafer w. The member W is moved down in this state, the residue of the dummy is cut from below at the lower end of the cutter 2 to separate the wafer W.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a cutting blade (hereinafter referred to as an inner peripheral blade) on the inner periphery of a rotating annular cutting blade, inserts a member to be cut into an inner hole, and inserts a member to be cut into the inner hole. The present invention relates to a method and apparatus for taking out a single wafer by cutting a cutting member into a thin piece, that is, a wafer, by using the inner circumferential blade.

[Conventional technology]

The above-mentioned slicing machine is used to sequentially cut into wafer shapes a member to be cut made of a highly hard and brittle material. The cutting procedure is shown in Figure 11.]
00 indicates an annular cutting blade, which includes an inner peripheral blade 101. A dummy material of appropriate material is pasted to the lower part of the workpiece W, and this dummy material is gripped by known means (not shown) and sent forward (to the right in the figure) in predetermined size increments. Shift the member W upward, and the upper end I of the inner peripheral blade 101
Leave to cool and cut into wafers. Single wafer take-out using this type of internal blade type slicing machine is effective in terms of safety issues and labor saving through automation, and various developments have been made, but there are still concerns about the reliability of take-out.

That is, the workpiece W to be cut is cut, the dummy material is cut halfway, the adsorption means 102 is moved forward, the wafer W is adsorbed and held, and the adsorption pad 103 is rotated as shown by the arrow 104 to remove the dummy material. A method of breaking the wafer and taking it out during cutting, or a method of adsorbing the wafer while cutting the dummy material.
A method is adopted in which the wafer is separated from the dummy material using a swing arm suction device that rises in synchronization with the workpiece W to be cut.

[Problem to be solved by the invention]

When the suction pad 103 suctions the wafer W, the wafer W is often pressed. In this case, there is a risk that the wafer w i will come into contact with the rotating cutting blade 100 and be broken and scattered due to the rotation of the cutting blade 100. In addition, if the suction pad 103 is affected by coolant water and chips on the cutting blade 100, it may cause suction failure, causing the wafer to scatter and damage the suction take-out device. Since suction is performed when the cutting member overlaps with the cutting member, precision of the suction pad surface is required.

In view of this, an object of the present invention is to ensure that a wafer is held by suction by a suction means, and to effectively separate the wafer by cutting a dummy material.

[Means to solve the problem]

A first invention to achieve the above object relates to a method for taking out single wafers in a slicing machine, and the slicing machine forms thin wafers by sequentially cutting a member to be cut with a rotating annular cutting blade inner peripheral blade. In,
The workpiece to be cut is pushed up and a cut is made leaving a part of the dummy material attached to the bottom surface of the workpiece from the upper end of the inner peripheral blade to form a wafer, and then the inner peripheral blade and the workpiece are overlapped. After the wafer is returned to the central space of the inner circumferential blade where the wafer does not move, the wafer is suctioned and carried out by a suction mechanism.

In the second invention, the member to be cut is pushed up, the upper end of the inner peripheral blade leaves the member to be cut and a part of the dummy material to form a cut wafer, and then the inner peripheral blade is returned to the central space. , the wafer is suctioned and held by the suction mechanism, and then this suction a! The workpiece to be cut is lowered while maintaining the horizontal adsorption state, the remaining part of the dummy material is cut and separated by the lower end of the inner peripheral blade, and the wafer is carried out by the above-mentioned adsorption mechanism. The invention relates to a single wafer take-out device for carrying out the above method,
The slicing machine is equipped with a suction m side facing the workpiece to be cut in the central space of the inner peripheral blade, and a support base equipped with a vertically movable member that pushes up this suction mechanism at a predetermined pressure. The mechanism is designed to suction and hold the wafer to be cut, and to follow the descending wafer and descend against the upward force of the vertically movable member.

In addition, it is preferable that the said support stand is rotatably attached to the sliding stand which moves back and forth.

[For production]

After making a cut at the upper end of the inner blade, leaving a part of the dummy material to form a wafer, the workpiece to be cut is returned to the central space of the inner blade, and then the suction mechanism is moved forward to come into contact with the wafer and suction it. let

That is, since the workpiece to be cut is attracted while it is stopped, the accuracy of the suction pad surface can be rough, and since the inner peripheral blade and the workpiece are attracted in the central space where they do not overlap, there is no influence of coolant water or cutting dust. few. Further, while holding the wafer by suction, the member to be cut is lowered, and the remaining part of the dummy material is cut by the lower end of the inner peripheral blade to separate the wafer. In this case, the suction mechanism is caused to follow the descent of the member to be cut while being suctioned to the wafer.

Therefore, when cutting the dummy material, the wafer does not swing, and the dummy material is reliably cut. After cutting, the wafer is held by the suction mechanism, and the wafer is carried out to an appropriate position by the suction mechanism.

In carrying out the above-described method for taking out single wafers, a suction mechanism serving as a wafer gripping device is supported on a support table via a vertically movable member that pushes up with a predetermined pressure. Thereby, after the suction mechanism suctions the wafer, when the member to be cut, that is, the wafer, is lowered, the suction mechanism descends against the push-up blade of the vertically movable member and follows the wafer, so that it can securely grip the wafer.

〔Example〕

1 to 10 show embodiments of the present invention.

Reference numeral 1 denotes an annular cutting blade that is attached to a slicing machine, and has diamond abrasive grains fixed to the inner circumference to form an inner circumferential blade 2, and the outer circumference has a blade receiver 3 and a top ring 4.
The blade receiver 3 is attached to an outer cylinder 5a of a bearing 5, and the outer cylinder 5a is driven by a belt 6.

As is well known, the workpiece to be cut W has a dummy material attached to its lower part and is supported by a suitable feeding mechanism (not shown), and is fed out and raised and lowered by a predetermined amount.

Reference numeral 10 denotes a gripping device for sucking and holding the wafer W to be cut and carrying it out. This gripping device IO includes a suction mechanism 11 and a support stand 12.
It is pushed up and held by a vertically movable member 13 attached to it with a constant push-up force. The vertically movable member 13 may be a constant tension spring, but the Japanese government shows a structure in which it is pushed up at a predetermined pressure by an air cylinder. When using this air cylinder, the suction mechanism 11 can be energized with a constant pressure even when pushed down as described later, and is convenient for adjusting the push-up blade with respect to the suction Ii adjustment 11. 1
Reference numeral 4 denotes a guide rod that guides the vertical movement of the suction mechanism 11, and its lower end is fixed to the support base 12.

The suction machine 11111 is a suction cup】5 as shown in FIGS.
and a holder 16 that supports this suction cup 15, and a spherical seat 17 is provided between them, and the suction cup 15 can be adjusted along the spherical seat 17 by loosening an adjustment bolt 18.
After adjusting to properly face the wafer W, the bolt 18 is tightened and fixed.

The suction cup 15 is made of, for example, hard synthetic resin, has a suction port 20 formed therein, and is provided with a flexible packing 21 around the suction cup 15 . 22
indicates an airtight gasket provided between the suction cup 15 and the holder 16, and the suction port 20 is opened at the rear of the suction cup 15, and the suction port 20 is opened at the rear of the suction cup 15, and an appropriate suction is provided between the suction cup 15 and the holder 6. The suction cup 15 is connected to a means (not shown) through the suction port 20.
It is constructed so as to exert a suction effect on the front surface of the

Reference numeral 30 denotes an adjustment mechanism that moves the suction mechanism 11 in the front-rear direction relative to the wafer W and rotatably supports it. This adjustment mechanism 30 rotates a slide table] 1 which pivotally supports the left and right arms 23 projecting below the support table 12, a forward and backward movement cylinder 32 which moves this slide table 31 in the front and rear directions, and an adsorption mechanism 11. A rotating cylinder 33 that moves is provided. The rotation cylinder 33 is connected to a support shaft 34 fixed to one arm 23 via a connecting bar 35, and reciprocates the suction mechanism 11 between a suction position for the wafer W and a horizontal evacuation device. Reference numeral 36 denotes an adjustment bolt provided to orient the suction mechanism 11 to a vertical suction position.

In the above configuration, the procedure for cutting the wafer w from the member W to be cut will be explained based on FIG. 8.

First, the member W to be cut is fed out by a predetermined amount as shown in FIG. At this time, the suction mechanism 11 is in the retracted position. Next, the workpiece W to be cut is pushed up using a well-known means, and the upper edge of the inner circumferential blade 2 is used to cut the dummy material halfway, as shown in FIGS. It stops rising while leaving , and descends to the central space of the inner peripheral blade 2 at the old position.

Next, the suction mechanism 11 is erected and moved forward to suction the wafer W (FIG. C).

In this state, the member W to be cut is lowered, and the uncut dummy portion Da is cut from below at the lower end of the inner circumferential blade 2 to separate the wafer W. In this case, the suction mechanism 11 follows the movement of the wafer W against the bias of the vertically movable member 13 and descends in synchronization with the movement of the wafer W.

When the cutting is completed, the suction mechanism 11 is in a state of suctioning and holding the wafer W, and is rotated to the horizontal retracted position by the operation of the rotation cylinder 33 (d in the figure).

Note that any suitable means can be applied to take out the wafer W from the retracted position, and FIGS. 9 and 10 show an example thereof.

That is, the take-out device 40 includes a suction pad 41 for carrying out, and an elevating cylinder 42 and a transition cylinder 43 for raising and lowering the suction pad 41. The transition cylinder 43 uses a rodless cylinder, for example, and has a sliding rod 44 and the lifting cylinder 42.
are connected by a connecting bar 45. 46 is a universal joint that connects the lifting cylinder 42 and the suction pad 41, and 47 is an intake connecting pipe to which an appropriate suction means ζ is connected.

This allows said adsorption! The suction pad 4 faces the wafer W which has been attracted by the S side 11 and is held horizontally in the retracted position.
1 is lowered and adsorbed, and then moved up after moving cylinder 4
3 and carry it out to the specified position.

In addition to the above-mentioned embodiment, the workpiece W to be cut is lowered and stopped in the central space of the inner peripheral blade 2, and the wafer W is suctioned and held by a suction mechanism J. Of course, the removal may be performed using a grinder that automates forward straightening and vertical movement.

〔Effect of the invention〕

According to the present invention, the workpiece is cut until a part of the dummy material is left at the upper end of the inner peripheral blade. When holding the cut piece, that is, the wafer, by suction, as described above, the wafer is held in the central space of the inner circumferential blade, so the wafer does not come into contact with the cutting blade, and there is no fear of breakage and scattering, making it safe. In addition, when the workpiece to be cut is lowered further and the remaining part of the dummy material is cut off using the lower end of the inner peripheral blade, the wafer is held by suction by the suction M mechanism, so it does not fly away and the wafer can be separated easily. can be done effectively.

In addition, when cutting off the wafer, the suction mechanism is urged upward by an appropriate pressure by a vertically movable member, so that when the member to be cut is lowered, the suction mechanism slides in synchronization, that is, follows the wafer, while adsorbing the wafer. The cutting accuracy can be improved because the cutting edge moves with the

In addition, a support base equipped with a vertically movable member that urges the suction mechanism upward is rotatably attached to a sliding table that moves back and forth, so that the suction mechanism can be adjusted to the suction position relative to the wafer.
It is possible to quickly move forward and backward from the suction position to the retreat position, which is convenient for carrying out, and there is no influence of contamination from coolant water or cutting dust that is sprayed on the inner peripheral blade, reducing the possibility of suction failure. , it became possible to increase the efficiency of taking out single wafers.

[Brief explanation of drawings]

1 to 10 relate to an embodiment of the present invention. FIG. 1 is a front view of the device showing a wafer suction and holding state, FIG. 2 is a right side view thereof, FIG. 3 is a plan view thereof, and FIG. 4 6 to 6 relate to the side of the suction 411 and the support stand, FIG. 4 is a left side view thereof, FIG. 5 is a front view, FIG. 6 is a left side view partially cut away, and FIG. 7 is a suction mechanism. , FIG. 8 is an explanatory diagram of the wafer take-out operation, FIGS. 9 and 10 are related to the take-out device, FIG. 9 is a front view, FIG. 1O is a plan view, and FIG. 11 is a conventional FIG. 1 is an annular cutting blade, 2 is an inner peripheral blade, IO is a cut piece gripping device,
11 is a suction mechanism, 12 is a support base, 13 is a vertically movable member,
31 is a sliding table, W is a member to be cut, W is a wafer, and D is a dummy material. Fig. 2 W: Mc7] Bent material w: '7 Niha No. 3 Fig. 4 Fig. 5 Fig. 9 Fig. 6

Claims (4)

[Claims] (1) In a slicing machine that sequentially cuts a workpiece to form a flaky wafer using an inner peripheral blade of a rotating annular cutting blade, the workpiece is pushed up, and the upper end of the inner peripheral blade cuts the workpiece and its A cut is made leaving a part of the dummy material attached to the bottom surface to form a wafer.
A method for taking out single wafers in a slicing machine, characterized in that the inner peripheral blade and the workpiece to be cut are returned to the central space of the inner peripheral blade where they do not overlap, and then the wafer is sucked and carried out by a suction mechanism. (2) A rotating annular cutting blade In a slicing machine that sequentially cuts a member to be cut using an inner peripheral blade to form a flaky wafer, the member to be cut is pushed up, and the bottom surface of the member is pushed up from the upper end of the inner peripheral blade. A wafer is formed by making a cut leaving a part of the dummy material to be attached to the dummy material, and then the inner peripheral blade and the workpiece to be cut are returned to the central space of the inner peripheral blade where they do not overlap, and then the suction mechanism The wafer is held by suction, and then, while maintaining the suction state by this suction mechanism, the workpiece to be cut is lowered and the remaining part of the dummy material is cut and separated by the lower end of the inner circumferential blade, and the wafer is carried out by the suction mechanism. A method for taking out single wafers in a slicing machine, characterized in that: (3) A slicing machine that cuts a member to be cut by an inner peripheral edge of a rotating annular cutting blade to form a flaky wafer, and a suction mechanism that faces the member to be cut in a central space of the inner peripheral blade. and a support base equipped with a vertically movable member that pushes up this suction mechanism at a predetermined pressure. A single wafer take-out device for a slicing machine, which is characterized by descending against the pressure. (4) The wafer single-wafer takeout device in a slicing machine according to claim 3, wherein the support table is rotatably attached to a sliding table that moves back and forth.