JPH0448681A - Electronic circuit board and its manufacturing method - Google Patents
Electronic circuit board and its manufacturing methodInfo
- Publication number
- JPH0448681A JPH0448681A JP2156182A JP15618290A JPH0448681A JP H0448681 A JPH0448681 A JP H0448681A JP 2156182 A JP2156182 A JP 2156182A JP 15618290 A JP15618290 A JP 15618290A JP H0448681 A JPH0448681 A JP H0448681A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic circuit
- ram
- microprocessor
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 238000000034 method Methods 0.000 claims description 22
- 239000000047 product Substances 0.000 description 12
- 238000007689 inspection Methods 0.000 description 10
- 239000011265 semifinished product Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 101100524645 Toxoplasma gondii ROM5 gene Proteins 0.000 description 1
- RRLHMJHRFMHVNM-BQVXCWBNSA-N [(2s,3r,6r)-6-[5-[5-hydroxy-3-(4-hydroxyphenyl)-4-oxochromen-7-yl]oxypentoxy]-2-methyl-3,6-dihydro-2h-pyran-3-yl] acetate Chemical compound C1=C[C@@H](OC(C)=O)[C@H](C)O[C@H]1OCCCCCOC1=CC(O)=C2C(=O)C(C=3C=CC(O)=CC=3)=COC2=C1 RRLHMJHRFMHVNM-BQVXCWBNSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子回路基板とその製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an electronic circuit board and a method for manufacturing the same.
基板に電子部品を実装して電子回路基板を製造し、さら
にこの電子回路基板を電子機器に組付けて調整作業等を
行なって品物(電子機器)を完成させる生産ラインでは
、工程がいくつかの段階に分かれていて、各工程毎に自
動的に段取りが行なわれ、部品が組み付けられ、調整、
検査が行なわれる。 そして、これ等の段取り、組み付
け、調整、検査等の手順を指示する工程指示情報は、生
産設備側に予め記憶又は設定されていて、生産設備側か
らの指示に従って工程毎の作業が自動的に行なわれてい
た。A production line that manufactures an electronic circuit board by mounting electronic components on a board, and then assembles this electronic circuit board into an electronic device and performs adjustment work to complete the product (electronic device) has several processes. It is divided into stages, and each process is automatically set up, parts are assembled, adjusted,
An inspection will be carried out. Process instruction information that instructs procedures such as setup, assembly, adjustment, and inspection is stored or set in advance in the production equipment, and work for each process is automatically performed according to instructions from the production equipment. It was being done.
又、発受信通信機能を付加したパレットに半製品を固定
して生産ラインに流すことも実施されていた。Additionally, semi-finished products were fixed on pallets equipped with sending/receiving communication functions and then sent to the production line.
上記従来の技術では、生産設備側に組み付け、調整、検
査等の手順を指示する工程指示情報があるため、製造す
る品物が変わると、その都度生産設備がもっている工程
指示情報を変更する必要があり、特に多品種少量生産の
場合に多大の変更工数を要するばかりでなく、多品種の
製造組立に対応できるように標準化するのに制約が大き
いという問題点があった。In the conventional technology described above, the production equipment has process instruction information that instructs procedures such as assembly, adjustment, and inspection, so whenever the product to be manufactured changes, it is necessary to change the process instruction information held by the production equipment. In particular, in the case of high-mix, low-volume production, not only does it require a large number of man-hours for changes, but there are also problems in that there are significant restrictions on standardization to support the manufacture and assembly of a wide variety of products.
又、生産時におけるその品物の検査データ等の品質情報
を、品物の完成後に知りたい場合があるが、完成品の段
階でパレットと切離されてしまうため、このような品質
情報が得られに(いという問題点があった。In addition, there are cases where you want to know the quality information such as inspection data of the product during production after the product is completed, but since the pallet is separated from the finished product, it is difficult to obtain such quality information. (There was a problem.
本発明は上記問題点を解消できる電子回路基板とその製
造方法を提案することを目的とする。An object of the present invention is to propose an electronic circuit board and a manufacturing method thereof that can solve the above problems.
〔課題を解決するための手段〕
上記目的を達成するために、本発明の電子回路基板は、
電池駆動のマイクロプロセッサ(3)を搭載した電子回
路基板であって、製造工程を指示する情報が書き込まれ
たROM又はRA M (5)と、製造工程中に発生す
る関連情報を記録するR A M (6)(7)とを具
備し、前記マイクロプロセッサ(3)はROM又はRA
M (5)に書き込まれている製造工程指示情報を電
子回路基板(1)の外部に向って発信し、かつ前記関連
情報を受信して前記RA M (6)(7)に記録する
機能を備えたことを特徴とする。[Means for Solving the Problems] In order to achieve the above object, the electronic circuit board of the present invention has the following features:
An electronic circuit board equipped with a battery-powered microprocessor (3), ROM or RAM (5) in which information instructing the manufacturing process is written, and R A that records related information generated during the manufacturing process. M (6) and (7), and the microprocessor (3) is a ROM or RA.
The function is to transmit the manufacturing process instruction information written in M (5) to the outside of the electronic circuit board (1), and to receive the related information and record it in the RAM (6) and (7). It is characterized by having
そして、本発明の電子回路基板の製造方法は、基板(2
)にマイクロプロセッサ(3)とROM又はRAM(5
)とRA M (6)(7)とを実装した半製品状態の
電子回路基板(21)に電池(4)を装着してマイクロ
プロセッサ(3)を作動状態に保ったまゝ、マイクロプ
ロセッサ(3)から発信される製造工程指示情報に基づ
いて基板(2)に他の電子部品を組付ける等の工程を実
施し、工程中に発生した関連情報をRA M (6)
(7)に書き込み記録することを特徴とする。The method for manufacturing an electronic circuit board of the present invention includes a substrate (2
) with a microprocessor (3) and ROM or RAM (5).
) and RAM (6) (7) are mounted on the semi-finished electronic circuit board (21), a battery (4) is attached to the microprocessor (3) while the microprocessor (3) is kept in an operating state. ) Processes such as assembling other electronic components onto the board (2) are carried out based on the manufacturing process instruction information sent from the RAM (6), and related information generated during the process is stored in the RAM (6).
(7) It is characterized by writing and recording.
製造工程指示情報が書き込まれたROM又はRA M
(5)と製造工程中に発生する関連情報を記録するR
A M (6) (7)とマイクロプロセッサ(3)と
を実装した半製品状態の電子回路基板(21)に電池(
4)を装着してマイクロプロセッサを作動状態にしたま
\生産ラインに流す。 生産ラインの各工程に移る都度
、マイクロプロセッサ(3)はROM又はRA M (
5)に書き込まれている製造工程指示情報を発信する。ROM or RAM in which manufacturing process instruction information is written
(5) and R to record related information generated during the manufacturing process.
A battery (21) is attached to a semi-finished electronic circuit board (21) on which A M (6) (7) and a microprocessor (3) are mounted.
4) is attached and the microprocessor is activated and sent to the production line. Each time the production line moves to each step, the microprocessor (3) loads the ROM or RAM (
Send the manufacturing process instruction information written in 5).
生産設備側はこの指示に従って部品の組み付け、調整、
検査等の作業を行ない、製造工程中に発生した検査デー
タ等の関連情報を電子回路基板に向けて送信する。 マ
イクロプロセッサはこの関連情報を受信しROM又はR
A M (5)に記録する。The production equipment side assembles, adjusts, and assembles parts according to these instructions.
Performs inspection and other work, and transmits related information such as inspection data generated during the manufacturing process to the electronic circuit board. The microprocessor receives this relevant information and stores it in ROM or R
Record in A M (5).
第1図において、1は電子回路基板で、プリント基板等
の基板2、この基板2に実装されたマイクロプロセッサ
3、このマイクロプロセッサ3を駆動する電池4、製造
工程指示情報である組み付け、調整、検査等の手順を指
示するソフトを書き込んだROM5、製造工程中に発生
した関連情報を記録した二つのRAM6と7、これ等以
外の他の電子部品であるいくつかの集積回路8、抵抗9
及びコンデンサ10等から構成されている。11は基板
9に設けられた図示されてない配線パターンのランドで
、これに電池4の正負端子が接続されている。12.1
3及び14は基板2の一面に設けた端子で、電子回路基
板1の外部に向ってマイクロプロセッサ3が製造工程指
示情報を発信し、製造工程中に発生する関連情報を受信
するための通信用の端子として使われる。 15はこの
ような通信を行なう外部の電子機器である。 この第1
図の実施例で、第1のRAM6はメーカ側の関連情報を
、第2のRAM7はユーザ側で必要とする関連情報を記
録するためのものである。 例えば電子回路基板lが電
子式水道メータに組み込まれる場合について述べると、
水道メータの器差が経年変化することを考慮して、予め
メータの器差を規格内のプラス目に調整しておくとかの
情報を第1のRAM6に記録し、客先(ユーザ)仕様に
対する検査データのような完成品になってからユーザが
知りたい情報を第2のRAM7に記録しておくというよ
うに二つのRAM6と7を使いわけている。In FIG. 1, 1 is an electronic circuit board, which includes a board 2 such as a printed circuit board, a microprocessor 3 mounted on this board 2, a battery 4 that drives this microprocessor 3, and manufacturing process instruction information such as assembly, adjustment, etc. A ROM 5 in which software that instructs procedures such as inspections is written, two RAMs 6 and 7 that record related information generated during the manufacturing process, several integrated circuits 8 that are other electronic components, and a resistor 9
and a capacitor 10, etc. Reference numeral 11 denotes a land of a wiring pattern (not shown) provided on the substrate 9, to which the positive and negative terminals of the battery 4 are connected. 12.1
3 and 14 are terminals provided on one side of the board 2, which are used for communication by which the microprocessor 3 transmits manufacturing process instruction information to the outside of the electronic circuit board 1 and receives related information generated during the manufacturing process. used as a terminal. 15 is an external electronic device that performs such communication. This first
In the illustrated embodiment, the first RAM 6 is used to record related information on the manufacturer's side, and the second RAM 7 is used to record related information required on the user's side. For example, if the electronic circuit board l is incorporated into an electronic water meter,
Considering that the water meter difference changes over time, information such as adjusting the water meter difference to a plus point within the standard is recorded in the first RAM 6, and the information is recorded in the first RAM 6, and the information is adjusted to the customer's (user) specifications. The two RAMs 6 and 7 are used selectively so that information that the user wants to know after the finished product, such as inspection data, is recorded in the second RAM 7.
なお、電子回路基板1と外部の電子機器15との間の接
続は、第1図の端子12〜14の代りに光等の無接触に
よる接続方式を用いてもよい。 又、ROM5の代りに
RAMを用いてもよい。Note that for the connection between the electronic circuit board 1 and the external electronic device 15, a non-contact connection method such as an optical connection may be used instead of the terminals 12 to 14 shown in FIG. Also, a RAM may be used instead of the ROM5.
第2図は本発明の電子回路基板の製造方法を実施する場
合の製造工程の一例で、20は製造ラインの設備で、2
1は前記電子回路基板の半製品で、符号20a、 20
b、 20cで示す工程1.工程2.工程3と移動する
につれて完成される。 半製品21の段階では、前述の
基板2に、マイクロプロセッサ3゜電池4.製造工程指
示情報を書き込んだROM又はRAM5、製造工程中に
発生した関連情報を記録する二つのRAM6と7とが装
着されている。FIG. 2 shows an example of the manufacturing process when carrying out the method of manufacturing an electronic circuit board of the present invention, in which 20 is manufacturing line equipment;
1 is a semi-finished product of the electronic circuit board, and symbols 20a and 20
b, Step 1 as shown in 20c. Step 2. It will be completed as you move on to step 3. At the stage of the semi-finished product 21, a microprocessor 3, a battery 4. A ROM or RAM 5 in which manufacturing process instruction information is written and two RAMs 6 and 7 that record related information generated during the manufacturing process are installed.
マイクロプロセッサ3はこの状態で作動状態にされてい
る。 電子回路基板の半製品21が符号20aで示す工
程lに移動されると、マイクロプロセッサ3が外部から
リセットされると同時にソフトが働き、ROM又はRA
M5に書き込まれている製造工程指示情報に従って電子
部品のコンデンサ10等を設備20(1Nから供給して
基板2に実装する。The microprocessor 3 is activated in this state. When the semi-finished product 21 of the electronic circuit board is moved to the step 1 indicated by the reference numeral 20a, the microprocessor 3 is reset from the outside and at the same time the software is activated to reset the ROM or RA.
Electronic components such as the capacitor 10 are supplied from the equipment 20 (1N) and mounted on the board 2 according to the manufacturing process instruction information written in M5.
このとき、基板2の何番と何番のランドにコンデンサ1
0を実装するかという製造工程指示情報はROM又はR
AM5に書き込まれていた情報がマイクロプロセッサ3
により基板2の前記端子12.13゜14を介して設備
20側に発信指示する。 工程1で、電子回路基板に電
子部品が実装されると、電子回路基板側からの製造工程
指示情報に従って電子回路基板の調整とか検査が行なわ
れ、その結果の品質情報が設備20から、電子回路基板
の前記端子12゜13、14を経てマイクロプロセッサ
3に通信され、RAM6又は7に記録される。 なお第
2図において、工程1に示す三つの矢印A、B、Cは、
それぞれ、基板から設備20への製造工程の指示と、設
備20から基板への部品供給及び調整・検査作業の実施
と、設備20から基板へのRAM6.7に記録されるべ
き情報の流れとを示す、半製品21は、さらに、順に符
号20b、 20cで示す工程2と工程3に送られ、よ
り完成される。 そしてこれらの工程でも、設備20は
矢印Aで示す半製品からの指示を受けて、矢印Bで示す
作業を実施し、その工程中に発生した関連情報を矢印C
に従って基板のRAM6とか7に記録する。 こうして
決められた工程を終了すると製品が完成する。完成品か
らはいつでも品質管理情報や、ユーザ仕様に対する検査
成績データ等を取り出すことができる。At this time, capacitor 1 is placed on which land and which land on board 2.
The manufacturing process instruction information regarding whether to implement 0 is stored in ROM or R.
The information written in AM5 is transferred to microprocessor 3.
This instructs the equipment 20 to transmit via the terminals 12, 13, 14 of the board 2. In process 1, when electronic components are mounted on the electronic circuit board, the electronic circuit board is adjusted and inspected according to the manufacturing process instruction information from the electronic circuit board side, and the resulting quality information is sent from the equipment 20 to the electronic circuit board. The information is communicated to the microprocessor 3 via the terminals 12, 13 and 14 of the board, and recorded in the RAM 6 or 7. In addition, in FIG. 2, the three arrows A, B, and C shown in step 1 are
They respectively instruct the manufacturing process from the board to the equipment 20, supply parts from the equipment 20 to the board and perform adjustment/inspection work, and flow of information to be recorded in the RAM 6.7 from the equipment 20 to the board. The semi-finished product 21 shown is further sent to steps 2 and 3, indicated by reference numerals 20b and 20c, to be further completed. In these processes as well, the equipment 20 receives instructions from the semi-finished product shown by arrow A, performs the work shown by arrow B, and records related information generated during the process by arrow C.
Accordingly, it is recorded in RAM 6 or 7 of the board. Once the determined steps are completed, the product is completed. Quality control information and inspection result data based on user specifications can be extracted from the finished product at any time.
〔発明の効果]
本発明の電子回路基板は上述のように構成されているの
で、半製品や完成品を調査することで、ROMやRAM
に記録されている工程9品質、仕様等の情報が得られる
。[Effects of the Invention] Since the electronic circuit board of the present invention is configured as described above, by investigating semi-finished products and finished products, it is possible to determine whether the ROM or RAM is
Information on process 9 quality, specifications, etc. recorded in the process can be obtained.
又、半製品や完成品のROM又はRA M (5)に製
造工程指示情報等のソフトが書き込まれているので、製
造ラインの各工程における作業指示がこれ等のソフトか
ら得られる。 従って、設備側に多種類の製品毎の製造
工程指示情報を用意する必要がない。Further, since software such as manufacturing process instruction information is written in the ROM or RAM (5) of semi-finished products and finished products, work instructions for each process on the manufacturing line can be obtained from this software. Therefore, there is no need to prepare manufacturing process instruction information for each of many types of products on the equipment side.
第1図は本発明の電子回路基板の平面図、第2図は本発
明の電子回路基板の製造方法を実施する製造ラインの略
図である。
1・・・電子回路基板、2・・・基板、3・・・マイク
ロプロセッサ、4・・・電池、5・・ROM、6.7・
・・RAM、21・・・手製ロロFIG. 1 is a plan view of an electronic circuit board of the present invention, and FIG. 2 is a schematic diagram of a manufacturing line for implementing the method of manufacturing an electronic circuit board of the present invention. DESCRIPTION OF SYMBOLS 1... Electronic circuit board, 2... Board, 3... Microprocessor, 4... Battery, 5... ROM, 6.7.
...RAM, 21...Handmade Rolo
Claims (2)
子回路基板であって、製造工程を指示する情報が書き込
まれたROM又はRAM(5)と、製造工程中に発生す
る関連情報を記録するRAM(6)(7)とを具備し、
前記マイクロプロセッサ(3)はROM又はRAM(5
)に書き込まれている製造工程指示情報を電子回路基板
(1)の外部に向って発信し、かつ前記関連情報を受信
して前記RAM(6)(7)に記録する機能を備えたこ
とを特徴とする電子回路基板。1. An electronic circuit board equipped with a battery-powered microprocessor (3), which includes a ROM or RAM (5) in which information instructing the manufacturing process is written, and a RAM (6) that records related information generated during the manufacturing process. )(7),
The microprocessor (3) has a ROM or a RAM (5).
) has a function of transmitting the manufacturing process instruction information written in the electronic circuit board (1) to the outside of the electronic circuit board (1), and receiving the related information and recording it in the RAM (6) (7). Characteristic electronic circuit board.
はRAM(5)とRAM(6)(7)とを実装した半製
品状態の電子回路基板(21)に電池(4)を装着して
マイクロプロセッサ(3)を作動状態に保ったまゝ、マ
イクロプロセッサ(3)から発信される製造工程指示情
報に基づいて基板(2)に他の電子部品を組付ける等の
工程を実施し、工程中に発生した関連情報をRAM(6
)(7)に書き込み記録することを特徴とする電子回路
基板の製造方法。2. A microprocessor is constructed by mounting a battery (4) on a semi-finished electronic circuit board (21) in which a microprocessor (3) and ROM or RAM (5) and RAM (6) and (7) are mounted on a board (2). (3) is kept in an operating state, processes such as assembling other electronic components to the board (2) are carried out based on the manufacturing process instruction information sent from the microprocessor (3), and any problems that occur during the process are performed. related information is stored in RAM (6
) A method for manufacturing an electronic circuit board, characterized by writing and recording on (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2156182A JPH0448681A (en) | 1990-06-13 | 1990-06-13 | Electronic circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2156182A JPH0448681A (en) | 1990-06-13 | 1990-06-13 | Electronic circuit board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448681A true JPH0448681A (en) | 1992-02-18 |
Family
ID=15622153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2156182A Pending JPH0448681A (en) | 1990-06-13 | 1990-06-13 | Electronic circuit board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448681A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004019670A1 (en) * | 2002-08-23 | 2004-03-04 | Fuji Machine Mfg. Co., Ltd. | Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| JP2006278815A (en) * | 2005-03-30 | 2006-10-12 | Hitachi Kokusai Electric Inc | Mounting board |
| US7643282B2 (en) | 2006-03-20 | 2010-01-05 | Fujitsu Limited | Electronic apparatus and unit |
-
1990
- 1990-06-13 JP JP2156182A patent/JPH0448681A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004019670A1 (en) * | 2002-08-23 | 2004-03-04 | Fuji Machine Mfg. Co., Ltd. | Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| JP2006278815A (en) * | 2005-03-30 | 2006-10-12 | Hitachi Kokusai Electric Inc | Mounting board |
| US7643282B2 (en) | 2006-03-20 | 2010-01-05 | Fujitsu Limited | Electronic apparatus and unit |
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