JPH0449313U - - Google Patents
Info
- Publication number
- JPH0449313U JPH0449313U JP9233490U JP9233490U JPH0449313U JP H0449313 U JPH0449313 U JP H0449313U JP 9233490 U JP9233490 U JP 9233490U JP 9233490 U JP9233490 U JP 9233490U JP H0449313 U JPH0449313 U JP H0449313U
- Authority
- JP
- Japan
- Prior art keywords
- foil layer
- copper foil
- base film
- film
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 6
- 239000013039 cover film Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Description
第１図は本考案に係る磁気ヘツド装置の概略構
成図、第２図はそのフレキシブル基板の一部断面
した要部平面図、第３図はさらに他の実施例を示
す一部断面した要部平面図で、第４図は従来例を
示す一部断面した要部平面図である。
５……磁気ヘツド装置、６……シンバル、７…
…磁気ヘツド部、８……端子、９，１５……フレ
キシブル基板、１０，１６……ベースフイルム、
１１，１７……第１の銅箔層、１１ａ，１７ａ…
…配線パターン、１２，１８……第２の銅箔層、
１３，１４，１９，２１，２２……カバーフイル
ム、２０……第３の銅箔層。
FIG. 1 is a schematic configuration diagram of a magnetic head device according to the present invention, FIG. 2 is a plan view of a partially sectional main part of the flexible substrate, and FIG. 3 is a partially sectional main part showing another embodiment. FIG. 4 is a partially sectional plan view of the main part of a conventional example. 5...Magnetic head device, 6...Cymbal, 7...
...Magnetic head part, 8...Terminal, 9, 15...Flexible board, 10, 16...Base film,
11, 17...first copper foil layer, 11a, 17a...
... Wiring pattern, 12, 18 ... Second copper foil layer,
13, 14, 19, 21, 22... cover film, 20... third copper foil layer.
Claims (1)
ル基板において、該フレキシブル基板は、ベース
フイルムと、該ベースフイルムに配設された信号
用配線パターンを形成する第１の銅箔層と、該第
１の銅箔層の少なくとも一側面に該ベースフイル
ム若しくはカバーフイルムを介して配設されたノ
イズカツト用の第２の銅箔層と、該第２の銅箔層
をカバーするカバーフイルムとから構成されたこ
とを特徴とする磁気ヘツドのフイルム基板。 A flexible substrate conductively connected to a terminal of a magnetic head includes a base film, a first copper foil layer forming a signal wiring pattern disposed on the base film, and a first copper foil layer disposed on the base film. The second copper foil layer for noise cutting is disposed on at least one side of the foil layer via the base film or the cover film, and the cover film covers the second copper foil layer. The film substrate of the magnetic head is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9233490U JPH0449313U (en) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9233490U JPH0449313U (en) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0449313U true JPH0449313U (en) | 1992-04-27 |
Family
ID=31828699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9233490U Pending JPH0449313U (en) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449313U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188016A (en) * | 1986-02-13 | 1987-08-17 | Yokogawa Electric Corp | Wiring connection device for magnetic disk |
-
1990
- 1990-08-31 JP JP9233490U patent/JPH0449313U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188016A (en) * | 1986-02-13 | 1987-08-17 | Yokogawa Electric Corp | Wiring connection device for magnetic disk |