JPH0449610A - Bush for bead core and packaging method of bead core - Google Patents

Bush for bead core and packaging method of bead core

Info

Publication number
JPH0449610A
JPH0449610A JP2158735A JP15873590A JPH0449610A JP H0449610 A JPH0449610 A JP H0449610A JP 2158735 A JP2158735 A JP 2158735A JP 15873590 A JP15873590 A JP 15873590A JP H0449610 A JPH0449610 A JP H0449610A
Authority
JP
Japan
Prior art keywords
bead core
diameter part
center hole
bush
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2158735A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Takada
充裕 高田
Mitsuhisa Tsumura
津村 光恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FDK Corp
Original Assignee
FDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FDK Corp filed Critical FDK Corp
Priority to JP2158735A priority Critical patent/JPH0449610A/en
Publication of JPH0449610A publication Critical patent/JPH0449610A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE:To enable simple execution of an operation of packaging a bead core on a printed wiring board and complete attainment of insulation by having integrally a small-diameter part fitted elastically in the center hole of the bead core and retained in the hole and a large-diameter part joining coaxially to one end of the small-diameter part and by forming a center hole through which an electric line pierces. CONSTITUTION:A bush 2 is constructed of an electrically insulative elastic material such as rubber and has integrally a small-diameter part 2a having an outside diameter making it possible for the part to be fitted elastically in the center hole 1a of a bead core 1 and retained in the hole 1a and having substantially the same length as the core and a large- diameter part 2b being continuous in the shape of a flange to one end of the small-diameter part 2a coaxially, while a center hole 2a through which an electric line pierces is formed in the centers of these parts. When the bead core 1 is fitted to a lead frame 3a of a circuit element 3 by using the bush 2 for the bead core, first the small-diameter part 2a of the bush 2 is pushed into the center hole 1a of the bead core 1, so that the two components be integrated. Then, the lead frame 3a is pushed into the center hole 2c of the bush 2 from the side of the small-diameter part 2a, in respect to the bead core 1 with the bush 2, and the fore end side of the lead frame 3a is made to pierce through the side of the large-diameter part 2b and project therefrom.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、電気回路の線路を貫通させてノイズを防止
するために用いる小さな円筒形磁性体からなるビーズコ
アを実装する際に用いるブツシュとそのブツシュを用い
た実装方法に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a bushing used in mounting a bead core made of a small cylindrical magnetic material used to prevent noise by penetrating the lines of an electric circuit. This article relates to a mounting method using a bush.

(従来の技術) 例えばトランジスタやダイオード等の半導体素子やコネ
クタなどの電気回路部品をプリント配線基板に実装する
際に、これら回路部品のリードフレームにビーズコアを
嵌め込み、このビーズコアを貫通したリードフレームの
先端部分をプリント配線基板に接続するようにしたノイ
ズ防止方法が知られている。
(Prior art) For example, when mounting semiconductor elements such as transistors and diodes, and electric circuit components such as connectors on a printed wiring board, bead cores are fitted into the lead frames of these circuit components, and the tips of the lead frames that pass through the bead cores. A noise prevention method is known in which a part is connected to a printed wiring board.

このようにビーズコアを用いる場合、アモルファス磁性
体などからなるビーズコアの表面に絶縁層をコーティン
グしておき、トランジスタやコネクタ等の回路部品をプ
リント配線基板に実装する際にまずビーズコアをリード
フレームに取付け、ビーズコア付きの部品をプリント配
線基板に挿入することになる。
When using a bead core in this way, the surface of the bead core made of amorphous magnetic material is coated with an insulating layer, and when mounting circuit components such as transistors and connectors on a printed wiring board, the bead core is first attached to a lead frame. The component with the bead core will be inserted into the printed wiring board.

(発明が解決しようとする課題) 前記のような従来のビーズコア実装方法では、まずコア
表面に絶縁層をコーティングするという面倒な工程が必
要で、絶縁が完全でないとビーズコアを介してショート
事故を起こすおそれがあるという問題があった。
(Problem to be solved by the invention) The conventional bead core mounting method as described above first requires a troublesome process of coating the core surface with an insulating layer, and if the insulation is not perfect, short circuits may occur through the bead core. There was a problem that there was a risk.

また、ビーズコアを回路部品のリードフレームに嵌め込
んでも、コアをリードフレームに保持しておく手段がな
いので、リードフレームの先端を下向きにしてプリント
配線基板に取付ける場合、手指でコアを押えておかない
とビーズコアが落下してしまう。そのためビーズコア付
きの回路部品をプリント配線基板に挿入する作業が非常
に面倒なものになっていた。
In addition, even if a bead core is fitted into a lead frame of a circuit component, there is no way to hold the core in the lead frame, so when attaching it to a printed wiring board with the tip of the lead frame facing downward, hold the core with your fingers. If not, the bead core will fall off. Therefore, the work of inserting the circuit component with the bead core into the printed wiring board has become extremely troublesome.

この発明は前述した従来の問題点に鑑みなされたもので
、その目的は、ビーズコアを回路部品のリードフレーム
などに取付けてプリント配線基板に実装する作業が簡単
に行なえるとともに、貫通する導体との絶縁も完全に取
れるようにしたビーズコア用ブツシュおよびそれを用い
たビーズコア実装方法を提供することにある。
This invention was made in view of the conventional problems mentioned above, and its purpose is to easily attach the bead core to the lead frame of a circuit component and mount it on a printed wiring board, and to make it easier to attach the bead core to the lead frame of a circuit component and to mount it on a printed wiring board. An object of the present invention is to provide a bead core bushing that can be completely insulated and a bead core mounting method using the bushing.

(課題を解決するための手段) この発明に係るビーズコア用ブツシュは、電気絶縁性の
弾性材からなり、ビーズコアの中心穴に弾性的に嵌合し
て穴内に保持される外径で前記コアとほぼ等しい長さの
小径部と、この小径部の一端に同軸に連結している大径
部とを一体に有し、これらの中心に電気線路が貫通する
中心穴が形成されたものである。
(Means for Solving the Problems) The bead core bushing according to the present invention is made of an electrically insulating elastic material, and has an outer diameter that elastically fits into the center hole of the bead core and is held in the hole. It integrally has a small diameter part of approximately equal length and a large diameter part coaxially connected to one end of the small diameter part, and a center hole is formed in the center of these parts through which the electric line passes.

また、このビーズコア用ブツシュを用い、まずブツシュ
の前記小径部を前記ビーズコアの中心穴に弾性的に嵌合
して両者を一体化し、そのブツシュの前記中心穴に前記
小径部の側から回路部品のリードフレームを弾性的に貫
通させ、このリードフレームの貫通した先端部を配線基
板に接続するようにした。
Also, using this bead core bushing, first elastically fit the small diameter part of the bushing into the center hole of the bead core to integrate the two, and then insert the circuit component into the center hole of the bushing from the small diameter part side. The lead frame is elastically penetrated, and the penetrating tip of the lead frame is connected to the wiring board.

(作 用) 前記ブツシュの小径部を前記ビーズコアの中心穴に弾性
的に嵌合することで両者が一体的に保持され、コアの中
心穴内周がブツシュでもって完全に絶縁された状態にな
る。そして前記ブツシュ付きのビーズコアに対して前記
ブツシュの小径部側からその中心穴に回路部品のリード
フレームを弾性的に挿入すると、前記ブツシュの弾性力
でもってリードフレームに対してブツシュおよびビーズ
コアが一体的に保持され、手指でこれらを押えていなく
ても落下することはない。
(Function) By elastically fitting the small diameter portion of the bushing into the center hole of the bead core, both are held integrally, and the inner periphery of the center hole of the core is completely insulated by the bush. When a lead frame of a circuit component is elastically inserted into the center hole of the bead core with the bushing from the small diameter side of the bushing, the bushing and bead core are integrally connected to the lead frame by the elastic force of the bushing. , and will not fall even if you do not hold them down with your fingers.

(実施例) 第1図は本発明の一実施例によるビーズコア用ブツシュ
とその利用形態を示している。図において、1は小さな
円筒形のアモルファス磁性体製のビーズコアであり、2
は本発明によるビーズコア用ブツシュ、3はビーズコア
1の取付対象物であるトランジスタ等の回路部品を示し
ている。
(Example) FIG. 1 shows a bead core bushing and its usage according to an example of the present invention. In the figure, 1 is a small cylindrical bead core made of amorphous magnetic material, and 2
3 indicates a bead core bushing according to the present invention, and 3 indicates a circuit component such as a transistor to which the bead core 1 is attached.

ブツシュ2はゴムなどの電気絶縁性の弾性材からなり、
ビーズコア1の中心穴1aに弾性的に嵌合して穴la内
に保持される外径(穴1aの内径より若干大きい)でコ
ア1とほぼ等しい長さの小径部2aと、小径部2aの一
端にフランジ状に同軸に連続している大径部2bとを一
体に有し、これらの中心に電気線路が貫通する中心穴2
cが形成されている。小径部2aと大径部2bとのりな
ぎ目はテーパー状の曲面になっており、小径部2aをビ
ーズコア1の中心穴1aに完全に押し込んだ状態では、
小径部2aの先端がコア1の端面にわずかに出る程度の
寸法になっている。また、大径部2bはビーズコア1の
外径とほぼ同じ寸法になってる。さらに、中心穴2cの
内径は取付対象である回路素子3のリードフレーム3a
の幅より少し小さく設定しておく。
The bushing 2 is made of an electrically insulating elastic material such as rubber.
A small diameter portion 2a having an outer diameter (slightly larger than the inner diameter of the hole 1a) and approximately the same length as the core 1, which elastically fits into the center hole 1a of the bead core 1 and is held within the hole la; A central hole 2 that integrally has a large diameter portion 2b coaxially continuous in the form of a flange at one end, and an electric line passes through the center of the large diameter portion 2b.
c is formed. The joint between the small diameter part 2a and the large diameter part 2b is a tapered curved surface, and when the small diameter part 2a is completely pushed into the center hole 1a of the bead core 1,
The size is such that the tip of the small diameter portion 2a slightly protrudes from the end surface of the core 1. Further, the large diameter portion 2b has approximately the same size as the outer diameter of the bead core 1. Furthermore, the inner diameter of the center hole 2c is the lead frame 3a of the circuit element 3 to be mounted.
Set it slightly smaller than the width of .

以上のように構成されたビーズコア用ブツシュ2を用い
てビーズコア1を回路素子3のリードフレーム3aに取
付ける場合、まずビーズコア1の中心穴1aにブツシュ
2の小径部2aを押し込んで両部品を一体化する。次に
、ブツシュ2の付いたビーズコア1に対し、リードフレ
ーム3aをブツシュ2の中心穴2cに小径部2aの側か
ら押し込み、リードフレーム3aの先端側を大径部2b
の側に貫通させて突出させる。この状態でビーズコア1
およびブツシュ2を押えている必要はなく、ブツシュ2
の弾性力でリードフレーム3aにコア1およびブツシュ
2が保持されている。この後ビ−ズコア1の付いた回路
素子3をプリント配線基板(図示省略)に実装するので
あるが、そのときリードフレーム3aの先端側を下向き
にして基板への挿入作業を行なっても従来のようにコア
1が落下してしまうことはない。従って自動挿入機も使
用することができる。
When attaching the bead core 1 to the lead frame 3a of the circuit element 3 using the bead core bushing 2 configured as described above, first push the small diameter part 2a of the bushing 2 into the center hole 1a of the bead core 1 to integrate both parts. do. Next, for the bead core 1 with the bushing 2 attached, push the lead frame 3a into the center hole 2c of the bushing 2 from the small diameter part 2a side, and insert the tip side of the lead frame 3a into the large diameter part 2b.
Make it penetrate and protrude from the side. In this state, bead core 1
And it is not necessary to hold down Bush 2, but Bush 2
The core 1 and the bushing 2 are held on the lead frame 3a by the elastic force. After this, the circuit element 3 with the bead core 1 attached is mounted on a printed wiring board (not shown), but at that time, it is possible to insert the lead frame 3a into the board with the tip end facing downward, as compared to the conventional method. Core 1 will not fall like this. Automatic insertion machines can therefore also be used.

なお本発明のビーズコア用ブツシュ2はトランジスタ等
の回路素子にビーズコアを装着する際にのみ適用される
ものではなく、被覆導線や裸の導線などの電気回路の線
路にビーズコアを装着する際に適用しても良く、その場
合にもコアが線路上の所定位置に安定に保持させること
ができるとともに線路との間を完全に絶縁することがで
きる。
The bead core bushing 2 of the present invention is not only applicable to attaching bead cores to circuit elements such as transistors, but also to attaching bead cores to electrical circuit lines such as covered conductors and bare conductors. In that case as well, the core can be stably held at a predetermined position on the line and can be completely insulated from the line.

(発明の効果) 以上詳細に説明したように、この発明に係るビーズコア
用ブツシュを用いることで、トランジスタ等の回路素子
のリードフレームにビーズコアを装着してプリント配線
基板に実装するような作業が非常に簡単に能率良く行な
えるようになるとともに、コア表面に絶縁層をコーティ
ングしなくてもコアとリードフレームとの間およびコア
と配線基板との間を前記ブツシュによって確実に絶縁す
ることができる。
(Effects of the Invention) As explained in detail above, by using the bead core bushing according to the present invention, the work of attaching the bead core to the lead frame of a circuit element such as a transistor and mounting it on a printed wiring board is greatly simplified. This can be done simply and efficiently, and the bushing can reliably insulate between the core and the lead frame and between the core and the wiring board without coating the surface of the core with an insulating layer.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例によるビーズコア用ブツシュ
の構造とその利用形態の一例を示す斜視図である。 1・・・・・・ビーズコア 1a・・・中心穴 2・・・・・・ブツシュ 2a・・・小径部 2b・・・大径部 2C・・・中心穴 3・・・・・・回路部品 3a・・・リードフレーム
FIG. 1 is a perspective view showing the structure of a bead core bushing according to an embodiment of the present invention and an example of its usage. 1...Bead core 1a...Center hole 2...Bushing 2a...Small diameter part 2b...Large diameter part 2C...Center hole 3...Circuit parts 3a...Lead frame

Claims (2)

【特許請求の範囲】[Claims] (1)電気絶縁性の弾性材からなり、ビーズコアの中心
穴に弾性的に嵌合して穴内に保持される外径で前記コア
とほぼ等しい長さの小径部と、この小径部の一端に同軸
に連結している大径部とを一体に有し、これらの中心に
電気線路が貫通する中心穴が形成されたビーズコア用ブ
ッシュ。
(1) A small diameter part made of an electrically insulating elastic material, which elastically fits into the center hole of the bead core and is held in the hole, and has an outer diameter and approximately the same length as the core, and one end of this small diameter part. A bush for bead cores that has a large diameter part that is coaxially connected, and a center hole is formed in the center of these parts, through which an electric line passes.
(2)請求項1に記載のブッシュの前記小径部を前記ビ
ーズコアの中心穴に弾性的に嵌合して両者を一体化し、
そのブッシュの前記中心穴に前記小径部の側から回路部
品のリードフレームを弾性的に貫通させ、このリードフ
レームの貫通した先端部を配線基板に接続するようにし
たビーズコア実装方法。
(2) elastically fitting the small diameter portion of the bushing according to claim 1 into the center hole of the bead core to integrate the two;
A bead core mounting method in which a lead frame of a circuit component is elastically passed through the center hole of the bushing from the small diameter portion side, and the penetrating tip of the lead frame is connected to a wiring board.
JP2158735A 1990-06-19 1990-06-19 Bush for bead core and packaging method of bead core Pending JPH0449610A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2158735A JPH0449610A (en) 1990-06-19 1990-06-19 Bush for bead core and packaging method of bead core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2158735A JPH0449610A (en) 1990-06-19 1990-06-19 Bush for bead core and packaging method of bead core

Publications (1)

Publication Number Publication Date
JPH0449610A true JPH0449610A (en) 1992-02-19

Family

ID=15678188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2158735A Pending JPH0449610A (en) 1990-06-19 1990-06-19 Bush for bead core and packaging method of bead core

Country Status (1)

Country Link
JP (1) JPH0449610A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reduction element and semiconductor circuit element using the same
JP2010147481A (en) * 1998-03-30 2010-07-01 Toshiba Corp Noise reducing element, and semiconductor circuit element using the same
JP2012104556A (en) * 2010-11-08 2012-05-31 Kitagawa Ind Co Ltd Noise countermeasure component
JP2017112323A (en) * 2015-12-18 2017-06-22 北川工業株式会社 Noise countermeasure component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reduction element and semiconductor circuit element using the same
JP2010147481A (en) * 1998-03-30 2010-07-01 Toshiba Corp Noise reducing element, and semiconductor circuit element using the same
JP2012104556A (en) * 2010-11-08 2012-05-31 Kitagawa Ind Co Ltd Noise countermeasure component
JP2017112323A (en) * 2015-12-18 2017-06-22 北川工業株式会社 Noise countermeasure component

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