JPH02205385A - Large current substrate device - Google Patents

Large current substrate device

Info

Publication number
JPH02205385A
JPH02205385A JP2532889A JP2532889A JPH02205385A JP H02205385 A JPH02205385 A JP H02205385A JP 2532889 A JP2532889 A JP 2532889A JP 2532889 A JP2532889 A JP 2532889A JP H02205385 A JPH02205385 A JP H02205385A
Authority
JP
Japan
Prior art keywords
lead terminal
bus bar
circuit element
diameter lead
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2532889A
Other languages
Japanese (ja)
Other versions
JPH0777285B2 (en
Inventor
Einosuke Adachi
栄之資 足立
Takashi Takahama
高浜　隆
Hiroyuki Nakajima
博行 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2532889A priority Critical patent/JPH0777285B2/en
Publication of JPH02205385A publication Critical patent/JPH02205385A/en
Publication of JPH0777285B2 publication Critical patent/JPH0777285B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To improve reliability of electric connection and mechanical strength by adhering the small-diameter lead terminal of a circuit element to the bar ring of a bus bar via solder interposed in a gap therebetween. CONSTITUTION:A substrate 6 having insertion through holes 7, and a bar ring 21 having a length not exceeding the depth of the through hole 7 are provided. The ring 21 is disposed at the opposite side to the bus bar 1 via the bus bar 1 and the substrate 6 to be engaged by inserting it into the through hole 7, and a small-diameter lead terminal 42 at the end side is inserted into the ring 21 via a gap. A circuit element 3 in which a large-diameter lead terminal 41 of a root side is abutted against the substrate 6 and a solder 9 for adhering the terminal 42 to the ring 21 via a gap are provided. Thus, the reliability of an electric connection and mechanical strength are improved to conduct a large current low impedance, and productivity can be improved.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、大電流基板装置に関し、特に回路素子およ
びバスバーの固定方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a large current board device, and particularly to a method for fixing circuit elements and bus bars.

［従来の技術］ 第２図は、例えば実開昭５５−７７８８２号公報に示さ
れた従来の大電流基板装置の要部の構成を示す断面図で
ある０図において、（１）はバスバ（２）はバスバー（
，１）のバーリング部、（３）は回路素子、（４）はリ
ード端子、（５）はバーリング部（２）の透孔、（６）
は基板、（７）は基板（６）の挿入透孔、（８）は基板
（６）とバスバー（１）間に介在する鋼箔パターン、（
９）は半田である。[Prior Art] FIG. 2 is a sectional view showing the configuration of the main parts of a conventional large current board device disclosed in, for example, Japanese Utility Model Application Publication No. 55-77882. 2) is the bus bar (
, 1) burring part, (3) is the circuit element, (4) is the lead terminal, (5) is the burring part (2) through hole, (6)
(7) is the insertion hole of the board (6), (8) is the steel foil pattern interposed between the board (6) and the bus bar (1), (
9) is solder.

基板（６）の挿入透孔（７）にはバスバー（１）のバー
リング部（２）が挿入されている。このバーリング部（
２）の透孔（５）には回路素子（３）のリード端子（４
）が挿入され、溶融半田（９）によって半田付けされ、
バスバー（１）とリード端子（４）の電気的接続が行な
われている。The burring portion (2) of the bus bar (1) is inserted into the insertion hole (7) of the substrate (6). This burring part (
The lead terminal (4) of the circuit element (3) is inserted into the through hole (5) of 2).
) is inserted and soldered with molten solder (9),
Electrical connection is made between the bus bar (1) and the lead terminal (4).

第２図から明らかなように、回路素子（３）のリード端
子（４）はバーリング部（２）で直接バスパー（１）と
接続されているので、その導通路の電気インピーダンス
を低減することができる。As is clear from Fig. 2, the lead terminal (4) of the circuit element (3) is directly connected to the busper (1) at the barring part (2), so it is possible to reduce the electrical impedance of the conduction path. can.

［発明が解決しようとする課題］ 従来の大電流基板装置は以上のように構成されているの
で、バスバー（１）のバーリング部（２）が各リード端
子（４）との半田付は性を良くするためにテーパー状と
なっており、テーパーの先端付近で半田付けしている。[Problems to be Solved by the Invention] Since the conventional high-current board device is configured as described above, it is difficult to solder the bar ring portion (2) of the bus bar (1) to each lead terminal (4). It has a tapered shape to make it better, and it is soldered near the tip of the taper.

このため、バスバー（１）と半田（幻との電気的接続の
信頼性が悪く、インピーダンスの低減にも限界がある。For this reason, the reliability of the electrical connection between the bus bar (1) and the solder is poor, and there is a limit to the reduction of impedance.

また、このようなバスバー（１）の形状や固定方法では
機械的にも弱く、大電流を流すのに不向きである。さら
に、バスバー（１）は基板（６）に鋼箔パターン（８）
を介して半田付は固定されているが、バスバー（１）を
固定する目的のみで鋼箔パターン（８）を形成すること
は、作業が面倒で工程が長くなり、製造コストの低減に
も逆行するものであるなどの問題点があった。Furthermore, the shape and fixing method of the bus bar (1) is mechanically weak and unsuitable for passing a large current. Furthermore, the busbar (1) has a steel foil pattern (8) on the substrate (6).
Although the soldering is fixed through the bus bar (1), forming the steel foil pattern (8) only for the purpose of fixing the bus bar (1) is cumbersome and lengthens the process, and goes against the reduction of manufacturing costs. There were problems such as the fact that the

この発明は上記のような問題点を解消するためになされ
たもので、電気的接続の信頼性および機械的強度が向上
して大電流低インピーダンスの通電が可能で、しかも生
産性の向上した大電流基板装置を得ることを目的とする
。This invention was made in order to solve the above problems, and it is possible to improve the reliability and mechanical strength of electrical connections, to enable the conduction of large currents and low impedance, and to improve productivity. The purpose is to obtain a current substrate device.

［課題を解決するための手段］ この発明に係る大電流基板装置は、挿入透孔な有する基
板、バーリング長さが上記挿入透孔の深さを越えないバ
ーリング部を有し、このバーリング部が上記挿入透孔に
挿入されて嵌合するバスバー、上記基板を介してバスバ
ーと反対側に配置され、先端側の小径リード端子が上記
バーリング部に間隙を介して挿入されるとともに根本側
の大径リード端子が上記基板に当接する回路素子、およ
び上記間隙に介在し上記小径リード端子と上記バーリン
グ部とを接合する半田を備えたものである。[Means for Solving the Problems] A large current board device according to the present invention has a board having an insertion hole, a burring portion whose burring length does not exceed the depth of the insertion hole, and the burring portion has a A bus bar that is inserted and fitted into the insertion through hole is placed on the opposite side of the bus bar through the board, and the small diameter lead terminal on the tip side is inserted into the bar ring part through a gap, and the large diameter on the base side. The device includes a circuit element whose lead terminal contacts the substrate, and solder which is interposed in the gap and joins the small-diameter lead terminal and the burring portion.

［イ乍用］ この発明においては、回路素子の小径リード端子とバス
バーのバーリング部とが両者の間隙に介在する半田によ
り接合され、回路素子は大径リード端子とバスバーとで
基板を挟んで強固に固定されるので、機械的強度および
電気的接続の信頼性が非常に向上し、電気インピーダン
スを低減し、大電流を流すことができる。さらに、バス
バーを基板に固定するための銅箔パターンは不要となる
ので、作業が簡素化されて生産性が著しく向上し、用途
拡大が可能となる。[For use] In this invention, the small-diameter lead terminal of the circuit element and the bar ring part of the bus bar are joined by solder interposed in the gap between them, and the circuit element is firmly held by sandwiching the board between the large-diameter lead terminal and the bus bar. This greatly improves the mechanical strength and reliability of electrical connections, reduces electrical impedance, and allows large currents to flow. Furthermore, since a copper foil pattern for fixing the bus bar to the board is not required, the work is simplified, productivity is significantly improved, and applications can be expanded.

［実施例］ 以下、この発明の一実施例を図について説明する。第１
図において、（２１）はバスバー（１）のバーリング部
であり、そのバーリング長さが基板（６）の挿入透孔（
７）の深さを越えないように構成されており、バーリン
グ部（２１）を基板（６）の挿入透孔（７）に挿入した
とき、この例では間隙（ｌＯ）が生じる。　（４１１は
回路素子（３）に固定されている根本側の大径リード端
子であり、その外径は基板（６）の挿入透孔（７）の直
径より大きい。（４２）は先端側の小径リード端子であ
り、バーリング部（２１）の透孔（５）に例えばＯ１２
〜０．５ｍｍの間隙をもって挿入され、この例では、そ
の長さもバーリング部（２１）の透孔（５）の深さより
例えば０．２〜０．５ｍｍ程度短く構成されている。バ
ーリング部（２１）と小径リード端子（４２）との間隙
には半田（９）が介在し両者を接合している。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
In the figure, (21) is the burring part of the bus bar (1), and the burring length is the insertion hole (21) of the board (6).
7), and when the burring portion (21) is inserted into the insertion hole (7) of the substrate (6), a gap (lO) is created in this example. (411 is a large diameter lead terminal on the base side fixed to the circuit element (3), and its outer diameter is larger than the diameter of the insertion hole (7) of the board (6). (42) is the large diameter lead terminal on the tip side. It is a small diameter lead terminal, and the through hole (5) of the burring part (21) is filled with O12, for example.
It is inserted with a gap of ~0.5 mm, and in this example, its length is also shorter, for example, by about 0.2~0.5 mm than the depth of the through hole (5) of the burring part (21). Solder (9) is interposed in the gap between the burring portion (21) and the small diameter lead terminal (42) to join them together.

次に、組み立て方法の一例について説明する。Next, an example of an assembly method will be described.

基板（６）の挿入透孔（７）にバスバー（１１のバーリ
ング部（２１）を挿入して嵌合させる０次に基板（６）
を介してバスバー（１）　と反対側の面から、回路素子
（３）の小径リード端子（４２）をバスバー（１）の透
孔（５）に挿入する。この時、大径リード端子（４１）
が基板（６）に当接して挿入寸法を限定するストッパー
の役目を果たし、小径リード端子（４２）がバスバー（
＋）から突出しないように構成されており、また、バー
リング部（２りと小径リード端子（４２）との間には間
隙が形成される０次に、上記のように組み立てられた基
板（６）のバスバー（１）側を溶融半田に浸漬する。溶
融半田はバスバー（１）のバーリング部（２りの透孔（
５）の壁面と小径リード端子（４２）の外壁との間隙に
毛細管現象で入り込み、硬化して半田（９）となり、基
板（６）を挟んだ状態で回路素子（３）の小径リード端
子（４２）がバスバー（１）のバーリング部（２１）に
接合されることによって回路素子（３）は強固に固定さ
れる。Insert and fit the bar ring part (21) of the bus bar (11) into the insertion hole (7) of the board (6).
Insert the small-diameter lead terminal (42) of the circuit element (3) into the through hole (5) of the bus bar (1) from the side opposite to the bus bar (1) through the small diameter lead terminal (42) of the circuit element (3). At this time, large diameter lead terminal (41)
plays the role of a stopper that comes into contact with the board (6) and limits the insertion dimension, and the small diameter lead terminal (42) comes into contact with the bus bar (
+), and a gap is formed between the burring part (2) and the small diameter lead terminal (42). ) of the busbar (1) side is immersed in molten solder.The molten solder is applied to the barring part (the two through holes (
5) It enters the gap between the wall surface and the outer wall of the small-diameter lead terminal (42) by capillary action, hardens and becomes solder (9), and the small-diameter lead terminal (42) of the circuit element (3) is soldered with the board (6) in between. 42) is joined to the bar ring portion (21) of the bus bar (1), thereby firmly fixing the circuit element (3).

なお、溶融半田に浸漬する際の６耶の組み立て、および
浸漬時に各部品が緩まないように固定する手だてについ
てはこの発明の目的とするところではないので省略する
。It should be noted that the assembly of the six-piece assembly when immersed in molten solder and the means for fixing each component to prevent it from loosening during immersion are not the purpose of this invention, and will therefore be omitted.

［発明の効果］ 以上のように、この発明によれば、挿入透孔を有する基
板、バーリング長さが上記挿入透孔の深さを越えないバ
ーリング部を有し、このバーリング部が上記挿入透孔に
挿入されて嵌合するバスバ、上記基板を介してバスバー
と反対側に配置され、先端側の小径リード端子が上記バ
ーリング部に間隙を介して挿入されるとともに根本側の
大径リード端子が上記基板に当接する回路素子、および
上記間隙に介在し上記小径リード端子と上記バーリング
部とを接合する半田を備えたので、電気的接続の信頼性
および機械的強度が向上して大電流低インピーダンスの
通電が可能で、しかも生産性の向上した大電流基板装置
が得られる効果がある。[Effects of the Invention] As described above, according to the present invention, there is provided a substrate having an insertion hole, a burring portion whose burring length does not exceed the depth of the insertion hole, and this burring portion is connected to the insertion hole. A bus bar is inserted into the hole and fitted, and the small diameter lead terminal on the tip side is inserted through the gap into the bar ring part, and the large diameter lead terminal on the root side is placed on the opposite side of the bus bar across the board. Since it includes a circuit element that comes into contact with the board, and a solder that is interposed in the gap and joins the small diameter lead terminal and the burring part, the reliability and mechanical strength of the electrical connection are improved and the high current and low impedance. This has the effect of providing a large current board device that can conduct electricity for 20 seconds and has improved productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例による大電流基板装置の要
部の構成を示す断面図、第２図は従来の大電流基板装置
の要部の構成を示す断面図である。 図において、（１）はバスパー　（２）、（２１）はバ
ーリング部、（３）は回路素子、（４）はリード端子、
（４１）は大径リード端子、（４２）は小径リード端子
、（５）は透孔、（５）は基板、（７）は挿入透孔、（
９）は半田である。 なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing the structure of the main part of a large current board device according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of the main part of a conventional large current board device. In the figure, (1) is the busper (2), (21) is the burring part, (3) is the circuit element, (4) is the lead terminal,
(41) is a large diameter lead terminal, (42) is a small diameter lead terminal, (5) is a through hole, (5) is a board, (7) is an insertion through hole, (
9) is solder. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] （１）挿入透孔を有する基板、バーリング長さが上記挿
入透孔の深さを越えないバーリング部を有し、このバー
リング部が上記挿入透孔に挿入されて嵌合するバスバー
、上記基板を介してバスバーと反対側に配置され、先端
側の小径リード端子が上記バーリング部に間隙を介して
挿入されるとともに根本側の大径リード端子が上記基板
に当接する回路素子、および上記間隙に介在し上記小径
リード端子と上記バーリング部とを接合する半田を備え
た大電流基板装置。(1) A board having an insertion hole, a bus bar having a burring portion whose burring length does not exceed the depth of the insertion hole, and this burring portion being inserted into and fitted into the insertion hole; A circuit element is arranged on the opposite side of the bus bar through the circuit element, the small diameter lead terminal on the tip side is inserted into the bar ring part through the gap, and the large diameter lead terminal on the base side comes into contact with the board, and the circuit element is inserted in the gap. and a large current board device comprising solder for joining the small diameter lead terminal and the burring part.
JP2532889A 1989-02-03 1989-02-03 High current board device Expired - Lifetime JPH0777285B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2532889A JPH0777285B2 (en) 1989-02-03 1989-02-03 High current board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2532889A JPH0777285B2 (en) 1989-02-03 1989-02-03 High current board device

Publications (2)

Publication Number Publication Date
JPH02205385A true JPH02205385A (en) 1990-08-15
JPH0777285B2 JPH0777285B2 (en) 1995-08-16

Family

ID=12162882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2532889A Expired - Lifetime JPH0777285B2 (en) 1989-02-03 1989-02-03 High current board device

Country Status (1)

Country Link
JP (1) JPH0777285B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007522631A (en) * 2004-02-16 2007-08-09 アンドラーシュ・ファザカシュ Soldering nest for busbar
JP2011080973A (en) * 2009-10-09 2011-04-21 Kohshin Electric Corp Coreless current sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007522631A (en) * 2004-02-16 2007-08-09 アンドラーシュ・ファザカシュ Soldering nest for busbar
JP2011080973A (en) * 2009-10-09 2011-04-21 Kohshin Electric Corp Coreless current sensor

Also Published As

Publication number Publication date
JPH0777285B2 (en) 1995-08-16

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