JPH0449652Y2 - - Google Patents
Info
- Publication number
- JPH0449652Y2 JPH0449652Y2 JP1987071696U JP7169687U JPH0449652Y2 JP H0449652 Y2 JPH0449652 Y2 JP H0449652Y2 JP 1987071696 U JP1987071696 U JP 1987071696U JP 7169687 U JP7169687 U JP 7169687U JP H0449652 Y2 JPH0449652 Y2 JP H0449652Y2
- Authority
- JP
- Japan
- Prior art keywords
- ecd
- display
- layer
- electrode
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 14
- 239000003792 electrolyte Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、エレクトロクロミツクデイスプレイ
(以下、ECDともいう)素子を利用した、オセ
ロ、囲碁等における白黒表示が可能な、タツチス
イツチ式のECDパネルに関する。[Detailed description of the invention] [Field of industrial application] The present invention is a touch-switch type ECD panel that uses an electrochromic display (hereinafter also referred to as ECD) element and is capable of displaying black and white in Othello, Go, etc. Regarding.
従来、液晶表示器を使用したオセロ、囲碁等の
ゲーム機が知られている。これらのゲーム機は、
液晶表示器よりなる盤面に別途スイツチを設け、
該スイツチにより白黒表示を行うものである。し
かしながら、かかる液晶表示器は、表示層である
液晶層の厚みを極めて高精度に均一化する必要が
あり、大面積のものができない。また、スイツチ
が別にあるため、ゲームの実感がない。しかも、
長時間つけつ放しにしておくと大量の電力を消費
するという欠点を有する。
Conventionally, game machines such as Othello and Go that use liquid crystal displays have been known. These game machines are
A separate switch is installed on the panel consisting of a liquid crystal display,
This switch performs black and white display. However, in such a liquid crystal display, the thickness of the liquid crystal layer, which is a display layer, must be made uniform with extremely high precision, and a large-area display cannot be produced. Also, since there is a separate switch, there is no real sense of the game. Moreover,
It has the disadvantage that it consumes a large amount of electricity if left on for a long time.
本考案者は、ECD素子が、固体のエレクトロ
クロミツク層(以下、EC層という)で構成され
るため、大面積の表示器が構成できること、及び
EC層のメモリー性により長時間の表示において
も電力の消費量が少ないことに着目し、該ECD
素子を用いて、オセロ、囲碁等における白黒表示
が可能な、デイスプレイ面を直接押すことによ
り、該押された箇所のデイスプレイ面を構成する
ECD素子が電極と接触し、該ECD素子に電圧が
印加されて着色又は消色表示する方式(タツチス
イツチ式)のECDパネルを開発すべく研究を重
ねた。その結果、ECD素子を特定の構造に成形
したデイスプレイ基板と電極フイルムとを用いて
タツチスイツチ式デイスプレイパネルを構成する
ことにより、前記した液晶表示器を用いたゲーム
機における欠点を全く解消することができ、本考
案を完成するに至つた。
The inventor of the present invention believes that since the ECD element is composed of a solid electrochromic layer (hereinafter referred to as the EC layer), a large-area display can be constructed;
Focusing on the low power consumption even during long-time display due to the memory properties of the EC layer,
By directly pressing the display surface, which can display black and white in Othello, Go, etc., using the element, the display surface of the pressed location is configured.
We conducted extensive research to develop an ECD panel in which the ECD element contacts an electrode and a voltage is applied to the ECD element to display color or decolor (touch switch type). As a result, by constructing a touch-switch type display panel using a display substrate in which an ECD element is molded into a specific structure and an electrode film, it is possible to completely eliminate the drawbacks of game machines using liquid crystal displays as described above. This led to the completion of this invention.
以下、添付図面に従つて本考案を詳細に説明す
るが、本考案はこれらの添付図面に限定されるも
のではない。第1図は、本考案のECDパネルの
代表的な態様の部分断面を示す斜視図である。即
ち、本考案のECDパネルは、外周部3と内周部
4に電気的に分割されたECD素子と電極層7と
を積層したECD単位素子2を、絶縁体6を介し
て平面に配列したデイスプレイ基板1と電極基板
8とより、該デイスプレイ基板1の電極層7が位
置する面と電極基板8の電極面9とを空間5を隔
てて対向させて構成される。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to these drawings. FIG. 1 is a perspective view showing a partial cross section of a typical embodiment of the ECD panel of the present invention. That is, the ECD panel of the present invention has ECD unit elements 2 stacked with ECD elements electrically divided into an outer circumference 3 and an inner circumference 4 and an electrode layer 7 arranged in a plane with an insulator 6 in between. A display substrate 1 and an electrode substrate 8 are constructed such that the surface of the display substrate 1 on which the electrode layer 7 is located and the electrode surface 9 of the electrode substrate 8 are opposed to each other with a space 5 in between.
本考案において、ECD素子は、EC層を含む公
知の積層構造が特に制限なく採用される。代表的
な態様としては、第1図に示すように、透明電極
層13、EC層14、電解質層15及び対向電極
層16を順次積層した態様が挙げられる。 In the present invention, the ECD element may have any known laminated structure including an EC layer without any particular limitation. A typical embodiment is, as shown in FIG. 1, an embodiment in which a transparent electrode layer 13, an EC layer 14, an electrolyte layer 15, and a counter electrode layer 16 are sequentially laminated.
透明電極層13の材質は、透明性を有し、電子
導電性を有するものが特に制限なく使用される。
例えば、酸化インジウムに酸化スズをドープした
もの、酸化スズ、酸化亜鉛、酸化チタン、酸化カ
ドミウム、すず酸化カドミウム等の酸化物半導
体、厚さを500Å以下とした金、銀等の導電性金
属等が好適に使用される。上記の透明導電層13
は、スパツタリング、真空蒸着、イオンプレーテ
イング、スプレー法、ゾルーゲル法、CVD法等
の公知の方法によつて形成させることができる。
透明電極層13の厚みは、30〜1000Åが一般的で
ある。 The material for the transparent electrode layer 13 is not particularly limited, and any material that is transparent and has electronic conductivity can be used.
For example, indium oxide doped with tin oxide, oxide semiconductors such as tin oxide, zinc oxide, titanium oxide, cadmium oxide, and cadmium tin oxide, and conductive metals such as gold and silver with a thickness of 500 Å or less. Preferably used. The above transparent conductive layer 13
can be formed by a known method such as sputtering, vacuum evaporation, ion plating, spray method, sol-gel method, or CVD method.
The thickness of the transparent electrode layer 13 is generally 30 to 1000 Å.
また、EC層14は、エレクトロクロミツク物
質を含む層であればよい。該エレクトロクロミツ
ク物質としては例えば、無定形酸化タングステン
が最も代表的であるが、その他にも、有機色素、
金属錯体、遷移金属化合物、有機物の高分子体な
どが適宜採用される。該EC層の形成方法として
は、例えば真空蒸着、スパツタリング、イオンプ
レーテイング、プラズマ等の公知の方法が適宜採
用される。また、他の形成方法として塩化タング
ステンをアルコール等の有機溶媒に溶解した液を
膜状に形成し、該有機溶媒を除去した後、或いは
除去と同時に水中又は水蒸気中で加水分解する方
法も好適である。EC層は、一般に100Å〜5μの厚
さが好ましい。 Further, the EC layer 14 may be any layer containing an electrochromic substance. The most typical example of the electrochromic substance is amorphous tungsten oxide, but other materials include organic dyes,
Metal complexes, transition metal compounds, organic polymers, and the like are appropriately employed. As a method for forming the EC layer, known methods such as vacuum evaporation, sputtering, ion plating, plasma, and the like are appropriately employed. Another suitable method is to form a film by dissolving tungsten chloride in an organic solvent such as alcohol, and then hydrolyzing it in water or steam after or simultaneously with the removal of the organic solvent. be. The EC layer generally has a preferred thickness of 100 Å to 5 μ.
本考案において、電解質層15を構成する電解
質は、公知のものが特に制限なく使用し得るが、
可撓性を有する固体電解質を用いることが好まし
い。例えば、高分子体に電解質物質を分散させた
もの、具体的には分子量1000以上のポリアルキレ
ンオキサイドに、過塩素酸アルカリ等の電解質物
質を分散させたものが挙げられる。また、イオン
交換基を有する重合体、例えば、イオン交換体を
電解質として用いることが、得られるECD素子
の応答速度及びコントラスト比が向上するために
好ましい。かかる電解質層の厚みは一般に1000Å
〜200μmが好適である。また、電解質層の形成
方法としては、例えば、スピンナー法、スクリー
ン印刷等の公知の方法が採用される。 In the present invention, as the electrolyte constituting the electrolyte layer 15, any known electrolyte may be used without particular limitation, but
It is preferable to use a flexible solid electrolyte. For example, examples include those in which an electrolyte substance is dispersed in a polymer, specifically those in which an electrolyte substance such as alkali perchlorate is dispersed in a polyalkylene oxide having a molecular weight of 1000 or more. Further, it is preferable to use a polymer having an ion exchange group, for example, an ion exchanger, as an electrolyte because the response speed and contrast ratio of the resulting ECD device are improved. The thickness of such an electrolyte layer is typically 1000 Å
~200 μm is suitable. Further, as a method for forming the electrolyte layer, for example, a known method such as a spinner method or screen printing may be employed.
対向電極層16としては、公知のものが使用で
きる。例えば酸化インジウム、酸化インジウム−
酸化すず膜(ITO膜)、無定形酸化タングステン、
鉄錯体、遷移金属化合物−カーボン焼結体及び酸
化マンガン等が挙げられる。形成方法としては、
スパツタリング、真空蒸着、電解メッキ等の公知
の方法が採用される。尚、本発明に於ける対向電
極とは、上記で説明した公知のものの他、エレク
トロクロミツク層と透明導電層との2層からな
り、電極として機能するものをも含む。 As the counter electrode layer 16, a known one can be used. For example, indium oxide, indium oxide
Tin oxide film (ITO film), amorphous tungsten oxide,
Examples include iron complexes, transition metal compound-carbon sintered bodies, and manganese oxide. As for the formation method,
Known methods such as sputtering, vacuum deposition, and electrolytic plating may be employed. The counter electrode in the present invention includes, in addition to the well-known ones described above, those which are composed of two layers, an electrochromic layer and a transparent conductive layer, and which function as an electrode.
対向電極層の厚みは100Å〜80μmが好ましい。 The thickness of the counter electrode layer is preferably 100 Å to 80 μm.
本考案において、ECD素子は外周部3と内周
部4とに電気的に分割されている。かかる外周部
3はドーナツ状、内周部4は円状の形状とするの
が、オセロ、囲碁等に本考案のデイスプレイパネ
ルを使用する場合に一般的であるが、その他四角
形、三角形、星形等任意の形状で外周部3と内周
部4に分割してもよい。また、かかる分割は、第
1図に示すようにECD素子の全層にわたつて同
一パターンで行うことが好ましいが、少なくとも
透明電極層13、EC層14、及び電解質層15
を同一パターンで外周部3と内周部4とに電気的
に分割すれば充分である。更に、外周部3の形状
は完全に周である必要がなく、後記する電気配線
を行うための切り欠きを設けてもよい。 In the present invention, the ECD element is electrically divided into an outer peripheral part 3 and an inner peripheral part 4. Generally, when the display panel of the present invention is used for Othello, Go, etc., the outer circumferential portion 3 is donut-shaped and the inner circumferential portion 4 is circular. It may be divided into an outer circumferential portion 3 and an inner circumferential portion 4 in any shape. Furthermore, it is preferable that such division be performed in the same pattern over all layers of the ECD element as shown in FIG.
It is sufficient to electrically divide it into an outer circumferential portion 3 and an inner circumferential portion 4 in the same pattern. Further, the shape of the outer circumferential portion 3 does not have to be completely circular, and a cutout for electrical wiring, which will be described later, may be provided.
本考案において、ECD素子を電気的に分割す
る手段は特に制限されないが、一般には、酸化珪
素の蒸着、絶縁性を有するインキを用いたスクリ
ーン印刷等により絶縁する部分をパターニングし
て行えばよい。 In the present invention, the means for electrically dividing the ECD element is not particularly limited, but in general, it may be done by patterning the insulating parts by vapor deposition of silicon oxide, screen printing using insulating ink, etc.
上記のECD素子の対向電極層16の位置する
面と電極層7とを積層してECD単位素子2が形
成される。かかる電極層7は、ECD素子の外周
部3及び内周部4に共通して設けられ、電極基板
の電極面との電気的な接触時に、ECDの通電面
となる外周部3及び内周部4の全面に均一に電圧
を印加するためのものである。従つて、電極層7
の材質としては、電子導電性の高いものが好適に
使用される。例えば、アルミニウム、クロム、ニ
ツケル、銅、金、銀、白金等の金属;カーボン、
酸化物半導体等を合成樹脂に分散したインキ等よ
りなる電子導電物質を用い、真空蒸着、スパツタ
リング、スクリーン印刷等の公知の方法によつて
形成することが好ましい。該電極層7の厚みは
100Å〜1μmが適当である。尚、ECD素子の対向
電極層16の電子導電性が高い場合は、対向電極
層16を、電気的に分割せずに電極層7として使
用してもよい。 The ECD unit element 2 is formed by laminating the electrode layer 7 and the surface of the ECD element on which the counter electrode layer 16 is located. The electrode layer 7 is provided in common on the outer circumferential part 3 and the inner circumferential part 4 of the ECD element, and when it comes into electrical contact with the electrode surface of the electrode substrate, the outer circumferential part 3 and the inner circumferential part become the current-carrying surface of the ECD. This is for uniformly applying voltage to the entire surface of the 4. Therefore, the electrode layer 7
A material with high electronic conductivity is preferably used as the material. For example, metals such as aluminum, chromium, nickel, copper, gold, silver, platinum; carbon,
It is preferable to use an electronically conductive material made of ink or the like in which an oxide semiconductor or the like is dispersed in a synthetic resin, and to use a known method such as vacuum evaporation, sputtering, or screen printing. The thickness of the electrode layer 7 is
A suitable thickness is 100 Å to 1 μm. Note that if the counter electrode layer 16 of the ECD element has high electronic conductivity, the counter electrode layer 16 may be used as the electrode layer 7 without being electrically divided.
本考案において、デイスプレイ基板1は絶縁体
6を介して上記のECD単位素子2を平面に配列
して構成される。ECD単位素子2の配列間隔、
及び配列数は、用途に応じて適宜決定される。ま
た、絶縁体6を設ける手段は特に制限されない
が、前記した酸化珪素等の絶縁物質の蒸着、絶縁
性を有するインキを用いたスクリーン印刷等によ
りパターニングする方法が好ましい。 In the present invention, the display substrate 1 is constructed by arranging the above ECD unit elements 2 in a plane with an insulator 6 in between. Arrangement interval of ECD unit element 2,
And the number of arrays is determined as appropriate depending on the purpose. Further, the means for providing the insulator 6 is not particularly limited, but a patterning method such as vapor deposition of an insulating material such as silicon oxide described above or screen printing using an insulating ink is preferable.
本考案において、デイスプレイ基板1は、タツ
チ入力時における入力面の損傷を防止するため、
保護用の可撓性を有する透明フイルム17を積層
することが好ましい。 In the present invention, the display board 1 has the following features to prevent damage to the input surface during touch input:
It is preferable to laminate a flexible transparent film 17 for protection.
上記の可撓性を有する透明フイルムは、公知の
ものが特に制限なく使用される。例えば、ポリエ
チレンテレフタレートフイルム、ポリカーボネー
トフイルム等が透明性及び耐擦傷性の面で好適に
使用される。尚、12は盤面に引かれた線であ
る。 As the above-mentioned flexible transparent film, any known film can be used without particular limitation. For example, polyethylene terephthalate film, polycarbonate film, etc. are preferably used in terms of transparency and scratch resistance. Note that 12 is a line drawn on the board.
また、第1図に示すデイスプレイパネル1は
ECD単位素子2の透明電極層13の外周部3と
内周部4を外部電源と夫々接続するものであり、
この場合、図に示すように内周部同士及び外周部
同士を、該透明電極層13をパターニングするこ
とにより夫々電気的に接続し、各1つずつの端子
を取り出すことが好ましい。 In addition, the display panel 1 shown in FIG.
The outer circumferential portion 3 and the inner circumferential portion 4 of the transparent electrode layer 13 of the ECD unit element 2 are respectively connected to an external power source.
In this case, it is preferable to electrically connect the inner peripheral parts and the outer peripheral parts by patterning the transparent electrode layer 13, as shown in the figure, and take out one terminal from each.
本考案において、電極基板8は、デイスプレイ
パネルとしてある程度の強度を有するものであれ
ば特に制限なく使用される。例えばガラス板、プ
ラスチツク板、プラスチツクシート、金属板、金
属シートなどが挙げられるが、特に透明である必
要はない。また、電極面9は、上記電極基板8に
形成されるものであり、材質は電子導電性を有す
るものであれば特に制限されない。例えば銅、ニ
ツケル、アルミニウム等の金属が挙げられる。電
極面の形成方法としては、例えば、スパツタリン
グ、プラズマ、真空蒸着、圧延銅を積層する方法
等が挙げられる。尚、電極基板自体が電子導電性
を有している場合は、別途電極面を形成させる必
要はない。 In the present invention, the electrode substrate 8 may be used without particular limitation as long as it has a certain degree of strength as a display panel. Examples include glass plates, plastic plates, plastic sheets, metal plates, metal sheets, etc., but they do not need to be particularly transparent. Further, the electrode surface 9 is formed on the electrode substrate 8 , and the material thereof is not particularly limited as long as it has electronic conductivity. Examples include metals such as copper, nickel, and aluminum. Examples of methods for forming the electrode surface include sputtering, plasma, vacuum deposition, and a method of laminating rolled copper. Note that if the electrode substrate itself has electronic conductivity, there is no need to separately form an electrode surface.
本考案において、デイスプレイ基板1と電極基
板8との空間5の間隙は、小さ過ぎると誤作動が
起こり易く、大き過ぎると操作性が悪いばかりで
なく、デイスプレイ基板1の屈曲も激しくなり寿
命が低下する。そのため、かかる間隙は5〜
1000μm、好ましくは10〜300μmとすることが好
ましい。 In the present invention, if the gap between the space 5 between the display substrate 1 and the electrode substrate 8 is too small, malfunctions are likely to occur, and if it is too large, not only will the operability be poor, but the display substrate 1 will also be severely bent, reducing its lifespan. do. Therefore, the gap is 5~
The thickness is preferably 1000 μm, preferably 10 to 300 μm.
上記した空間5を均一に維持するために、スペ
ーサー10を介してデイスプレイ基板1と電極基
板8とを積層することは好ましい態様である。か
かるスペーサーの厚みは空間5の間隙に応じて決
定すればよく、切欠部の大きさ形状は特に制限さ
れないが、ECD単位素子2の大きさ及び形状に
応じて決定するのが一般的である。該スペーサー
10の材質は絶縁性を有するものであれば特に制
限されない。例えば、ゴム、プラスチツク、セラ
ミツクス、紙等が一般に使用される。 In order to maintain the above-described space 5 uniformly, it is a preferable embodiment to laminate the display substrate 1 and the electrode substrate 8 with spacers 10 in between. The thickness of such a spacer may be determined according to the gap between the spaces 5, and the size and shape of the notch are not particularly limited, but it is generally determined according to the size and shape of the ECD unit element 2. The material of the spacer 10 is not particularly limited as long as it has insulation properties. For example, rubber, plastic, ceramics, paper, etc. are commonly used.
本考案において、ECDパネルを作動させるた
めの配線は、ECD単位素子2の外周部3の端子
及び/又は内周部4の端子と電極面9の端子とを
電源を介して接続することにより行われる。第2
図は、ECDパネルの代表的な配線を示す回路図
である。第2図において、EC層が、透明電極層
13に負の電圧が印加されると着色するEC物質
によつて構成される場合、スイツチCを接続した
回路でデイスプレイパネル1を直接押して電極基
板8に接触させると、内周部4及び外周部3の
ECD素子に電源18−2より電圧が印加されて
両方の素子が着色し、スイツチAを接続した回路
でデイスプレイパネル1を直接押して電極基板8
に接触させると、外周部3のECD素子5電源1
8−2より電圧が印加され、該部分のみが着色
し、内周部4のECD素子には、電源18−1よ
り電圧が印加され、該部分が消色する。また、ス
イツチBを接続した回路でデイスプレイパネル1
を直接押して電極基板8に接触させると、内周部
4及び外周部3のECD素子に電源18−1より
電圧が印加されて両方の素子が消色する。 In the present invention, the wiring for operating the ECD panel is performed by connecting the terminals on the outer circumference 3 and/or the inner circumference 4 of the ECD unit element 2 and the terminals on the electrode surface 9 via a power supply. be exposed. Second
The figure is a circuit diagram showing typical wiring of an ECD panel. In FIG. 2, when the EC layer is composed of an EC substance that colors when a negative voltage is applied to the transparent electrode layer 13, the display panel 1 is directly pushed by a circuit connected to the switch C, and the electrode substrate 8 is When brought into contact with the inner circumferential portion 4 and outer circumferential portion 3
Voltage is applied to the ECD element from the power source 18-2, both elements are colored, and the display panel 1 is directly pressed using the circuit connected to the switch A.
When the ECD element 5 on the outer periphery 3
A voltage is applied from 8-2 to color only that portion, and a voltage is applied to the ECD element in the inner circumferential portion 4 from power source 18-1 to decolor that portion. Also, display panel 1 is connected to the circuit connected to switch B.
When pressed directly to contact the electrode substrate 8, voltage is applied from the power source 18-1 to the ECD elements on the inner circumferential part 4 and the outer circumferential part 3, and both elements are decolored.
従つて、上記スイツチを切り換えて、デイスプ
レイパネルを直接押す(タツチ入力する)ことに
より、表示をそれぞれのスイツチに対応して変化
させることができる。 Therefore, by changing the switches and directly pressing (touch input) the display panel, the display can be changed in accordance with each switch.
以上、本考案を第1図に示す態様に従つて詳細
に説明したが、本考案のECDパネルは、デイス
プレイ基板1のECD素子の積層順序を逆にした
態様、電極基板8側を可撓性とした態様等、本考
案の要旨を逸脱しない範囲で変更可能である。 As above, the present invention has been explained in detail according to the embodiment shown in FIG. Modifications may be made without departing from the gist of the present invention.
本考案のECDパネルは、デイスプレイ面を直
接押すことにより、該押された箇所のデイスプレ
イ面を構成するECD素子が電極と接触し、該
ECD素子に電圧が印加されて着色又は消色表示
できるため、オセロ、囲碁等の白黒表示を行うこ
とが可能であり、ゲームの実感を味わうことがで
きる。しかも、電圧を印加して着色状態、或いは
消色状態となつたEC層は、電圧を印加しない状
態でも、着色状態、或いは消色状態を維持し得
る、いわゆる「メモリー性」を有しているため、
長時間の表示においても電力消費が少なく、しか
も通常の盤面と同じくらいの大面積のデイスプレ
イを構成しても鮮明な表示を行うことができ、且
つ薄いECDパネルとすることができる。
In the ECD panel of the present invention, by directly pressing the display surface, the ECD elements forming the display surface at the pressed location come into contact with the electrodes.
Since a voltage is applied to the ECD element and the display can be colored or decolored, it is possible to display black and white games such as Othello and Go, allowing you to enjoy the real experience of the game. Moreover, the EC layer that becomes colored or decolored by applying a voltage has so-called "memory properties" that it can maintain its colored or decolored state even when no voltage is applied. For,
Power consumption is low even during long-time display, clear display can be achieved even if the display is as large as a normal board, and the ECD panel can be made thin.
従つて、オセロ、囲碁等のゲーム用をはじめ各
種のデイスプレイに応用することができる。 Therefore, it can be applied to various displays including those for games such as Othello and Go.
第1図は本考案の代表的な態様のECDパネル
の部分断面を示す斜視図、第2図はECDパネル
の接断態様を示す回路図である。
1……デイスプレイ基板、2……ECD単位素
子、3……外周部、4……内周部、5……空間、
6……絶縁体、7……電極層、8……電極基板、
9……電極面、10……スペーサ、11……配
線、12……線、13……透明導電層、14……
EC層、15……電解質層、16……対向電極層、
17……保護フイルム、18−1,18−2……
電源。
FIG. 1 is a perspective view showing a partial cross section of an ECD panel according to a typical embodiment of the present invention, and FIG. 2 is a circuit diagram showing a connection/disconnection state of the ECD panel. 1... Display board, 2... ECD unit element, 3... Outer periphery, 4... Inner periphery, 5... Space,
6... Insulator, 7... Electrode layer, 8... Electrode substrate,
9... Electrode surface, 10... Spacer, 11... Wiring, 12... Line, 13... Transparent conductive layer, 14...
EC layer, 15... Electrolyte layer, 16... Counter electrode layer,
17...Protective film, 18-1, 18-2...
power supply.
Claims (1)
ロクロミツクデイスプレイ素子と電極層とを積層
したエレクトロクロミツクデイスプレイ単位素子
を、絶縁体を介して平面に配列したデイスプレイ
基板と電極基板とよりなり、該デイスプレイ基板
の電極層が位置する面と電極基板の電極面とを空
間を隔てて対向させたエレクトロクロミツクデイ
スプレイパネル。 It consists of a display substrate and an electrode substrate in which an electrochromic display unit element, in which an electrochromic display element electrically divided into an outer peripheral part and an inner peripheral part and an electrode layer are laminated, is arranged in a plane with an insulator interposed therebetween. , an electrochromic display panel in which the surface of the display substrate on which the electrode layer is located and the electrode surface of the electrode substrate are opposed to each other with a space between them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071696U JPH0449652Y2 (en) | 1987-05-15 | 1987-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071696U JPH0449652Y2 (en) | 1987-05-15 | 1987-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180889U JPS63180889U (en) | 1988-11-22 |
| JPH0449652Y2 true JPH0449652Y2 (en) | 1992-11-24 |
Family
ID=30914482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071696U Expired JPH0449652Y2 (en) | 1987-05-15 | 1987-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449652Y2 (en) |
-
1987
- 1987-05-15 JP JP1987071696U patent/JPH0449652Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63180889U (en) | 1988-11-22 |
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