JPH0449672A - Dmos transistor - Google Patents

Dmos transistor

Info

Publication number
JPH0449672A
JPH0449672A JP15947090A JP15947090A JPH0449672A JP H0449672 A JPH0449672 A JP H0449672A JP 15947090 A JP15947090 A JP 15947090A JP 15947090 A JP15947090 A JP 15947090A JP H0449672 A JPH0449672 A JP H0449672A
Authority
JP
Japan
Prior art keywords
region
source
base
pmos
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15947090A
Other languages
Japanese (ja)
Inventor
Noboru Kudo
昇 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP15947090A priority Critical patent/JPH0449672A/en
Publication of JPH0449672A publication Critical patent/JPH0449672A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

PURPOSE:To form two source regions and two base regions in conventional cases as one common source region and one common base region by a method wherein a base region of one conductivity type is arranged on a semiconductor region of one conductivity type, a source region of an opposite conductivity type is arranged on the base region and a plurality of drain regions, of on opposite conductivity type, which do not come into contact with each other are formed so as to be adjacent to the base region. CONSTITUTION:A PMOS 1 is constituted of the following: a gate electrode 6; a high-concentration drain region 11; a low-concentration drain region 12; a drain electrode 1; a base region 8; a source region 7; and a source electrode 2. A PMOS 2 is constituted of the following: a gate electrode 6'; a high- concentration region 9; a low-concentration drain region 10; a drain electrode 3; and the base region 8, the source region 7 and the source electrode 2 which are common to those of the PMOS 1. The PMOS 1 and the PMOS 2 are formed on a P-type substrate 14 and on an N-type epitaxial region 13 which is surrounded by a P-type isolation diffusion region 15 and a P-type isolation buried region 16.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、アナログ信号の増幅に広く用いられている差
動増幅回路のカレントミラ一部に使用されるDMO5I
−ランジスクーに関する。
Detailed Description of the Invention [Field of Industrial Application] The present invention is directed to a DMO5I used in a current mirror part of a differential amplifier circuit widely used for analog signal amplification.
- Regarding Ranjisku.

[発明の概要I D M OS (Double Diffused M
OS )は、ドレイン領域内にゲート電極をマスクにし
てベース領域及びソース領域の拡散を行なってつくられ
、ゲート電極下のベース領域がチャネルとして機能する
MO3I−ランシスターである。DMO3を差動増幅回
路のカレントミラ一部に用いると、DMOSのgdが通
常MO3のgdにくらべ小さいので。
[Summary of the invention I D M OS (Double Diffused M OS)
OS) is an MO3I-run sister which is made by diffusing the base region and source region into the drain region using the gate electrode as a mask, and the base region under the gate electrode functions as a channel. When DMO3 is used as part of the current mirror of a differential amplifier circuit, the gd of DMOS is usually smaller than that of MO3.

オーブンループゲインの大きいすぐれた差動増幅回路が
得られる。本発明は、カレントミラー回路をDMO3で
構成した場合に、ペアとなる複数個のトランジスターの
ベース領域及びソース領域を、1個の共通のベース領域
及びソース領域で形成することにより、カレントミラー
回路のセルサイズを小さくするものである。
An excellent differential amplifier circuit with large oven loop gain can be obtained. In the present invention, when the current mirror circuit is configured with DMO3, the base regions and source regions of a plurality of paired transistors are formed by one common base region and source region, thereby forming the current mirror circuit. This reduces the cell size.

[従来の技術] 基本的な差動増幅回路の回路図を第3図に示す。第3図
において点線で囲まれたカレントミラ回路は2個のPM
OSI−ランシスターで構成され、前記2個のPMOS
I−ランシスターのソースとサブストレートがVddに
接続している。PMOSカレントミラー回路をDMO5
で構成した従来のDMOSトランジスターの断面図は、
第2図に示すように、P型ドレイン領域20及びP型ド
レイン領域24をN型エピタキシャル領域13上に相隔
でて配し、ひとつのトランジスターのソース領域17と
ベース領域18をドレイン領域20上に、またもうひと
つのトランジスターのソース領域21とベース領域22
をドレイン領域24上に配している。ソース領域17と
ソース領域21のVddへの接続はAI2配線であるソ
ース電極2を介して行なわれる。
[Prior Art] A circuit diagram of a basic differential amplifier circuit is shown in FIG. In Figure 3, the current mirror circuit surrounded by dotted lines consists of two PMs.
Consisting of OSI-run sister, the two PMOS
The source of the I-run sister and the substrate are connected to Vdd. DMO5 PMOS current mirror circuit
A cross-sectional view of a conventional DMOS transistor configured with
As shown in FIG. 2, a P-type drain region 20 and a P-type drain region 24 are arranged on the N-type epitaxial region 13 at a distance, and a source region 17 and a base region 18 of one transistor are arranged on the drain region 20. , yet another transistor source region 21 and base region 22
is arranged on the drain region 24. The source region 17 and the source region 21 are connected to Vdd via the source electrode 2, which is an AI2 wiring.

[発明が解決しようとする課題I DMOSカレントミラー回路の短所はドレイン領域20
.24と基板14及び分離拡散領域15を電気的に分離
するためのN型エピタキシャル領域13が必要なことで
、そのためセルサイズがMOSカレントミラー回路に(
らべ大きくなることである。
[Problem to be solved by the invention I The disadvantage of the DMOS current mirror circuit is that the drain region 20
.. 24, the substrate 14, and the isolation diffusion region 15 are required to have an N-type epitaxial region 13 for electrically separating them.
It's about getting bigger.

[課題を解決するための手段1 従来分離して形成されていたソース領域17とソース領
域21、及びベース41域18とベース額板22を2つ
のトランジスターに共通の1個のソース領域とベース領
域で形成することにした。
[Means for Solving the Problem 1] The source region 17 and the source region 21, the base 41 region 18 and the base plate 22, which were conventionally formed separately, are now combined into one source region and base region common to two transistors. I decided to form it.

[作用] 従来2個必要であったソース領域、ベース領域を、それ
ぞれ1個の領域で兼用できるため、セルサイズが小さく
なった。
[Function] Since the source region and the base region, which conventionally required two regions, can each be used as one region, the cell size is reduced.

[実施例] 実施例のDMOSトランジスターの実施例について、第
1図に示すDMO3I−ランシスターの断面図を用いて
説明する。カレントミラー回路を構成する2つのPMO
5I−ランシスターをそれぞれPMO51,PMO32
と呼ぶことにすると、PMO5Iは、ゲート電極6、高
濃度ドレイン領域11、低濃度ドレイン領域12、ドレ
イン電極1、ベース領ftj8、ソース領域7、ソース
電極2から構成され、PMO52は、ゲート電極6′高
濃度ドレイン領@9、低濃度ドレイン領@10、ドレイ
ン電極3、及びPMO5Iと共通のベース領域8、ソー
ス領域7、ソース電極2がら構成される。ゲート電極6
とゲート電極6゛は、1つの連続したPo1y Si層
でつくられ電気的に接続している6 ドレイン領域11
.9.及びソース領域7、ベース領域8は前記Po1y
 Si層に形成された開口部を通して拡散形成される。
[Example] An example of a DMOS transistor according to an example will be described using a cross-sectional view of a DMO3I-run sister shown in FIG. Two PMOs forming a current mirror circuit
5I-run sister PMO51, PMO32 respectively
The PMO 5I is composed of a gate electrode 6, a highly doped drain region 11, a lightly doped drain region 12, a drain electrode 1, a base region ftj8, a source region 7, and a source electrode 2. 'It is composed of a highly doped drain region @9, a lightly doped drain region @10, a drain electrode 3, and a base region 8, a source region 7, and a source electrode 2 common to the PMO5I. Gate electrode 6
and the gate electrode 6' are made of one continuous Po1ySi layer and are electrically connected to the drain region 11.
.. 9. And the source region 7 and the base region 8 are the Po1y
It is formed by diffusion through an opening formed in the Si layer.

PMO5I及びPMO32は、P型基板14、及びP型
分離拡散領域15、P型分離埋込領域16で囲まれたN
型エピタキシャル領域13上に形成される。低濃度ドレ
イン領域10.12は、ボロンなどのP型不純物を10
16.10”cm−3含む拡散領域であり、ベース領域
8はリンなどのN型不純物を101?〜l Q”cm−
”含む拡散領域である。高濃度ドレイン領域9.11及
びソース領域7は通常同一の拡散工程でつくられ、ポロ
ンなどのP型不純物を10′9〜10”cm−”含む拡
散領域である。
PMO5I and PMO32 are N-shaped substrates surrounded by a P-type substrate 14, a P-type isolation diffusion region 15, and a P-type isolation buried region 16.
The mold epitaxial region 13 is formed on the mold epitaxial region 13. The low concentration drain region 10.12 is doped with a P-type impurity such as boron.
It is a diffusion region containing 16.10"cm-3, and the base region 8 contains N-type impurities such as phosphorus at 101?~lQ"cm-
The highly doped drain region 9.11 and the source region 7 are usually formed in the same diffusion process, and are diffusion regions containing 10'9 to 10"cm of P-type impurity such as poron.

[発明の効果j 本発明のDMOSトランジスターは、前述したように従
来2個あったソース領域及びベース領域を共通の1個の
領域で形成するため、1個のジス領域及び1個のベース
領域が不要になることベース領域とN型エピタキシャル
領域の間隔がなくなること、2個のソース領域を接続す
るAJ2配線が不要になることから、カレントミラー回
路のセルサイズを大幅に小さくすることができる。また
、本発明のDMO5)−ランシスター構造ではベース領
域8とエピタキシャル領@13が接続しているが、ベー
ス領域は回路上サブストレートとしてVddに接続し、
エピタキシャル領域もDMOSトランシスタート他の素
子を分離するためVddに接続しているため問題は生じ
ない。本発明の効果がカレントミラー回路にかぎらず、
ソースとサブストレートが共通の複数個のDMO5を含
むすべての回路に適用できることは明らかである。また
、本発明の実施例ではPMO3について説明したがNM
O5の場合でも、PとNをとりかえれば本発明が適用で
きることは言うまでもない。
[Effects of the Invention j As described above, in the DMOS transistor of the present invention, the source region and the base region, which were conventionally two, are formed in one common region. Elimination of need Since the distance between the base region and the N-type epitaxial region is eliminated and the AJ2 wiring connecting the two source regions is no longer necessary, the cell size of the current mirror circuit can be significantly reduced. In addition, in the DMO5)-Run sister structure of the present invention, the base region 8 and the epitaxial region @13 are connected, but the base region is connected to Vdd as a substrate on the circuit,
No problem arises because the epitaxial region is also connected to Vdd to isolate the DMOS transistor and other elements. The effects of the present invention are not limited to current mirror circuits,
It is clear that the invention is applicable to all circuits containing a plurality of DMOs 5 having a common source and substrate. In addition, although PMO3 was explained in the embodiment of the present invention, NM
It goes without saying that the present invention can also be applied to O5 by replacing P and N.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のDMOSトランジスターの断面図、第
2図は従来のDMO5I−ランジスクーの断面図、第3
図は差動増幅回路の回路図である。 l、3・ ・・・・ ・・・・・ドレイン電極2・・・
・・・・・・・・・ソース電極4.5・・・・・・・・
・・酸化膜 6.6′ ・・・・・・・・・ゲート電極7.17.2
1・・・・・・ソース領域8.18.22・・・・・・
ベース領域9.11.19.23・・・高濃度ドレイン
領域 10.12.20.24・・・低濃度ドレイン領域 13・・・・・・・・・・・・エピタキシャル領域 14・・・・・・・・・・・・基板 15・・・・・・・・・・・・分離拡散領域16・・・
・・・・・・・・・分離埋込領域25・ ・ ・ ・ 
・ ・ ・ ・ ・ ・ ・ ・Vdd端子26・・・
・・・・・・・・・カレントミラー27・・・・・・・
・・・・・出力端子28・・・・・・・・・・・・入力
端子129・・・・・・・・・・・・入力端子230・
・・・・・・・・・・・定電流回路出願人 セイコー電
子工業株式会社
FIG. 1 is a cross-sectional view of the DMOS transistor of the present invention, FIG.
The figure is a circuit diagram of a differential amplifier circuit. l, 3. . . . Drain electrode 2...
・・・・・・・・・Source electrode 4.5・・・・・・・・・
...Oxide film 6.6' ......Gate electrode 7.17.2
1... Source area 8.18.22...
Base region 9.11.19.23...High concentration drain region 10.12.20.24...Low concentration drain region 13...Epitaxial region 14... ...... Substrate 15 ...... Separation diffusion region 16 ...
......Separated embedding area 25...
・ ・ ・ ・ ・ ・ ・ ・Vdd terminal 26...
・・・・・・・・・Current mirror 27・・・・・・・
...Output terminal 28...Input terminal 129...Input terminal 230.
・・・・・・・・・・・・Constant current circuit applicant Seiko Electronics Industries Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims]  一導電型の半導体領域上に一導電型のベース領域を配
し、前記ベース領域上に逆導電型のソース領域を配し、
前記ベース領域に隣接して複数個の互いに接しない逆導
電型のドレイン領域を配することを特徴とするDMOS
トランジスター。
A base region of one conductivity type is disposed on a semiconductor region of one conductivity type, a source region of an opposite conductivity type is disposed on the base region,
A DMOS characterized in that a plurality of drain regions of opposite conductivity types that do not touch each other are arranged adjacent to the base region.
transistor.
JP15947090A 1990-06-18 1990-06-18 Dmos transistor Pending JPH0449672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15947090A JPH0449672A (en) 1990-06-18 1990-06-18 Dmos transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15947090A JPH0449672A (en) 1990-06-18 1990-06-18 Dmos transistor

Publications (1)

Publication Number Publication Date
JPH0449672A true JPH0449672A (en) 1992-02-19

Family

ID=15694477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15947090A Pending JPH0449672A (en) 1990-06-18 1990-06-18 Dmos transistor

Country Status (1)

Country Link
JP (1) JPH0449672A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758228A (en) * 1993-07-22 1995-03-03 Philips Electron Nv Integrated device
JP2004273793A (en) * 2003-03-10 2004-09-30 Mitsubishi Electric Corp Semiconductor device
US7598541B2 (en) 2004-02-26 2009-10-06 Fujitsu Microelectronics Limited Semiconductor device comprising transistor pair isolated by trench isolation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758228A (en) * 1993-07-22 1995-03-03 Philips Electron Nv Integrated device
JP2004273793A (en) * 2003-03-10 2004-09-30 Mitsubishi Electric Corp Semiconductor device
US7598541B2 (en) 2004-02-26 2009-10-06 Fujitsu Microelectronics Limited Semiconductor device comprising transistor pair isolated by trench isolation

Similar Documents

Publication Publication Date Title
GB959667A (en) Improvements in or relating to methods of manufacturing unitary solid state electronic circuit complexes and to said complexes
US5296409A (en) Method of making n-channel and p-channel junction field-effect transistors and CMOS transistors using a CMOS or bipolar/CMOS process
JPS6153861B2 (en)
CN101599490B (en) Bipolar device
US5045912A (en) Bi-CMOS integrated circuit device having a high speed lateral bipolar transistor
GB1050805A (en)
JPH0449672A (en) Dmos transistor
JPH0555493A (en) Integrated circuit
JP3128808B2 (en) Semiconductor device
JPS6032354A (en) Semiconductor integrated circuit
JPS63175463A (en) Bi-MOS integrated circuit manufacturing method
JPH05211331A (en) Misfet device and manufacturing method thereof
JP3522462B2 (en) Bipolar transistor ECL device and method of manufacturing the same
JP2990439B2 (en) DMOS transistor
JPS61156830A (en) Semiconductor device and manufacture thereof
JPS6222464B2 (en)
JPH08340108A (en) Mos field effect transistor and manufacture thereof
JP2968640B2 (en) Semiconductor device
JPH07193086A (en) Junction field effect semiconductor device and manufacturing method thereof
JPH02241057A (en) Manufacture of semiconductor integrated circuit
JPS6262062B2 (en)
GB1318979A (en) Semiconductor components
JPH0245977A (en) Dual gate-type insulated gate fet
JPS60180172A (en) Integrated circuit
JPS6337642A (en) Semiconductor integrated circuit device