JPH044970A - Solder removing filter for solder absorbing device - Google Patents

Abstract

PURPOSE:To surely store and fix molten solder into a filter body by constituting a filter body of a coil spring like cylindrical body, closing the root end thereof and removably mounting the front end thereof to a part of an absorbing route. CONSTITUTION:The solder heated by a heating means 2 is sucked from an absorbing nozzle 1 by a sucking means 5 via the absorbing route A into the inside. The absorbing route A is partly formed of a filter pipe 11. The filter body 12 is removably inserted into the filter pipe 11. The filter body 12 is constituted of a cylindrical body formed by winding an elastic wire like a tension coil spring. The root end part 12b of this body 12 is closed and the front end 12c is removably mounted to a part of the absorbing route A. The solder removing filter having the structure to allow an easy exchange operation is provided in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a solder removal filter installed in a solder sucking device.

(Prior Art) A solder suction device is equipped with a suction means and a heating means, and a solder removal filter is removably provided in the middle of the suction path from the suction nozzle to the suction means. The structure is as shown in Figure 6.

That is, the solder removal filter consists of a filter pipe a forming a part of the suction path, a filter body made of steel wool, and a felt member C, which are filled inside the filter pipe a. The solder heated and melted by the heating means is then heated and melted by the suction means.
The flux and the like are sucked into the device from the suction port of the suction nozzle via the suction path, and are deposited on the filter body, and the flux and the like that have passed through the filter body are adsorbed by the felt member C. It is designed to be

Further, the filter body felt member C is a consumable item and is replaced with a new one periodically or at any time when the amount of solder stored in the solder removal filter increases over time.

(Problems to be Solved by the Invention) However, such a structure has the following problems.

That is, as a guideline for when to replace the filter body or felt member C in an actual field, for example, the molten solder sucked into the solder removal filter may not only be absorbed into the filter body itself but also the inner periphery of the filter pipe a. This is when the solder adheres to the surface and hardens, and as a result, the suction path of the solder suction device becomes blocked, and its suction power (solder removal efficiency) decreases.

However, in the conventional structure in which the filter body is filled into the filter vibe a, the filter body is clogged with adhered solder, leading to the blockage of the suction path. Since it is made of steel wool, clogging with solder occurs quickly, and the amount of solder adhesion is relatively small.
The lifespan of the filter body, that is, its replacement cycle, is quite short, leading to an increase in running costs.

In addition, in order to replace the filter body, the worker takes an appropriate amount from a lump of steel wool and fills it into the filter pipe a. It requires intuition and is extremely troublesome. Furthermore, when replacing the filter body, the solder that has adhered and solidified on the inner peripheral surface of the filter vibrator a must be removed at the same time, but this work is also extremely troublesome. This further exacerbated the poor workability.

The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a solder removal filter in a solder sucking device, which has a structure in which filter component parts have a long life and can be easily replaced. purpose.

(Means for Solving the Problems) In order to achieve the above object, the solder removal filter of the present invention includes a filter pipe that forms a part of the suction path of a solder suction device, and a removably installed inside of the filter pipe. and a filter body, the filter body comprising:
It is composed of a cylindrical body formed by winding an elastic wire into the shape of a tension coil spring, and its proximal end is closed, and its distal end is removably attached to a part of the suction path. Its specific structure is:
When the filter main body and the felt member are installed in the filter pipe, the filter main body and the filter pipe are concentric, and an annular space forming a part of the suction path is formed between them. An extension space is provided between the base end of the filter main body and the felt member to allow the filter main body to extend in the axial direction and to restrict the amount of extension. Also,
As the wire constituting the filter body, a hard steel wire coated with zinc plating is preferably used.

(Function) In the solder suction device equipped with the solder removal filter of the present invention, the solder heated and melted by the heating means is sucked into the device through the suction hole of the suction nozzle and the suction path together with flux etc. by the suction means. . The sucked molten solder is stored in the solder removal filter provided in the middle of the suction path as follows.

That is, when a suction force is generated in the suction path by the suction means, this suction force causes the filter body to slightly elastically move in the axial direction within the extension space provided between the base end of the filter body and the felt member. As a result, the windings are slightly opened, forming a suction path continuous from the suction nozzle to the suction means. As a result, a flow of intake air is formed from the suction hole of the suction nozzle to the suction means through the gaps between the windings of the filter body, and the molten solder is suctioned along with this flow.

The flow of this intake air bends from the axial direction of the filter body toward the gap between the windings, but on the other hand, the molten solder moves along the axis of the filter body to the closed part at the proximal end due to inertia due to its own weight. Most of the particles collide with each other, solidify and accumulate in this area, and do not flow out of the filter body. This prevention of leakage is also achieved by setting the gaps between the windings to a size that does not allow the molten solder to pass through.

In addition, the filter body and felt member are consumables and are replaced with new ones periodically or at any time as the amount of solder accumulated in the solder removal filter increases over time. It is only necessary to remove the partially attached tip of the filter body.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

A solder sucking device according to the present invention is shown in FIG. 1, and the solder sucking device includes a device main body 4 including a sucking nozzle 1, a heating heater 2 as a heating means, a solder removal filter 3, etc. as main parts, and a suction means. It is composed of a station section which includes a certain vacuum pump 5 etc. as its main section.

The device main body 4 includes a pistol-shaped main body case 6, and the above-mentioned suction nozzle 1 and heating heater 2 are provided in the barrel portion at the tip of the device, and a heating wick 7 is provided on the outer periphery of the heater 2. is connected to the suction nozzle 1.

8 is a protection pipe.

A suction pipe 9 is communicated with the suction hole 1a of the suction nozzle, and the suction pipe 9 passes through the heating core 7 and has its base end connected to the communication hole 1a of the heater 2.
It is connected to a.

The heating heater 2 is specifically a ceramic heater, which can be connected to a predetermined power source via a power cord (not shown), and when connected to the power source, the temperature is raised and the suction nozzle 1 is heated.
is heated to a predetermined temperature.

The solder removal filter 3 is provided in the middle of the suction path A that continues to the vacuum pump 5 through the suction nozzle 1, the suction pipe 9, the communication hole 2a of the heater 2, and the connection tube 10, and is , the above-mentioned heater 2
and the connecting tube 1o. As shown in FIG. 2, the solder removal filter 3 mainly includes a filter pipe 11 forming a part of the suction path A, a filter body 12, and a felt member 13.

The filter pipe 11 is a cylindrical body interposed between the heater 2 and the connecting tube 10, and is detachable by a detachable mechanism 15. A connecting plug 16 is removably fitted into the tip opening 11a of the filter pipe 1,
The connection plug 16 communicates with the communication hole 2a of the heater 2 through the communication port 16a. The proximal end portion 16b of the connecting plug 16 has an outer diameter smaller than the inner diameter of the filter pipe 11, and the filter main body 12 is attached to this portion. Further, an annular wall 17 having a communication port 17a is formed in the rear end side opening 11b of the filter pipe 11, and the felt member 13 is covered with this annular wall 17 as a partition wall.

As shown in FIG. 2, the filter body 12 is shaped like a tension coil spring made of an elastic wire. Specifically, it is made of a hard steel wire coated with zinc plating. There is.

The main body portion 12a of the filter main body 12 is formed in the shape of a cylindrical coil spring in which windings are in close contact with each other, and the closing portion 12b at the proximal end thereof is formed in the shape of a conical coil spring. The outer diameter of filter pipe 12 is set to be slightly smaller than the inner diameter of filter pipe 11 . The spring elasticity of the main body portion 12a is set to such an extent that it expands in the axial direction due to the suction force of the vacuum pump 5, and a gap is created between each winding.
The spring elasticity is set so that no gap is created between the windings even by the above-mentioned attraction force.

The distal end portion 12c of the filter body 12 is removably connected to the outer circumferential surface of the proximal end portion 16b of the connecting plug 16 due to its spring elastic force. By fitting this connecting plug 16 into the tip opening 11a of the filter pipe 11,
The filter body 12 is encased concentrically within the filter pipe 11, and an annular space B forming a part of the suction path A is formed between them.

The felt member 13 is for adsorbing and removing impurities such as flux that have passed through the filter body 12, and is removably fitted into the rear end opening 11b of the filter pipe 11. Further, the felt member 13 is positioned by the annular wall 17 of the filter pipe 11,
Thereby, a space C having a predetermined axial distance is formed between the base end of the filter body 12 and the front surface of the felt member 13. This space C is the filter body 1
It functions as an elongation space for allowing elongation in the axial direction of No. 2 and regulating the amount of elongation.

Note that the axial distance of the space C is set according to the wire diameter of the hard steel wire rod, the number of turns, etc.
The gaps formed between each winding due to the expansion of the windings ensure an effective intake flow through which air and flux can pass.
In the illustrated example, the number is set to a value of 0 to prevent the passage of molten solder, and is set to about 1 to 5+n.

The vacuum pump 5 connects the suction nozzle 1 via the suction path A.
The device generates suction force, and its operation is controlled as appropriate by operating a trigger switch 18 provided on the main body 4 of the device.

Therefore, in the solder blotting operation using the solder blotting device configured as described above, the power cord of the heater 2 is connected to the power source, the blotting nozzle 1 is heated to a predetermined temperature, and then the solder is sucked off at the location where the solder is to be bloated. Apply to solder. When the solder is heated and melted, the trigger switch 18 of the device main body 4 is turned on, and the melted solder is sucked into the device through the suction path A and stored in the solder removal filter 3. do.

That is, when the vacuum pump 5 operates, the inside of the suction path A becomes a negative pressure state and a suction force is generated, whereby the filter body 12 of the solder removal filter 3 is moved within the range defined by the extension space C. It expands elastically in the axial direction, and the intervals between the windings change from the close contact state shown in FIG. 3(a) to the state shown in FIG. 3(a).
The separated state shown in b) is reached. As a result, a minute gap is formed between each winding of the filter body 12, and the suction path A from the suction nozzle 1 to the vacuum pump 5 is completely communicated with the suction hole 1a of the suction nozzle 1. , the vacuum pump 5 through the gap between each winding of the filter body 12.
A flow of intake air is formed leading to the molten solder, and the molten solder is sucked along with this flow.

At this time, the flow of the intake air curves from the axial direction of the filter body 12 toward the gap between each winding, and the air, flux, etc. sucked together with the molten solder also proceed along the flow of the intake air to the annular space B. It is attracted to the felt member 13. .

On the other hand, the molten solder moves straight along the axis of the filter body 12 due to inertia due to its own weight and collides with the proximal end-side closing portion 12b, and most of it adheres to this portion and solidifies and is deposited. Ru.

When the amount of solder stored in the filter main body 2 increases over time and the suction force of the solder sucking device decreases, the filter main body 12 is removed together with the stored solder and replaced with a new filter main body 12. At this time, since the filter body 12 is connected to the connection plug 16 only by the spring elastic force of its tip 12c, the replacement work is easy and quick. Further, the felt member 13 is also replaced as appropriate in synchronization with the filter body 12.

Note that the present invention is not limited to the above-mentioned embodiments,
The design can be changed as appropriate.

For example, the shape of the filter body 12 is not limited to that shown in FIG. 2, but may also be shaped as shown in FIG. 4 or FIG. 5. That is, the filter main body 12 in FIG.
It is formed in the shape of a cylindrical coil spring having the same diameter from its distal end to its proximal end, and the closing part 12 at the proximal end thereof
b is formed in the shape of a helical spring. Further, the filter body 12 shown in FIG. 5 is formed in the shape of a conical coil spring whose diameter decreases from its distal end toward its base end, and the mounting portion 12c on the distal end side is formed in the shape of a cylindrical coil spring.

Further, in the illustrated example, the entire filter body 12 is formed from a wire rod, but the closing portion 12b in particular may have a composite structure formed from another closing member such as a plate material.

(Effects of the Invention) As detailed above, according to the present invention, various excellent effects as listed below can be obtained, and the life of the filter components is extended (and their replacement work is easy). It is possible to provide a solder removal filter having a structure.

(1) A filter body is removably installed inside a filter pipe that forms part of the suction path of the solder suction device,
The filter body is composed of a cylindrical body formed by winding an elastic wire into the shape of a tension coil spring, and its proximal end is closed, and its distal end is part of the suction path. Since it is removably attached, the sucked molten solder can be reliably stored and fixed within the filter body.

In other words, the filter body slightly expands in the axial direction due to the suction force generated in the suction/take-in path by the suction means, and the flow of intake air in the suction path is directed from the axial direction of the filter body to the direction of the gap between each winding. However, due to the inertia caused by its own weight, the molten solder that is sucked collides with the closed part at the base end along the axis of the filter body, and most of it adheres to this part and solidifies and is deposited. Become.

(2) Since the structure is such that molten solder is stored in the closed part at the base end of the filter body, this molten solder closes the gaps formed between each winding in the main body part of the filter body, causing clogging. There is no fear. Therefore, the desired suction force can be maintained over a long period of time, the life of the filter body is long, and the amount of solder stored is much larger than in the past.

Therefore, the replacement cycle of the filter body is considerably longer than in the past, and running costs can be significantly reduced.

Incidentally, when the conventional solder removal filter with the structure shown in FIG. 6 and the solder removal filter of the present invention with the structure shown in FIG. As a result of measurement tests, it has been found that the amount of solder stored in the filter of the present invention is about 1.5 times that of the conventional filter.

(3) Since the structure is such that the molten solder sucked into the filter body does not flow out to the outside of the filter body, it does not leak to the inner peripheral surface of the filter pipe that constitutes the outer peripheral wall of the filter body or to the felt member downstream of the suction path. Adhesion of molten solder is reliably prevented.

Therefore, apart from replacing the filter body and the felt member, maintenance of the solder removal filter is almost unnecessary.

(4) The filter body has a structure in which the tip of the filter body is removably attached to a part of the suction path by the elastic force of a spring, so the replacement work can be done easily and quickly, and the workability is good. It is.

(5) When the filter body and the felt member are installed in the filter pipe, the filter body and the filter pipe are concentric, and an annular space forming a part of the suction path is formed between them. This allows the filter body to be extended smoothly and accurately along its axis by the suction force, and as a result, the flow of intake air becomes smooth, and the molten solder is reliably stored.

(6) Furthermore, an expansion space is provided between the base end of the filter body and the felt member to allow the filter body to expand in the axial direction and to regulate the amount of expansion, and this is set appropriately. As a result, the gaps formed between the windings of the filter body can be precisely controlled, and the molten solder can be reliably stored in the filter body and prevented from flowing out of the filter body.

[Brief explanation of drawings]

Fig. 1 is a front sectional view showing a solder sucking device equipped with a solder removal filter according to the present invention, Fig. 2 is an enlarged front sectional view showing the structure of the solder removal filter, and Fig. 3 fa) and mountain). 3 is a front sectional view for explaining the function of the filter body of the solder removal filter, FIG. 3(a) shows the normal state, and FIG. 3(b) shows the suction state. Figure 4 is a front sectional view showing a modified example of the filter body;
This figure is a front sectional view showing another modified example of the filter body, and FIG. 6 is a front sectional view showing the structure of a conventional solder removal filter. DESCRIPTION OF SYMBOLS 1... Suction nozzle, 1a... Sucking hole, 2... Heater (heating means), 3... Solder removal filter, 5...
...Vacuum pump (suction means), 7...Heating core, 11.
...Filter pipe, 12...Filter body, 12a
...Main body part, 12b...Closing part, 12c...Tip part (attachment part), 13...Felt member, 15...
attachment/detachment mechanism, 16... connection plug, 17... annular wall, A.
...Suction path, B...annular space, C...extension space

Claims (6)

[Claims] (1) Mounted on a solder sucking device that is equipped with a suction means and a heating means, and has a structure in which the solder heated and melted by the heating means is sucked into the interior from a suction hole of a suction nozzle through a suction path. A solder removal filter comprising: a filter pipe forming a part of the suction path; and a filter body removably installed inside the filter pipe, wherein the filter body is made of an elastic wire material. is composed of a cylindrical body wound into the shape of a tension coil spring, its proximal end is closed, and its distal end is removably attached to a part of the suction path. Features: Solder removal filter for solder blotting equipment. (2) When the filter main body and the felt member are installed in the filter pipe, the filter main body and the filter pipe are concentric, and a part of the suction path is formed between them. an annular space is formed between the proximal end of the filter body and the felt member;
2. The solder removal filter for a solder sucking device according to claim 1, further comprising an extension space for allowing extension of the filter body in the axial direction and regulating the amount of extension. (3) The solder removal filter for a solder blotting device according to claim 1 or 2, wherein the wire constituting the filter body is a hard steel wire coated with zinc plating. (4) The main body portion of the filter body is formed in the shape of a cylindrical coil spring, and the closing portion on the proximal end thereof is formed in the shape of a conical coil spring.
A solder removal filter for the solder blotting device according to any one of paragraphs. (5) The filter main body is formed in the shape of a cylindrical coil spring having the same diameter from its distal end to its proximal end, and the closed portion on the proximal end side is formed in the shape of a helical spring. The solder removal filter of the solder sucking device according to any one of Items 3 to 3. (6) The filter main body is formed in the shape of a conical coil spring whose diameter decreases from the distal end toward the base end, and the attachment portion on the distal end side is formed in the shape of a cylindrical coil spring. The solder removal filter of the solder sucking device according to any one of Items 3 to 3.