JPH0449779B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor sealing device for sealing semiconductor elements with resin.

[Conventional technology]

FIG. 2 is a perspective view of the main parts of a conventional semiconductor sealing device. In the figure, 1 is a runner block in which a runner 1c through which resin flows, etc., 1a is a dowel pin for positioning the runner block 1;
b is a mounting bolt that attaches the runner block 1 to the surface plate 4, 1c is a runner drilled in the runner block 1, 1d is a resin injection part bored in the runner block 1, and 2 is a semiconductor element (not shown). A cavity block in which a cavity 2e etc. for resin sealing is drilled, 2a is a knock pin for positioning the cavity block 2, 2b is a mounting bolt for attaching the cavity block 2 to the surface plate 4, 2
c is a runner bored in the cavity block 2, 2d is a gate bored in the cavity block 2, 2e is a cavity bored in the cavity block 2, and 3 is one end of the cavity block 2. The attached end plate, 3a is a mounting bolt that attaches the end plate 3 to the cavity block 2, and 4 is a surface plate to which the runner block 1, cavity block 2, and various other parts (not shown) are attached. .

Although not shown, there is a similar upper mold opposite to the lower mold shown in FIG. 2, and the semiconductor element is resin-sealed with the upper mold and the lower mold overlapping each other.

Next, the operation will be explained. A lead frame 6 (see FIG. 3) on which a plurality of semiconductor elements are fixed and wired is mounted on the cavity block 2. A resin injected from the resin injection part 1d of the runner block 1 (the injection mechanism is not shown) passes through the runners 1c and 2c, passes through the gate 2d, and is injected into the cavity 2e, thereby sealing the semiconductor element with the resin. There is also a cavity on the upper mold side opposite to the cavity 2e, and it goes without saying that sealing is performed in both cavities.

Note that the semiconductor encapsulation device is heated and kept at a temperature determined by the encapsulation material.

[Problem that the invention seeks to solve]

Since the conventional semiconductor encapsulation device is constructed as described above, the runner block 1 and the cavity may differ due to differences in thermal expansion coefficients between the cavity block 2 and the runner block 1 and the surface plate 4, as well as machining errors in the knock pin holes. A problem arises in that a gap is created between the lead frame 6 and the lead frame 2, and resin enters this gap and adheres to the end of the lead frame 6 to which it is attached.

In other words, the surface plate 4 is generally made of a material with a larger coefficient of thermal expansion than the runner block 1 and the cavity block 2, and due to the difference in heating temperature and thermal expansion during operation of the semiconductor encapsulation equipment. As a result, a gap is generated between the runner block 1 and the cavity block 2, and this, together with the machining error of the knock pin hole, causes resin to adhere to the part indicated by the symbol A of the lead frame 6, as shown in FIG. There was a problem that occurred.

This invention was made to solve the above problems, and even if there is a temperature difference, thermal expansion difference, machining error, etc. between the runner block or cavity block and the surface plate, the edge of the lead frame can be fixed. An object of the present invention is to obtain a semiconductor device in which resin does not adhere to the parts.

[Means for solving problems]

The semiconductor sealing device according to the present invention has an end plate attached to one end of a cavity block and located between the cavity block and the runner block.

[Function] Since the end plate is fixed to the runner block side end face of the cavity block in this invention with mounting bolts, there is no temperature difference, thermal expansion difference, or machining error between the surface plate and the runner block and the cavity block. Even if such a problem occurs, no gap will be generated between the cavity block and the end plate, and the resin will not flow out of the cavity block and adhere to the end of the lead frame.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, numerals 1 to 4 are similar to those in the conventional semiconductor sealing device shown in FIG. Reference numeral 5 designates an end plate that is fixed between the runner block 1 and the cavity block 2 with mounting bolts (not shown) so as to be on the opposite side from the end plate 3. On the upper surface of this end plate 5 are a runner 1c of the runner block 1 and a runner 2c of the cavity block 2.
A runner 5a is provided to connect the two. A lead frame (not shown) is mounted between the end plates 3 and 5.

Note that there is a similar upper die facing the lower die shown in Fig. 1, and sealing is performed with the upper die and the lower die overlapping each other, as in the case of conventional semiconductor encapsulation equipment. be.

In the semiconductor encapsulation device of this embodiment configured as described above, the cavity block 2 and the end plate 5 are fixed to each other with mounting bolts, and there is no difference in temperature with the surface plate 4, difference in thermal expansion, and processing error. Even if there is a problem such as that, there will be no gap between the cavity block 2 and the end plate 5, and the resin will not flow into and adhere to the end face of the lead frame installed between the end plates 3 and 5. .

Further, even if the width of the runner 1c on the runner block 1 side and the runner 2c on the cavity block 2 side are different in width, this can be accommodated by changing the width of the entrance/exit of the runner 5a of the end plate 5. Furthermore, even if a plurality of cavity blocks 2 have different overall lengths due to differences in the lengths of lead frames mounted thereon, the runner block 1
By changing the thickness of the end plate 5 between the lead frames, it is possible to match the center positions of multiple lead frames, and the center of pressure applied to them can be made to coincide, making it possible to apply uniform pressure. .

〔Effect of the invention〕

As described above, according to the present invention, the end plate located between the cavity block and the runner block is attached to one end of the cavity block. Even if there are temperature differences, thermal expansion differences, processing errors, etc., the semiconductor packaging does not allow resin to adhere to the ends of the lead frame, and can accommodate the differences in runner dimensions between the runner block and cavity block. This has the effect of providing a stopping device.

[Brief explanation of drawings]

FIG. 1 is a perspective view of essential parts of a semiconductor encapsulation device according to an embodiment of the present invention, FIG. 2 is a perspective view of a conventional semiconductor encapsulation device, and FIG. 3 is a perspective view of the semiconductor encapsulation device of FIG. FIG. 3 is a diagram showing how resin is attached to the end of the lead frame by the device. 1 is a runner block, 2 is a cavity block, 3 and 5 are end plates, and 4 is a surface plate. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] 1. The upper mold and the lower mold are each provided with a runner block in which a runner or the like through which resin flows is bored, and a cavity block in which a cavity or the like for sealing a semiconductor element with resin is bored. 1. A semiconductor encapsulation device according to the present invention, wherein an end plate is attached to one end of the cavity block and located between the cavity block and the runner block. 2. The semiconductor encapsulation device according to claim 1, wherein a plurality of cavity blocks are provided for one runner block.