JPH0449908B2 - - Google Patents
Info
- Publication number
- JPH0449908B2 JPH0449908B2 JP11856085A JP11856085A JPH0449908B2 JP H0449908 B2 JPH0449908 B2 JP H0449908B2 JP 11856085 A JP11856085 A JP 11856085A JP 11856085 A JP11856085 A JP 11856085A JP H0449908 B2 JPH0449908 B2 JP H0449908B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- humidity
- sensitive film
- moisture
- upper electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、湿度を測定する湿度素子に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a humidity element for measuring humidity.
［従来の技術］
従来、湿度素子として、基板上に下部電極、感
湿膜、上部電極を形成し電極間の感湿膜の容量変
化から湿度を測定する湿度素子が知られている。[Prior Art] Conventionally, a humidity element is known in which a lower electrode, a moisture-sensitive film, and an upper electrode are formed on a substrate, and humidity is measured from a change in the capacitance of the humidity-sensitive film between the electrodes.
そして、各電極からリード線により容量信号を
取り出すのであるが、透湿性を有するAu等の薄
膜よりなる上部電極とリード線の接続に導電性接
着剤を用いたり、導電ゴム、バネ等を利用し、リ
ード線をAu薄膜に機械的に押圧したりしていた。 Capacitance signals are then extracted from each electrode using lead wires. Conductive adhesives, conductive rubber, springs, etc. are used to connect the lead wires to the upper electrode, which is made of a thin film such as Au that has moisture permeability. , the lead wire was mechanically pressed against the Au thin film.
［この発明が解決しようとする問題点］
しかしながら、導電性接着材では、吸湿、乾燥
のくり返しにより劣化を生じやすく、機械的押圧
では、機械的に力を加えているため導電ゴムの疲
労による接触不良、振動による接触不良等の不具
合を生じていた。[Problems to be Solved by the Invention] However, conductive adhesives are prone to deterioration due to repeated moisture absorption and drying, and with mechanical pressing, contact due to fatigue of the conductive rubber occurs due to the mechanical force applied. There were problems such as defects and poor contact due to vibration.
この発明の目的は、以上の点に鑑み、湿度素子
のリード線の接続、取り出しを強固に可能とした
湿度素子を提供することである。 In view of the above points, it is an object of the present invention to provide a humidity element that allows the lead wires of the humidity element to be firmly connected and taken out.
［問題点を解決するための手段］
この発明は、感湿膜上の一部にCr層を形成し、
感湿膜上にAu等よりなる電極膜を形成し、Cr層
または感湿膜上にNi層を形成し、このNi層に低
温ハンダによりリード線を接続するようにした湿
度素子である。[Means for solving the problem] This invention forms a Cr layer on a part of the moisture sensitive film,
This is a humidity element in which an electrode film made of Au or the like is formed on a humidity-sensitive film, a Ni layer is formed on a Cr layer or a humidity-sensitive film, and a lead wire is connected to this Ni layer by low-temperature solder.
［実施例］
第１図は、この発明の一実施例を示す構成説明
図である。[Embodiment] FIG. 1 is a configuration explanatory diagram showing an embodiment of the present invention.
図において、１は、円筒状の金属パイプ等によ
りなる下部電極で、この下部電極１の外周に高分
子等によりなる感湿膜２をデイツピング等により
形成し、さらに感湿膜２上に蒸着等でAu等の透
湿性薄膜よりなる上部電極３を形成している。こ
の下部電極１、上部電極３にリード線４を接続
し、電極１、３間の感湿膜２の容量値変化から湿
度の測定を行つている。なお、下部電極１として
平板状のものでもよく、また、絶縁性の円筒また
は平板上の基板上更に下部電極を形成するように
してもよい。 In the figure, reference numeral 1 denotes a lower electrode made of a cylindrical metal pipe, etc. A moisture-sensitive film 2 made of a polymer or the like is formed on the outer periphery of the lower electrode 1 by dipping or the like, and then vapor-deposited or the like on the moisture-sensitive film 2. The upper electrode 3 is formed of a moisture permeable thin film such as Au. A lead wire 4 is connected to the lower electrode 1 and the upper electrode 3, and the humidity is measured from the change in the capacitance of the humidity sensitive film 2 between the electrodes 1 and 3. Note that the lower electrode 1 may be in the form of a flat plate, or the lower electrode may be further formed on an insulating cylindrical or flat substrate.
第２図、第３図は、リード線４の接続部の詳細
を示し、第２図において、下部電極１の感湿膜２
の一部に付着力の良好なCr層５を形成し、さら
に感湿膜２の全体およびCr層５上に上部電極３
を形成し、そして、上部電極３、Cr層５上にNi
層を形成する。このハンダ付が良好なNi層に低
温ハンダ７によりリード線４を接続する。 2 and 3 show details of the connecting portion of the lead wire 4, and in FIG. 2, the moisture sensitive film 2 of the lower electrode 1 is
A Cr layer 5 with good adhesion is formed on a part of the moisture sensitive film 2 and an upper electrode 3 is formed on the entire moisture sensitive film 2 and the Cr layer 5.
Then, Ni is formed on the upper electrode 3 and the Cr layer 5.
form a layer. Lead wires 4 are connected to this well-soldered Ni layer with low-temperature solder 7.
第３図においては、Ni層６をCr層５上のみに
形成し、低温ハンダ７によりリード線４を接続し
ている。 In FIG. 3, the Ni layer 6 is formed only on the Cr layer 5, and the lead wires 4 are connected by low-temperature solder 7.
このようにして、Cr層５により感湿膜２、上
部電極３との付着力を高め、Ni層６によりハン
ダ付を強固にしている。 In this way, the Cr layer 5 increases the adhesion between the moisture sensitive film 2 and the upper electrode 3, and the Ni layer 6 strengthens the soldering.
［発明の効果］
以上述べたように、この発明は、Cr層、Ni層
を利用して付着力を高め、直接リード線と電極と
を接続しているので、接着剤と比べて接続が強固
であり、押圧等の方法と比べて接触不良はなく、
きわめて確実にリード線の接続が可能となる。[Effects of the Invention] As described above, this invention utilizes a Cr layer and a Ni layer to increase the adhesion and directly connect the lead wire to the electrode, so the connection is stronger compared to adhesives. Compared to methods such as pressing, there is no contact failure.
Lead wires can be connected extremely reliably.
第１図、第２図、第３図は、この発明の一実施
例を示す構成説明図である。
１……下部電極、２……感湿膜、３……上部電
極、４……リード線、５……Cr層、６……Ni層、
７……低温ハンダ。
FIG. 1, FIG. 2, and FIG. 3 are configuration explanatory diagrams showing one embodiment of the present invention. 1... Lower electrode, 2... Moisture sensitive film, 3... Upper electrode, 4... Lead wire, 5... Cr layer, 6... Ni layer,
7...Low temperature solder.
Claims (1)
変化から湿度を測定する素子において、感湿膜上
の一部に形成されたCr層と、感湿膜およびCr層
上に形成されたAu等よりなる上部電極と、Cr層
または上部電極上に形成されたNi層と、Ni層に
低温ハンダにより接続するリード線とを備えた湿
度素子。1 In an element that measures humidity from a change in capacitance of a moisture-sensitive film between an upper electrode and a lower electrode, a Cr layer formed on a part of the humidity-sensitive film and an Au layer formed on the humidity-sensitive film and the Cr layer are used. A humidity element comprising an upper electrode consisting of a Cr layer or a Ni layer formed on the upper electrode, and a lead wire connected to the Ni layer by low-temperature solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11856085A JPS61277046A (en) | 1985-05-31 | 1985-05-31 | Humidity element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11856085A JPS61277046A (en) | 1985-05-31 | 1985-05-31 | Humidity element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61277046A JPS61277046A (en) | 1986-12-08 |
| JPH0449908B2 true JPH0449908B2 (en) | 1992-08-12 |
Family
ID=14739613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11856085A Granted JPS61277046A (en) | 1985-05-31 | 1985-05-31 | Humidity element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61277046A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI98861C (en) * | 1994-01-18 | 1997-08-25 | Vaisala Oy | A method of manufacturing a microporous gas-permeable electrode and a microporous gas-permeable electrode |
| JP5385657B2 (en) * | 2009-03-27 | 2014-01-08 | 株式会社堀場製作所 | Gas sensor |
-
1985
- 1985-05-31 JP JP11856085A patent/JPS61277046A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61277046A (en) | 1986-12-08 |
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