JPH04500241A - Method and apparatus for depositing coatings on supports in vacuum - Google Patents
Method and apparatus for depositing coatings on supports in vacuumInfo
- Publication number
- JPH04500241A JPH04500241A JP1509077A JP50907789A JPH04500241A JP H04500241 A JPH04500241 A JP H04500241A JP 1509077 A JP1509077 A JP 1509077A JP 50907789 A JP50907789 A JP 50907789A JP H04500241 A JPH04500241 A JP H04500241A
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- support
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- section
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Links
- 238000000576 coating method Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 11
- 238000000151 deposition Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims description 23
- 230000008020 evaporation Effects 0.000 claims description 18
- 238000001704 evaporation Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 238000009826 distribution Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WJCRZORJJRCRAW-UHFFFAOYSA-N cadmium gold Chemical compound [Cd].[Au] WJCRZORJJRCRAW-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 真空中で支持体へ皮膜を蒸着するための方法と装置不発明は、真空中で支持体へ 皮膜金蒸着する念めO方法番で関し、該方法に少なくとも1種の皮膜材料を加熱 することによって得られた蒸気を被覆すべき支持体表面上\凝縮さ、せる前(( 熱い壁間を案内することより成り、壁は案内長さにわたって少なくともほぼ一定 の流過横断面を形成している。更に本発明はこの方法全実施するための装置(C 関する。[Detailed description of the invention] A method and apparatus for depositing a coating on a support in a vacuum is disclosed. In order to deposit gold coatings, the method involves heating at least one coating material. The vapor obtained by condensing onto the surface of the support to be coated (before consisting of guiding between hot walls, the walls being at least approximately constant over the guiding length. It forms a flow cross section. Furthermore, the present invention provides an apparatus (C related.
例えば半導体素子の製作に関して支持体上にエピタキシャルat設ける際に材料 品質に対する高0要求を満こさせ得るため(′cは、エピタキシャルHt IK ?中で蒸気相から支持体上ンで成長させる。この目的のためには被覆材料を蒸発 室内で蒸発させ、かつ蒸zを比較的小さな横断面を持つ開口を通して真空室内へ 流出づせることが知られており、真空室内でl−i被覆すべき支持体が蒸発室か ら所定の距離金属いて保持されているので、支持体へ違した蒸気は被覆すべき支 持体表面′\、温度状態に依存する成長速度、し念がって蒸気@度と支持体温度 を介して調節可能である成長速度で凝縮する。蒸発室の出口開口は流出する蒸気 流に関する絞り開口を形成しており、これでもって蒸気流を支持体へ向けること ができる。蒸気室から流出する蒸気流の蒸気のVB度の、流過横断面にわたって の均一な分布が得られないので、一様な襖厚?得るに、は被覆−rべき支持体表 面全支持体の範囲における蒸77流の流過横断面よりも著しく小さく選択しなけ ればならず、蒸発された材料は僅かしか利用されないのでこれはエピタキシャル 膜の形成には高すぎる材料消費をも念らすことになる。For example, when providing an epitaxial layer on a support in the production of semiconductor devices, the material In order to satisfy the high quality requirements ('c is epitaxial Ht IK ? grown on the support from the vapor phase in the medium. For this purpose evaporate the coating material Evaporate it indoors, and pass the vapor into the vacuum chamber through an opening with a relatively small cross section. It is known that the substrate to be coated in the vacuum chamber is exposed to the evaporation chamber. Since the metal is held at a predetermined distance from the support, vapor escaping onto the support will be absorbed by the support to be coated. The growth rate depends on the support surface'\, temperature conditions, and the steam temperature and support temperature. The growth rate is adjustable through condensation. The outlet opening of the evaporation chamber allows the steam to flow out. Forms a flow restriction aperture that directs the vapor flow toward the support. Can be done. VB degrees of steam in the steam stream leaving the steam chamber, over the flow cross-section Since a uniform distribution of the fusuma cannot be obtained, is there a uniform thickness of the fusuma? To obtain, the coating-r should be the support surface. It must be chosen to be significantly smaller than the flow cross-section of the vapor stream in the area of the entire surface support. This is an epitaxial The formation of membranes also requires too high a material consumption.
皮膜の容積に比べて亮い材料使用を減少せL2めるためには、蒸発室から流出す る被覆材料の蒸気を顎熱された管内で導くことが知られており、管(・づ、出口 側で被覆すべき支持体を受容している。このように熱い壁間で蒸気益金案内する ことは(相対的に高い壁温度のために壁では蒸気がjj!縮することはな(へ) 、蒸発室と支持体との間1で少な(ともほぼ閉じられた蒸気案内が得られること なので材料消費を制限するが、蒸気の密度が管の流過横断面にわたりて不均一に 分布するので面倒な手段を講じなければ比較的大きな支持体表面を一様に被覆す ることはできなめ。その上に支持体が隣接の熱い壁1てよって不所望な形でエピ タキシャル勝の成長に有利な表面温度を上回る温度まで加熱される危険がある。In order to reduce the use of bright materials compared to the volume of the film, the amount of material flowing out of the evaporation chamber is It is known that the vapor of the coating material used in the coating is guided in a tube heated by the jaws, and the The side receives the substrate to be coated. In this way, steam profit guides between hot walls The thing is (because of the relatively high wall temperature, steam does not contract at the wall) , between the evaporation chamber and the support 1 a small (and almost closed) vapor guide is obtained. This limits material consumption, but also prevents the vapor density from becoming non-uniform across the flow cross-section of the tube. Because of the distribution, it is possible to uniformly cover a relatively large support surface unless complicated measures are taken. I can't do that. On top of that, the support is epitomized in an undesirable manner by the adjacent hot wall 1. There is a danger that it will be heated to a temperature that exceeds the surface temperature that is favorable for the growth of taxial growth.
しtがって本発明の課題は、上記の欠点を回避し、かつ比較的大きな支持体表面 も少なくとも1つの蒸発させた被覆材料で有利な材料利用の下に一様に被覆する ことが保証される方法を提供することである。The object of the invention is therefore to avoid the above-mentioned disadvantages and to provide a relatively large support surface. is coated uniformly with at least one evaporated coating material with advantageous material utilization. The objective is to provide a method that guarantees that
上記の課題を解決するための本発明の手段は、冒頭に記載された形式の方法から 出発して蒸気が分子の自由な流動状態の下に熱い壁間を出る前に蒸気を先ず流過 横断面の最小直径の1′V2倍に相当する長さ以上の長さにわたって熱い壁間を 案内し、かつ出口側で熱い壁によって形成された流過横断面の最小直径の肴から 2 V2倍に等しい平均流動距離全通過後に被覆すべき支持体表面上へ凝縮させ ることよ構成る。The means of the invention for solving the above-mentioned problem arise from a method of the type mentioned at the outset. The steam is first passed through before leaving and exiting between the hot walls under a free-flowing state of molecules. between hot walls over a length equal to or more than 1'V2 times the minimum diameter of the cross section. From the minimum diameter of the flow cross section formed by the guiding and hot wall on the exit side 2 Condensation onto the surface of the support to be coated after passing the entire average flow distance equal to V2 times It is composed of things.
被覆材料蒸気全熱い壁間全この壁によって形成される流過横断面の最小直径の少 なくとも1V2倍に相当する長さにわ几って案内することは、先ず、分子の自由 な運動状報が配慮された場合に分子の流れのある程度の平行化を可能にする、そ れというのもこの場合には特に少なくとも熱い壁によって規定された流れの軸線 の方向に移動する蒸気分子のみが熱い壁によって形成された流路を出ることがで きるからである。この平行化効果を比較的多数の分子の粒子の衝突によって損わ ないためには分子の自由な流動状態が維持されなければならない。したがってこ のような流動状態に関しては被覆材料の蒸気分子もしくは原子の平均の自由路長 が少なくとも流過横断面の最少直径に相当するという条件が満たされなければな らない。複数の被覆材料を使用する場合には、この条件は最小の平均自由路長を 有する被覆材料に該当する。蒸気の分子粒子の平均自由路長は著しく蒸気温度に 依存するので、要求される分子の自由な流動状態も簡単な方法で適切な温度制御 を介して維持することができる。The minimum diameter of the flow cross-section formed by this wall is Carefully guiding the length to a length equivalent to at least 1V2 times requires the freedom of molecules. It is possible to parallelize the flow of molecules to some extent if the motion information is taken into account. This is because in this case, in particular, at least the flow axis defined by the hot wall Only vapor molecules moving in the direction of can exit the channel formed by the hot wall. This is because it can be done. This collimation effect is impaired by collisions of relatively large numbers of molecular particles. In order to avoid this, a state of free flow of molecules must be maintained. Therefore this For flow conditions such as , the average free path length of the vapor molecules or atoms of the coating material must correspond to at least the minimum diameter of the flow cross section. No. When using multiple cladding materials, this condition determines the minimum mean free path length. This applies to coating materials that have The mean free path length of the molecular particles of steam changes significantly with the steam temperature. The required free flowing state of the molecules also depends on the appropriate temperature control in a simple manner. can be maintained through.
ただし熱い壁間金山た蒸気はここ全出た直後にではなく、一定の流動距離を通過 後に被覆すべき支持体表面へ凝縮せしめられる。すなわち熱い壁の流出端部がら 一定の距離範囲内にある遠距離フィールド内における密度の分布に比べて近距離 フィールド内において比較的大きな流過横断面にわたって均一な密度分Sが得ら れ、そのために近距離フィールドの範囲内では比較的大きな支持体表面にもエピ タキシャル膜を一様に設けることができる。熱い壁の流出端部のW!囲における 流過横断面の最小直径の偽から21/2倍の距離範囲内においてこの効果を有利 に利用することができ、分子の粒子の密度は流れの軸線からの距@が大きくなる と均一な密度分布に続いて急激に低下し、し念がってこれによって生じる材料損 失は限られた範囲にとどまり、かつ−、傑な被覆の要求と良好な材料利用の要求 とを有利に結び付けることができる。However, the hot steam between the walls passes through a certain flow distance, not immediately after it leaves. It is then allowed to condense onto the substrate surface to be coated. i.e. hot wall outflow end The distribution of density in the far field within a certain distance range A uniform density S is obtained over a relatively large flow cross section within the field. Therefore, within the range of the near field, even relatively large support surfaces can be epitaxially The taxial film can be uniformly provided. W at the outflow end of the hot wall! in the surroundings This effect is advantageous within a distance range of 21/2 times from the minimum diameter of the flow cross section. The density of molecular particles increases as the distance from the flow axis increases. The uniform density distribution is followed by a sudden drop, and the material loss caused by this should be avoided. loss is limited to a limited extent and - requires excellent coverage and good material utilization. can be advantageously linked.
本発明の構成ではエピタキシャル膜の特に有利な成長条件は熱い壁間から出た蒸 気が被覆すべき支持体表面へ凝縮する前に、出口側で熱い壁によって形成された 流過横断面の最小直径の1倍から11/2倍に相当する平均流動路@を自由に流 れることによって保証される、それというのもこの距離の関係では支持体上での 皮膜の一様な成長に関して、かつ材料利用に関して最適化が保証されるからであ る。In the configuration of the invention, particularly advantageous growth conditions for the epitaxial film are The air formed by the hot wall on the exit side before condensing onto the support surface to be coated Flow freely through an average flow path @ corresponding to 1 to 11/2 times the minimum diameter of the flow cross section. This distance relationship guarantees that the This ensures optimization with respect to uniform growth of the film and with regard to material utilization. Ru.
本発明による方法を実施するためには、真壁室中1′C設けらハた蒸発室少なく とも1つと流路の軸線方向上に配置さi″L7′C,、被覆すべき支持本のため のホルダと全1□えた装置であって、上記の蒸発室が少なくともほぼ一定の流過 横断面金持つ流路全形成する即熱可能な壁間へ連通した形式のものから山登する 。この装!!lは、FI熟熱可能壁間の流路O長さが流路の最小直径の少なくと も1V′2倍に相当し、かつホルダが支持体位宜にig して・つ蕃路、つ出口 端部からの距@が流路の出口横断面・、:)最・Js :i i Iτ)七゛2 から217/′2倍の量となSように真空室内(・こ配tさt′Lるように構成 される。加熱可能な壁上流動プ5 (Ffi+で適切に設定し、かつ被覆すべき 支持体の7也ど〕Lつホτ・々゛全全絡路出口端部から所定・つ距離の;17T +・で配置すSこと(二より支持体の範囲内で、しかも熱い壁間ψつ庵路の出口 開口の横断面(て相当する横断面にわたって、均一、な密度分布全頁する蒸気の 流〕1が必然的(で達成される。このこと1・−1流路の軸線方向でみて渭]つ た、被覆すべさ支持体と流路の出口端部との間の距離が流路の出口横断面の奢少 直径の1〜11z′2倍(て相当てる場合に特に該当゛する。In order to carry out the method according to the invention, it is necessary to provide at least 1'C of evaporation chamber in the Makabe chamber. Both one and i″L7′C, placed in the axial direction of the channel, for the supporting book to be covered. holder and a total of 1 □, wherein said evaporation chamber has at least a substantially constant flow rate. Climb the mountain from a type that has a cross-sectional metal and has a complete flow path that can be heated immediately and communicates between walls. . This outfit! ! l is the length of the flow path O between the FI heatable walls that is at least the minimum diameter of the flow path. is also equivalent to 1V'2 times, and the holder is set according to the position of the support. The distance from the end is the outlet cross section of the flow path. The vacuum chamber is configured so that the amount is 217/'2 times the amount S be done. Heatable wall-mount fluid pipe 5 (should be properly set up and covered with Ffi+) 7 points of the support 7T +・S (within the range of the second support, and between the hot walls ψ the exit of the hermitage) A uniform density distribution over the cross section of the aperture (which corresponds to the cross section) Flow] 1 is necessarily achieved with 1.-1. In addition, the distance between the support to be covered and the outlet end of the channel is determined by the width of the outlet cross section of the channel. This is especially true when the diameter is 1 to 11z'2 times the diameter.
これと関連しては流路[てついては一般に円形横断面が配慮されること1述べな けねばならない。し、tがって熱い壁は相応ずS管によって形成することができ る。In this regard, it should be mentioned that the flow path [generally has a circular cross section]. I have to go. However, the hot wall can correspondingly be formed by an S-tube. Ru.
しかし円形横断面とは異なる輪郭形状を持つ支持体については他の、支持体のそ の輪郭形状に適合された横断面形状も流路に関して配置することができ、しかも 流路を閉じた形で熱い壁によって形成する必要はない。However, for supports with a contour shape different from a circular cross section, other A cross-sectional shape adapted to the contour shape of can also be arranged with respect to the flow path, and There is no need for the flow path to be formed in a closed manner by hot walls.
蒸気流全熱い壁間を十分に案内することが必要であるにすぎケしン。It is necessary to guide the steam flow thoroughly between the hot walls.
図面に基いて本発明による方法について詳述される。The method according to the invention will be explained in detail on the basis of the drawings.
図面シては真空中で支持体上に皮it蒸着するための本発明にXる装置が軸線1 含む略示断面図で示されている。The drawing shows an apparatus according to the invention for depositing a film on a support in vacuum with axis 1 It is shown in a schematic cross-sectional view including:
図示の実施例による装置は王に1点鑓線で略示されたにすぎな0.lE空室1を 備えており、真空室は最高101ミリバールの残留ゴスEt有する。被覆すべき 支持体6Kff数の被覆材料から成るエピタキシャル膜を設けSことができるよ うに真空室1内の石英管5内に同心的な蒸発室2,3.4が配置きれている。蒸 発室2 、3. 、4の7ID熱のためにこれらにはヒータ7.8゜9が配属さ れでおり、ヒータはそれぞれ石英管5の周囲に分配された、対応する接続リング 11間の電気的な抵抗加熱導体10を備えている。これらのヒータγ。The device according to the illustrated embodiment is shown only schematically by a dotted line. lE vacancy 1 The vacuum chamber has a residual Goss Et of up to 101 mbar. should be covered The support can be provided with an epitaxial film consisting of a coating material with a number of 6 Kff. Concentric evaporation chambers 2, 3.4 are arranged within a quartz tube 5 within a vacuum chamber 1. steaming Release room 2, 3. , a heater 7.8°9 is assigned to these for 7ID heat of 4. The heaters each have a corresponding connecting ring distributed around the quartz tube 5. 11 is provided with an electrical resistance heating conductor 10 between them. These heaters γ.
8.91は複数のモリブデン遮蔽体12によって外側から遮蔽されており、モリ ブデン遮蔽体は抵抗加熱導体10を包理している。8.91 is shielded from the outside by a plurality of molybdenum shields 12, and The budene shield encloses the resistive heating conductor 10.
蒸発室2,3.4は管13に連通しており、管は下端の範囲に蒸発室2全形成し ており、かつ管の壁14は同様(でシて加熱装置2t−介して加熱することがで きる。加熱装置は比較可能な形式と方法で接続リング11間に配置された抵抗加 熱導体10から構成されている。この管13は熱い壁14でもって蒸発室2,3 ゜4から得られた蒸気のための流路161i−形成している。The evaporation chambers 2, 3.4 communicate with a pipe 13, which has an evaporation chamber 2 completely formed in the region of its lower end. and the tube wall 14 can be similarly heated via the heating device 2t. Wear. The heating device is a resistive heating device arranged between the connecting rings 11 in a comparable form and manner. It is composed of a thermal conductor 10. This tube 13 has hot walls 14 and is connected to the evaporation chambers 2, 3. A flow path 161i- is formed for the steam obtained from .degree.4.
蒸気は管13の出口端部17から真空室1内に流出し、かつ自由流路を進んだ後 に出口端部17から距離を置いてホルダ18内に配電され九支持体6の被覆すべ き表面上に凝縮せしめられる。エピタキシャル膜の成長速度に材料の蒸気圧およ び支持体64の温度を介して制御され、その穴めに支持体にはヒータ19が配属 されている。After the steam exits into the vacuum chamber 1 from the outlet end 17 of the tube 13 and follows a free flow path, The electrical power is distributed within the holder 18 at a distance from the outlet end 17 at a distance from the outlet end 17. condenses on the surface. The growth rate of epitaxial films depends on the vapor pressure and and the temperature of the support 64, and a heater 19 is assigned to the support through the hole. has been done.
管13の出口端部11と支持体6のためのホルダ18との間には軸20を中心に して回転調節移動可能なシャッタ21が設けられ、シャッタを介して被覆過程の 開始と終了を厳密に決めることができる。Between the outlet end 11 of the tube 13 and the holder 18 for the support 6 there is a A rotatably adjustable and movable shutter 21 is provided, and the coating process is controlled through the shutter. You can define the exact start and end.
実施例によれば支持体6はヒ化がリウムの直径25鎮のディスクから成る。この ヒ化がリウムーディスクにテルル化カドミウム@全設ける場合、テルル化カドミ ウム嗅は要求に応じてテルルないしはカドミウムを僅かな過剰量でドーピングす る。そのためには主被覆材料のテルル化カドミウム金蒸発室2に、かつ被覆材料 テルルとカドミウム金蒸発室3と4に装入する。蒸発室2は温度460〜520 ℃に、蒸発室3は温度350〜420℃に、かつ蒸発室4は温度250〜300 ℃に加熱され、その結果材料から出した蒸気分子は蒸発室2,3.4から管13 内の流路16内へ到達する。管13の壁14は温度520〜570℃に加熱され る。管13は直径約50龍および蒸気流のための胃効案内長さ約9011□を有 している。管13の出口端部1Tと被覆すべき支持体6との間の距@は45nに 選択されている。According to the exemplary embodiment, the support 6 consists of a disk of arsenide with a diameter of 25 cm. this If arsenide is placed on a lithium disk with cadmium telluride @ all, cadmium telluride Um-sniffing can be doped with tellurium or cadmium in a slight excess upon request. Ru. For this purpose, the main coating material cadmium gold telluride evaporation chamber 2 and the coating material Charge tellurium and cadmium to gold evaporation chambers 3 and 4. Evaporation chamber 2 has a temperature of 460 to 520 ℃, the temperature of the evaporation chamber 3 is 350 to 420℃, and the temperature of the evaporation chamber 4 is 250 to 300℃. ℃ and the resulting vapor molecules emitted from the material pass from the evaporation chamber 2, 3.4 to the tube 13. It reaches the inside of the flow path 16 inside. The wall 14 of the tube 13 is heated to a temperature of 520-570°C. Ru. The tube 13 has a diameter of about 50 mm and a length of gas flow guide for steam flow of about 9011□. are doing. The distance between the outlet end 1T of the tube 13 and the support 6 to be coated is 45n. Selected.
支持体6が温度200〜450℃に加熱された後、シャッタ21は旋回せしめら れて蒸気の流路から外され、かつ管13へ向けられた支持体6の表百が被覆され る。支持体温度350℃および主被覆材料の温度500℃でエピタキシャル膜の 成長速度2.5μm / hが達成され、しかも一様な膜厚が得られた。支持体 表面にわたって光学的および機械的に測定された膜厚の偏差は4%よりも小さく 、測定方法の測定精度のために測定されない。After the support 6 is heated to a temperature of 200 to 450°C, the shutter 21 is rotated. The surface of the support 6 which is removed from the steam flow path and directed towards the pipe 13 is coated. Ru. The epitaxial film was formed at a support temperature of 350°C and a main coating material temperature of 500°C. A growth rate of 2.5 μm/h was achieved, and a uniform film thickness was obtained. support Deviation in film thickness measured optically and mechanically across the surface is less than 4% , not measured due to the measurement accuracy of the measurement method.
皮喚の蒸着の間真空室内では残留がス圧約10−10ミリバールが維持された。A residual gas pressure of approximately 10-10 mbar was maintained in the vacuum chamber during the deposition of the skin.
本発明が図示の実施例に限定されるものではないことは詳述するまでもない。例 えば支持体6のためのホルダ18は、大面積の支持体の場合に一様な膜厚t−得 るために公知の形式で付加的に移動させることができる。It goes without saying that the present invention is not limited to the illustrated embodiment. example For example, the holder 18 for the support 6 can be used to obtain a uniform film thickness t in the case of large-area supports. It can be additionally moved in a known manner in order to
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Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT211088A AT392486B (en) | 1988-08-29 | 1988-08-29 | METHOD AND DEVICE FOR EVAPORATING A COATING ON A CARRIER IN A VACUUM |
| AT2110/88 | 1988-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04500241A true JPH04500241A (en) | 1992-01-16 |
Family
ID=3527991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1509077A Pending JPH04500241A (en) | 1988-08-29 | 1989-08-29 | Method and apparatus for depositing coatings on supports in vacuum |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0431021A1 (en) |
| JP (1) | JPH04500241A (en) |
| AT (1) | AT392486B (en) |
| WO (1) | WO1990002214A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361591A (en) * | 1964-04-15 | 1968-01-02 | Hughes Aircraft Co | Production of thin films of cadmium sulfide, cadmium telluride or cadmium selenide |
| CH626407A5 (en) * | 1977-07-08 | 1981-11-13 | Balzers Hochvakuum | |
| DE3204337A1 (en) * | 1981-02-10 | 1982-11-04 | Fuji Photo Film Co., Ltd., Minami-Ashigara, Kanagawa | Process and apparatus for forming a thin film |
| JPS62500110A (en) * | 1984-06-12 | 1987-01-16 | キエフスキ ポリテヒニチェスキ インスティテュト イメニ 50−レティア ベリコイ オクトヤブルスコイ ソツィアリスティチェスコイ レボリュツィイ | Evaporator for depositing films in vacuum |
-
1988
- 1988-08-29 AT AT211088A patent/AT392486B/en not_active IP Right Cessation
-
1989
- 1989-08-29 EP EP19890909676 patent/EP0431021A1/en not_active Withdrawn
- 1989-08-29 JP JP1509077A patent/JPH04500241A/en active Pending
- 1989-08-29 WO PCT/AT1989/000077 patent/WO1990002214A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| AT392486B (en) | 1991-04-10 |
| WO1990002214A1 (en) | 1990-03-08 |
| ATA211088A (en) | 1990-09-15 |
| EP0431021A1 (en) | 1991-06-12 |
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