JPH0450677A - Method for measuring components mounted on printed circuit board - Google Patents

Abstract

PURPOSE:To shorten the time required in the measurement of one printed circuit board by respectively measuring the respective mounting parts of respective measuring areas when the respective measuring areas correspond to moving probe units. CONSTITUTION:A Y-direction rail is mounted on an X-direction rail in a manner freely movable in an X-direction and moving probes 8, 8 are mounted on the Y-direction rail in a manner freely movable in a Y-direction. The moving data of the respective moving probes 8 in respective moving probe units to measuring points are applied from a moving probe control unit. The respective measured data are combined to judge the quality of the first printed circuit board. This operation is successively repeated to measure each printed circuit board.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention is used to check whether components mounted on a printed circuit board are correctly mounted, whether defective components are mounted, or whether there is a short open between adjacent measurement points. The present invention relates to a method for measuring components mounted on a printed circuit board, which measures whether or not there are any parts that are damaged.

(Prior Art) Conventionally, measurements of components mounted on a printed circuit board, such as resistors, capacitors, coils, diodes, and transistors, have been carried out by moving a probe one component at a time and repeating the measurement each time.

(Problem to be Solved by the Invention) However, in such conventional measurement, the inspection of one printed circuit board is not completed unless the probe bin moves by the number of parts to be measured, so there is a problem that measurement takes time. An object of the present invention is to provide a method for measuring components mounted on a printed circuit board that can efficiently measure components mounted on a printed circuit board.

(Means for Solving the Problems) To explain in detail the present invention for achieving the above object, the method for measuring components mounted on a printed circuit board according to the present invention includes:
The printed circuit board is divided into first to nth measurement areas, and the first to nth measurement areas are dedicated for measuring the first to nth measurement areas along the moving direction of the conveyor that conveys the printed circuit board. A movable probe unit is arranged, and the mounted component in the first measurement area is measured with the first movable probe unit at a position where the first measurement area of the printed circuit board faces the first movable probe unit. , at a position where the printed circuit board is moved by the conveyor and the second measurement area faces the second moving probe unit, the mounted component in the second measurement area is measured with the second moving probe unit; 1. The method is characterized in that these measurements are performed sequentially, and the mounted components in the entire measurement area are measured.

(Function) In this way, the printed circuit board is divided into multiple measurement areas,
When the printed circuit board is moved by a conveyor and each measurement area corresponds to a moving probe unit provided exclusively for the measurement of that area, each mounted component in the measurement area is measured, respectively. Multiple printed circuit boards can be measured at the same time by shifting their positions. For example, when measuring three printed circuit boards, the third measurement area of the first printed circuit board is being measured with the third moving probe unit.
The measurement area of the third printed circuit board is measured by the second moving probe unit, and the first measurement area of the third printed circuit board is measured by the first moving probe unit. The time required for measurement can be reduced to 1/N, that is, 1/N, the number of divided measurement areas on the printed circuit board.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 2, in the present invention, there are n pieces of each mounted component 2 on the printed circuit board 1 to be measured, four in this embodiment.
, that is, into first to fourth measurement areas 31 to 34.

As shown in FIG. 1, on the conveyor 4 that conveys the printed circuit board 1, along the moving direction of the conveyor 4, there is a dedicated area for measuring the first to fourth measurement areas 31 to 34. First to fourth mobile probe units 51 to 54 are arranged. Each moving probe unit 51-54 is mounted on an X-direction rail 6.6 on an X-direction rail 7.6, as shown in FIG.
It is mounted movably in the X direction, and each X direction rail 77
Moving probes 8, 8 are mounted on the top so as to be movable in the X direction, and these moving probes 8, 8 are moved in the X, X directions by a servo motor to solder the target mounted component 2. The attached portion is to be measured as shown in Figure 4.

The measurement data of each of the moving probe units 51 to 54 is accumulated in the measurement unit 9 as shown in FIG. Further, movement data of each moving probe 8 to a measurement point in each moving probe unit 5 to 54 is given from the moving probe control unit 10. Furthermore, the controller 11 manages data such as measurement conditions and movement amounts for each mobile probe 8, and sequentially provides test conditions and movement amounts to the measurement unit 9 and the mobile probe control unit 10.

Next, an example of a method for measuring components mounted on a printed circuit board according to the present invention using the above board tester is shown in FIG.
) to (D).

As shown in FIG. 6(A), the first printed circuit board 11
The first measurement area 31, which is the first measurement area of
Mobile probe unit 5. When the conveyor 4 is transported to a position opposite to the conveyor 4, the conveyor 4 is temporarily stopped and each mounted component 2 in the first measurement area 31 is measured by the first movable probe unit 51, and the measurement data is collected. It is collected in the measurement unit 9.

When the measurement of the first measurement area 31 of the first printed circuit board 11 is completed, the conveyor 4 is driven, and as shown in FIG.
As shown in FIG. When the conveyor 4 is in a state facing the moving probe unit 51, the movement of the conveyor 4 is stopped, and the measurement of each mounted component 2 in the second measurement area 32 of the first printed circuit board 11 is carried out by the second moving probe unit. Performed at 52,
and the first measurement area 3 of the second printed circuit board 12
The first movable probe unit 5 measures each mounted component 2 in the first embodiment, and the obtained measurement data is transferred to the measurement unit 9.

Measurement of the second measurement area 32 of the first printed circuit board 1 and the first measurement area 3 of the second printed circuit board 1 □
When the measurement of □ is completed, the conveyor 4 is driven and the 611th
As shown in (C), the third measurement area 3. of the first printed circuit board 11. is the third mobile probe unit 5.
The second measurement area 32 of the second printed circuit board 12 faces the second moving probe unit 52, and the first measurement area 31 of the third printed circuit board 13 faces the first measurement area 32 of the second printed circuit board 12. When the conveyor 4 comes to face the moving probe unit 51, the movement of the conveyor 4 is stopped, and the first
The measurement of each mounted component 2 in the third measurement area 33 of the third printed circuit board 11 is carried out by the third moving probe unit 5. , and the measurement of each mounted component 2 in the second measurement area 32 of the second printed circuit board 12 is performed by the second moving parts unit 52, and The first movable probe unit 51 measures each mounted component 2 in the measurement area 3□, and the obtained measurement data is accumulated in the measurement unit 9.

Next, the conveyor 4 is driven, and as shown in FIG. The third measurement area 33 of the second printed circuit board 12 faces the third moving probe unit 53, and the second measurement area 33 of the third printed circuit board 13 faces the third moving probe unit 53.
2 faces the second moving probe unit 52 and the first measurement area 31 of the fourth printed circuit board 14 faces the first moving probe unit 51. Then, each mounted component 2 in the fourth measurement area 34 of the first printed circuit board 11 is measured by the fourth moving probe unit 54, and a third measurement is performed on the second printed circuit board 1□. The measurement of each mounted component 2 in the area 33 is performed by the third moving probe unit 53, and the measurement of each mounted component 2 in the second measurement area 32 of the third printed circuit board 13 is performed by the second moving probe unit 52. At the same time, each mounted component in the first measurement area 31 of the fourth printed circuit board 14 is measured by the first movable probe unit 5□, and the obtained measurement data are accumulated in the measurement unit 9.

In this step, the measurement of all the measurement areas 31 to 34 of the first printed circuit board 11 is completed, and the measurement of the second printed circuit board 12 is completed in the first to third measurement areas 31 to 33, that is, 3/3.
The measurement of the measurement area 4 is completed, and the measurement of the third printed circuit board 1. is the first to second measurement area 31 to 3□, that is, 2/4
The measurement of the measurement area of the fourth printed circuit board 14 is completed, and the measurement of the first measurement area 3I, that is, 1/4 of the measurement area of the fourth printed circuit board 14 is completed.

Therefore, since all measurements have been completed for the first printed circuit board 11, the quality of the first printed circuit board 11 is determined by combining the measurement data.

These operations are repeated in order to measure each printed circuit board.

In the above embodiment, measurements were performed using the common measurement unit 9, mobile probe control unit 10, and controller 11, but the measurement units 91 to 9 as shown in FIG.
4 and the mobile probe control unit 10. 104 can be provided corresponding to each of the mobile probe units 51 to 54, and these can also be attached to the mobile probe units 51 to 54, respectively, and controlled by the common controller 11.

In addition, in the above embodiment, each movable probe unit) 5+ to
54 uses two movable probes 8, but a structure having two or more movable probes 8 is also possible.

(Effects of the Invention) As explained above, in the method for measuring components mounted on a printed circuit board according to the present invention, the printed circuit board is divided into a plurality of measurement areas, and the printed circuit board is moved by a conveyor to Since each mounted component in the measurement area is measured respectively when corresponding to the movable probe unit provided for measurement, a plurality of printed circuit boards can be measured at the same time by shifting their positions. When multiple printed circuit boards are measured simultaneously using this method, the time required to measure one printed circuit board is reduced to 1/N, the number of divided measurement areas on the printed circuit board.
, that is, it can be shortened to 1/N, and measurements can be carried out efficiently.

4. 5th floor of zi tube FIG. 1 is a side view showing an example of an apparatus for carrying out the measurement method according to the present invention, and FIG. 2 is a plan view showing how the measurement area of a printed circuit board, which is the object of measurement in the present invention, is divided. , FIG. 3 is a plan view showing an example of the moving probe unit used in the present invention, FIG. 4 is a side view showing the state of measurement of a printed circuit board by the moving probe unit, and FIG. 5 is a plan view showing an example of the moving probe unit used in the present invention. 6(A) to 6(D) are explanatory diagrams showing the measurement process of each measurement area according to this embodiment. FIG. 7 is another example of the board tester used in the present invention. FIG.

1. Printed circuit board, 11-14... 1st to 4th printed circuit board, 2.
...Mounted components, 31-34...First to fourth measurement areas, 51-54
...first to fourth moving probe units, 6...X direction rail, 7...Y direction rail, 8...
- Moving probe, 9.91-94...Measurement unit, 10.10+-104...Moving probe control unit, 11...Controller.

Claims (1)

[Claims] The printed circuit board is divided into first to nth measurement areas, and the first to nth measurement areas are dedicated for measuring the first to nth measurement areas along the moving direction of the conveyor that conveys the printed circuit board. A movable probe unit is arranged, and the mounted component in the first measurement area is measured with the first movable probe unit at a position where the first measurement area of the printed circuit board faces the first movable probe unit. , at a position where the printed circuit board is moved by the conveyor and the second measurement area faces the second moving probe unit, the mounted component in the second measurement area is measured with the second moving probe unit; A method for measuring mounted components on a printed circuit board, characterized in that these measurements are sequentially performed to measure mounted components in all measurement areas.