JPH04509U - - Google Patents
Info
- Publication number
- JPH04509U JPH04509U JP4130190U JP4130190U JPH04509U JP H04509 U JPH04509 U JP H04509U JP 4130190 U JP4130190 U JP 4130190U JP 4130190 U JP4130190 U JP 4130190U JP H04509 U JPH04509 U JP H04509U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- groove
- view
- ceramic
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Description
第１図はこの考案の一実施例によるセラミツク
の平面図、第２図は第１図のセラミツクを複数個
にブレイクした状態を示す平面図、第３図は第１
図に示すＡ，Ａにおける断面図、第４図は第３図
に示すＢ部の拡大断面図、第５図は従来のセラミ
ツクの平面図、第６図は第５図のセラミツクを複
数個にブレイクした状態を示す平面図、第７図は
第５図に示すＣ，Ｃにおける断面図、第８図は第
６図に示すＤ部の拡大斜視図である。
図において、１は基板、３は溝である。なお、
図中、同一符号は同一、又は相当部分を示す。
Fig. 1 is a plan view of a ceramic according to an embodiment of this invention, Fig. 2 is a plan view showing a state in which the ceramic shown in Fig. 1 is broken into a plurality of pieces, and Fig.
4 is an enlarged sectional view of part B shown in FIG. 3, FIG. 5 is a plan view of a conventional ceramic, and FIG. 6 is a cross-sectional view of the ceramic shown in FIG. FIG. 7 is a plan view showing the broken state, FIG. 7 is a sectional view taken along lines C and C shown in FIG. 5, and FIG. 8 is an enlarged perspective view of section D shown in FIG. 6. In the figure, 1 is a substrate and 3 is a groove. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
セラミツクにおいて、上記溝の構造が基板端ほど
深くなる湾曲構造となつていることを特徴とする
セラミツク。 1. A ceramic in which a groove for breaking is formed in a substrate, wherein the groove has a curved structure that becomes deeper toward the edge of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4130190U JPH04509U (en) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4130190U JPH04509U (en) | 1990-04-17 | 1990-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04509U true JPH04509U (en) | 1992-01-06 |
Family
ID=31551850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4130190U Pending JPH04509U (en) | 1990-04-17 | 1990-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04509U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235670A (en) * | 2007-03-22 | 2008-10-02 | Rohm Co Ltd | Manufacturing method of chip resistor |
| JP2013207065A (en) * | 2012-03-28 | 2013-10-07 | Denso Corp | Ceramic substrate manufacturing method |
-
1990
- 1990-04-17 JP JP4130190U patent/JPH04509U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235670A (en) * | 2007-03-22 | 2008-10-02 | Rohm Co Ltd | Manufacturing method of chip resistor |
| JP2013207065A (en) * | 2012-03-28 | 2013-10-07 | Denso Corp | Ceramic substrate manufacturing method |