JPH0451200U - - Google Patents
Info
- Publication number
- JPH0451200U JPH0451200U JP9300790U JP9300790U JPH0451200U JP H0451200 U JPH0451200 U JP H0451200U JP 9300790 U JP9300790 U JP 9300790U JP 9300790 U JP9300790 U JP 9300790U JP H0451200 U JPH0451200 U JP H0451200U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- backup
- supported
- base
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 2
Description
第１図及び第５図乃至第７図は本考案を適用し
た基板バツクアツプ装置の動作図、第２図乃至第
４図は基板バツクアツプ装置の動作図である。
１８……基板搬送コンベア、２１……テンプレ
ート保持台、２８……バツクアツプベース、３０
……駆動用シリンダ、３１……バツクアツプピン
、３２……装着ノズル、４０……貫通穴、４１…
…テンプレート（調整部材）。
1 and 5 to 7 are operational diagrams of a substrate backup device to which the present invention is applied, and FIGS. 2 to 4 are operational diagrams of the substrate backup device. 18...Substrate transport conveyor, 21...Template holding stand, 28...Backup base, 30
...Driving cylinder, 31...Backup pin, 32...Mounting nozzle, 40...Through hole, 41...
...Template (adjustment member).
Claims (1)
押し上げて基板を水平に保持させる基板バツクア
ツプ装置に於いて、前記基板の鉛直下方に配置さ
れ前記基板と対向する面に複数の穴が配設された
バツクアツプベースと、前記基板支持具に支持さ
れた前記基板を下面から支持するもので該穴の適
数箇所に前記バツクアツプベースから上の高さが
同一となるようその段差形成部が前記バツクアツ
プベース上面に係止され且つそのままの状態で引
き抜くことができるように挿入されるバツクアツ
プピンと、前記バツクアツプベース下方に配置さ
れるテーブルと、基板厚の違う基板を扱う場合に
該テーブル上に載置されて前記バツクアツプピン
の段差形成部を前記バツクアツプベース上面より
浮き上がらせて高さ調整すると共に基板下面に先
付けされた部品がある場合にその部品下方位置に
あるバツクアツプピンをその穿設された貫通穴内
に入り込ませて他のバツクアツプピンより低くす
る調整部材とを設けたことを特徴とする基板バツ
クアツプ装置。 In a substrate backup device that holds the substrate horizontally by pushing up the substrate whose end is supported by a substrate supporter from below, a plurality of holes are arranged vertically below the substrate and on a surface facing the substrate. The backup base supported by the substrate support and the substrate supported by the substrate support are supported from below, and step forming portions are formed at an appropriate number of locations in the hole so that the height above the backup base is the same. A backup pin that is inserted into the upper surface of the backup base so that it can be pulled out as it is, a table that is placed below the backup base, and a table that is used when handling substrates with different thicknesses. The step forming part of the back up pin placed on the board is raised above the upper surface of the back up base to adjust the height, and when there is a component previously attached to the bottom surface of the board, the back up pin located at a position below the component is removed from the hole. 1. A substrate backup device, comprising: an adjustment member that is inserted into a through-hole to make the backup pin lower than other backup pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9300790U JPH0451200U (en) | 1990-09-03 | 1990-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9300790U JPH0451200U (en) | 1990-09-03 | 1990-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451200U true JPH0451200U (en) | 1992-04-30 |
Family
ID=31829892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9300790U Pending JPH0451200U (en) | 1990-09-03 | 1990-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021014702A1 (en) * | 2019-07-19 | 2021-01-28 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting device |
-
1990
- 1990-09-03 JP JP9300790U patent/JPH0451200U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021014702A1 (en) * | 2019-07-19 | 2021-01-28 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting device |
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