JPH0451601A - Case for high frequency amplifier - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency amplifier housing for accommodating a high frequency amplifier circuit.

[Prior art] GaA is generally used as an active element used in the microwave band.
s field effect transistors (GaAsFETs) are known. In recent years, there has been a trend toward higher gain and higher bandwidth, and Ga
A high-frequency amplifier circuit that functions as a single high-frequency amplifier is constructed by combining several types of AsFETs with passive elements, etc., and this high-frequency amplifier circuit is housed in a housing to realize a wideband, high-gain high-frequency amplifier. ing.

A conventional high-frequency amplifier is shown in Fig. 2. Fig. 2 (a) is a plan view with a portion of the lid body cut away, and Fig. 2 (b) is a plan view taken along A-A.
I! FIG.

Book #10 of the casing has four parts for mounting a high frequency amplification circuit. The high frequency amplifier circuit is composed of a plurality of high frequency circuit units. Each high frequency circuit unit composed of GaAsPET, passive elements, etc. is formed on a dielectric substrate 14 made of alumina or the like. Dielectric substrate 14
is mounted on a metal carrier 12, and the carrier 12 is fixed to the bottom of the recess of the main body 10 by a screw 16. Each high-frequency circuit unit is connected to the signal conductor surface on each dielectric substrate 14 by soldering or thermocompression bonding using a connecting ribbon (not shown). An input connector 18 and an output connector 19 are provided, and the opening of the concave portion of the main body 10, in which the high frequency circuit unit is connected to the input connector 18 and the output connector 19, is sealed by a lid body 20.

The structure of the casing of the conventional high-frequency amplifier configured as described above is determined by the number and size of the high-frequency circuit units to be accommodated. In particular, the spacing 1 between the side walls of the main body 10 of the housing depends on the dimensions of the carrier 12.

[Problems to be Solved by the Invention] However, as the operating frequency of a high-frequency amplifier increases and the wavelength becomes extremely short, the spacing between the side walls and the depth of the recess in the recess of the main body 10 of the housing become relative to the wavelength of the operating frequency signal. This causes problems such as propagation of the waveguide mode and resonance, causing the device to malfunction as a high-frequency amplifier.

The present invention has been made in consideration of the above circumstances, and it is an object of the present invention to provide a high frequency amplifier housing that allows a high frequency amplifier circuit to operate normally without propagation of waveguide mode or resonance.

[Means for Solving the Problems] The above object is to provide a conductive main body in which a recessed portion in which a high frequency amplification circuit is placed is formed at the bottom, and an input terminal and an output terminal of the high frequency amplification circuit are provided on opposing side walls. and a conductive lid that seals the opening of the recess of the main body to form a cavity above the high frequency amplifier circuit, wherein the input terminal and the output terminal are connected to the lid. Achieved by a high frequency amplifier housing characterized in that a convex portion is formed such that the length of the hollow portion in the direction perpendicular to the direction is one-half or less of the wavelength of the highest frequency signal used by the high frequency amplifier circuit. be done.

[Function] According to the present invention, the convex portion is provided on the lid body so that the length of the hollow portion in the direction perpendicular to the direction in which the input terminal and the output terminal are connected is made equal to or less than half the wavelength of the frequency signal used. Therefore, the high frequency amplifier circuit can be operated normally without waveguide mode propagation or resonance occurring.

[Embodiment] A high-frequency amplifier using a high-frequency amplifier housing according to an embodiment of the present invention is shown in FIG. 1. FIG. b) is a sectional view taken along line A-A. In the conventional high frequency amplifier shown in FIG. 2, the same components are given the same reference numerals and their explanations will be omitted.

In this embodiment, metal protrusions 20a and 20b are formed on the lid 20 of the high-frequency amplifier housing, and the length 1' of the cavity 22 on the high-frequency circuit unit on the dielectric substrate 14 corresponds to the frequency signal used. wavelength λ or less. In other words, the direction (
The length f' of the cavity 22 in the left-right direction in FIG. ing. Note that the length of the cavity 22 includes the length of the main body 10 in the depth direction, and the structure of the lid 20 is determined so that this length is also 1/2 or less of the wavelength λ.

As described above, according to this embodiment, since the length of the cavity is less than 1/2 of the wavelength of the frequency signal used, the high frequency amplifier circuit can operate normally without propagation of the waveguide mode or resonance. I can do it. Moreover, since the length of the cavity is determined by the convex part of the lid, even if the wavelength of the high-frequency signal used changes, just by changing the shape of the lid, it is extremely easy to create a high-frequency amplifier suitable for the high-frequency signal used. It is possible to realize a housing for

The present invention is not limited to the above-mentioned embodiments, but various modifications are possible.

For example, in the above-mentioned example, one high-frequency amplifier was configured by five carriers, but the number of carriers may be any number.

[Effects of the Invention] As described above, according to the present invention, the convex portion is provided on the lid body, and the length of the cavity in the direction perpendicular to the direction connecting the input terminal and the output terminal is set to 2 times the wavelength of the frequency signal used. I reduced it to less than 1/2, so
The high frequency amplifier circuit can be operated normally without propagation of waveguide mode or resonance.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a high frequency amplifier using a high frequency amplifier housing according to an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional high frequency amplifier. In the figure, 10...Main body 2...Carrier 4...Dielectric substrate 6...Screw 8...Input connector 9...Output connector 0...Lid body Oa, 20b... Convex part 2... hollow part

Claims (1)

[Claims] 1. A conductive main body is formed with a recess on the bottom of which a high frequency amplification circuit is placed, and an input terminal and an output terminal of the high frequency amplification circuit are provided on opposing side walls. A high frequency amplifier housing having a conductive lid that forms a cavity above a high frequency amplifier circuit, wherein the lid has a length of the cavity in a direction perpendicular to a direction connecting the input terminal and the output terminal. A casing for a high frequency amplifier, characterized in that a convex portion is formed such that the wavelength is one-half or less of the wavelength of the highest frequency signal used in the high frequency amplifier circuit.