JPH0496501A - Microwave device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a microwave device in which a carrier on which microwave circuit elements are mounted is housed in a housing.

[Prior Art] Microwave devices such as microwave amplifiers, which were conventionally constructed using three-dimensional circuits such as waveguides, have recently been replaced with microwave hybrid integrated circuits (Microwave hybrid integrated circuits).
dIntegrated C1rcuit=M I
As for C), higher performance, smaller size, lighter weight, and higher reliability are progressing.

Microwave devices, such as microwave amplifiers, are configured to combine microwave circuit elements such as FETs, striplines, diodes, and capacitors to achieve desired functions such as amplification, oscillation, and modulation.

Each microwave circuit element is mounted on a carrier to constitute a plurality of microwave device units, and these microwave device units 1 are coupled and housed in one housing to configure a microwave device.

A conventional microwave device is shown in FIG. The figure (a) is a plan view, the figure (b) is a sectional view taken along the line A-A, and the figure (C) is a B-
It is a sectional view taken along the B line.

A recess 10a is formed in the housing 10 in order to place a microwave circuit element therein. The microwave circuit element is composed of a plurality of carriers 12 on which microwave device units are mounted. Each carrier 12 is composed of a grounding metal substrate 12a and a dielectric substrate 12b made of alumina or the like. Ga
Each microwave device unit constituted by AsFET, passive elements, etc. is formed on a dielectric substrate 12b, and this dielectric substrate 12b is mounted on a grounding metal substrate 12a.

The carrier 12 is inserted into the recess 10 of the housing 10 for easy attachment and detachment.
It is fixed to the bottom of a by a screw 14. Each carrier 12
The signal conductor surfaces on the dielectric substrate 12 are connected using a connecting ribbon 16 by soldering or thermocompression bonding. An input connector 18 and an output connector 20 for high frequency are provided on opposing side walls of the housing 10, and a microwave device unit is connected to the input connector 18 and the output connector 20.

The structure of the casing 10 of the microwave device is determined by the size of the carrier 12 to be accommodated. carrier 12 to housing 1
0, it is necessary to secure an area on the grounding metal substrate 12a for the screw fixation.

The recess 10a of the casing 10 is formed to be slightly larger than the width of the grounding metal substrate 12a so that the carrier 12 is housed therein.

In the microwave device configured in this way, resonance in the space above the microwave circuit element becomes a problem. In other words, when the cutoff frequency of the waveguide mode determined by the inner wall spacing (and depth h) of the four parts 10a of the housing 10 approaches the maximum frequency used in the microwave circuit element, the characteristics of the microwave device will be significantly affected. Therefore, the housing 10 is designed so that the cut-off frequency is higher than the maximum frequency used.
recess], it is necessary to determine the inner wall spacing and depth h of Oa.

In recent years, the maximum frequency used by microwave devices has become higher and higher, and it is necessary to shorten the inner wall spacing of the recess 10a of the housing 10. As mentioned above, the size of the recess 10a is determined by the size of the grounding metal substrate 12a, and it is necessary to ensure a screw fixing area in the grounding metal substrate 12a.

Therefore, there was a problem in that the microwave circuit element itself had to be highly integrated and extremely small.

In order to solve this problem, a microwave device as shown in FIG. 4 has been proposed. The same figure (a) is a plan view, the same figure (b)
) is a sectional view taken along line B-B.

In this microwave device, the recess 1 of the housing 10. By attaching the metal block 22 to Oa with the screw 23,
The width 1' of the space above the microwave circuit element is the recess 10a.
The width is set to be smaller than 1. Therefore, it is sufficient to integrate the microwave circuit elements so that the width is within 1'.

[Problems to be Solved by the Invention] However, such a microwave device requires an additional area for fixing the metal block 22 with a screw.
The housing 10 itself becomes larger, and the microwave device becomes smaller.
There was a problem that it was difficult to reduce the weight.

On the other hand, in the microwave apparatus shown in FIGS. 3 and 4, in order to reduce the influence of the connecting portion of the carriers 12, as shown in FIG. gap 24 needs to be formed. However, due to the processing precision of the casing 10 and the carrier 12, a gap 26 is formed between the grounding metal substrate 12a of the carrier 12 and the casing 10, as shown in FIG. There was a problem that I could either get it or not.

In order to solve this problem, a method has been proposed in which the gap 26 is filled with a conductive adhesive, but this method is difficult to perform in practice and has the problem that it is difficult to always obtain a gap 24 of an accurate predetermined width.

A first object of the present invention is to provide a microwave circuit element that can be made smaller and lighter as a whole without significantly affecting the characteristics of the element.

A second object of the present invention is to provide a microwave circuit element that can reduce the influence of the connection portion of the carrier without being affected by the processing accuracy of the casing or carrier.

[Means for Solving the Problems] The first object is to form a through hole opening in a first facing surface facing a microwave circuit element and an input/output terminal for inputting and outputting a microwave signal. a conductive casing provided with an input/output terminal on a second opposing surface; a lid body that closes an opening on one side of the first opposing surface; and a main surface of the microwave circuit element. A conductive carrier is mounted with a microwave circuit element housed in the through hole, and a first
a carrier attached to the housing so that the opening on the other side of the facing surface is closed; a signal connection conductor that connects the input/output terminal and the microwave circuit element and is housed within the housing;
This is achieved by a microwave device characterized in that it includes a ground connection conductor that connects the carrier and the casing and is provided outside the casing.

The second purpose is to connect the input/output terminals and the microwave circuit elements, to connect the signal connection conductor housed inside the housing, to the carrier and the housing, and to connect the grounding conductor provided outside the housing. This is achieved by a microwave device characterized in that the connecting conductor is a metal ribbon or metal wire.

[Function] According to the present invention, the width of the space above the microwave circuit element can be narrowed without increasing the size of the casing itself, so the overall size can be reduced without affecting the element characteristics. It is possible to reduce the size and weight of the product.

Further, according to the present invention, the influence of the connection portion of the carrier can be reduced without being affected by the processing accuracy of the casing or the carrier.

[Embodiment] FIG. 1 shows a microwave apparatus according to a first embodiment of the present invention. Figure (a) is a plan view, Figure (b) is a bottom view with the camera back removed, Figure FC) is a plan view of the camera back, Figure (d) is a top view of the camera back.
) is a sectional view taken along the line B-B, and (e) is an exploded view.

Components that are the same as those of the conventional microwave apparatus shown in FIGS. 3 and 4 are designated by the same reference numerals, and description thereof will be omitted.

In this embodiment, this through hole 10b is formed for storing a plurality of carriers in the medium heat of the casing 10.
b is wider on the back side of the housing 1 (,) than on the front side, with a narrow part 10C on the back side and a wide part 1 on the back side.
A mounting step portion 10e for accommodating the carrier 12 is formed at the boundary 0d.

With the dielectric substrate 12b on which the microwave circuit element is formed facing upward, the carrier 12 is inserted into the through hole 1 from the wide portion 10d.
．． Store it in Ob. Screw the grounding metal board 12a to the mounting step 10e with screws 1 and '1 from the back side, and attach the carrier 12 to the housing.

The carrier 12 is grounded through the back cover 30.

A soft metal plate 30a is attached to the center surface side of the back M30. By pressing this back cover 30 onto the carrier 12 from the back side, each carrier 12 is commonly connected and grounded. In addition, if necessary, use conductive adhesive to attach the back cover 3.
The soft metal plate 30a of the carrier 12 is connected to the grounding metal plate 1.0 of the carrier 12.
2 You may also adhere to a. The carrier 12 can be grounded more reliably.

In this way, according to this embodiment, a through hole with a wide part and a narrow part is formed in the housing, and the carrier is attached to the mounting step formed at the boundary between the wide part and the narrow part. The width of the space above the microwave circuit element can be narrowed to the necessary minimum without increasing the size of the casing itself, without affecting the characteristics of the microwave device.

A microwave apparatus according to a second embodiment of the invention is shown in FIG. FIG. 5(a) is a plan view, fb) is a bottom view, fc) is a sectional view taken along the line AA, and FIG. 4(d) is a sectional view taken along the line BB. The same 1.1ffl elements as in the microwave device of FIG. 3 are given the same reference numerals, and the explanation thereof will be omitted.

In this embodiment, the present invention is applied to the conventional microwave device shown in FIG. A recess 10 is provided on the surface side of the casing 10.
a is formed, and this recess 3. A carrier 12 is placed on Qa. The casing 1 of this embodiment is arranged so that the back surface of the grounding metal substrate 12a of the carrier 12 placed thereon is exposed.
0 has a ground wiring hole 10f formed therein. The grounding metal substrate 12 of the carrier 12 is connected to the grounding wiring hole 10f.
A are commonly connected by a connecting ribbon 32 and grounded.

Note that the connection ribbon 32 also connects between the grounding metal substrates 12a of the carrier 12 at both ends and the casing 10.

In this way, according to this embodiment, the hole for ground wiring is formed on the back side of the casing, and the grounding metal board of the carrier is connected from the back side with a connecting ribbon for grounding. The reproducibility of the stripline is improved without affecting accuracy, and the ground connection can be made reliably, and the influence of the connection part of the carrier can be reduced.

The present invention is not limited to the above embodiments, and various modifications are possible.

For example, in the first embodiment, the back cover is used to ground the carrier, but as in the second embodiment, the carrier may be connected to the ground using a connecting ribbon.

Further, in the above embodiment, the microwave device was configured with five carriers, but the number of carriers may be two or more.
It's also good to say goodbye.

Wear.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a microwave device according to a first embodiment of the present invention, FIG. 2 is a diagram showing a microwave device according to a second embodiment of the present invention, and FIG. 3 is a diagram showing a conventional microwave device. FIG. 4 is a diagram showing a conventional microwave device, and FIG. 5 is an enlarged sectional view of a carrier connection portion of the conventional microwave device. [Effects of the Invention] As described above, according to the present invention, the width of the space above the microwave circuit element can be narrowed without increasing the size of the casing itself, so that the element characteristics are not affected. The entire structure can be made smaller and the eaves can be made smaller without any effort. Further, according to the present invention, the influence of the connecting portion of the carrier can be reduced without being affected by the machining accuracy of the casing or carrier. ...Through hole 10c...Narrow portion 10d...Wide portion 10e...Mounting stepped portion 10f...Ground wiring hole 2...Carrier 2a...Grounding metal board 2b...Dielectric Body board 4...Screw 6...Connection ribbon 8...Input connector 0...Output connector 2...Metal block 3...Screw 4...Gap 6...Gap 0 ... Back cover Oa ... Soft metal plate 2 ... Connection ribbon

Claims (4)

[Claims] 1. A microwave circuit element, an input/output terminal for inputting/outputting a microwave signal, a through hole opening in a first opposing surface, and the input/output terminal provided in a second opposing surface. a conductive casing with a conductive casing; a lid that closes an opening on one side of the first opposing surface; and a conductive carrier with the microwave circuit element mounted on its main surface, the carrier comprising: a carrier attached to the housing so that the circuit element is housed in the through hole and an opening on the other side of the first opposing surface is closed; and a connection between the input/output terminal and the microwave circuit element. death,
A microwave device comprising: a signal connection conductor housed in the housing; and a ground connection conductor connecting the carrier and the housing and provided outside the housing. 2. 2. The microwave device according to claim 1, wherein the width of the through hole in which the microwave circuit element is housed in a direction parallel to the second opposing surface is equal to 1 wavelength corresponding to the frequency of the microwave signal. A microwave device characterized in that: /2 or less. 3. 2. The microwave device according to claim 1, wherein the signal connection conductor and the ground connection conductor are metal ribbons or metal wires. 4. 4. The microwave device according to claim 3, wherein the signal connection conductor is formed on the main surface side of the carrier, and the ground connection conductor faces the signal connection conductor on the opposite side of the main surface of the carrier. A microwave device characterized by being formed at a position.