JPH0451869B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention forms the wiring layers that form the conductor circuits of a printed wiring board by dividing them into a vertical wiring pattern layer and a horizontal wiring pattern layer, and connects the layers with through holes. Regarding a method for manufacturing a pattern film required when manufacturing a printed wiring board, in particular, a method for manufacturing a pattern film that allows easy modification of pattern film creation data that is the basis of this pattern film. It is related to. (Prior Art) In order to form a necessary conductor circuit on a printed wiring board, no matter what method is used, there must be something that will become the basis of the conductor circuit. Usually, a material corresponding to the conductive circuit, that is, a pattern film on which a pattern is drawn, is used as the source of the conductive circuit. To create this pattern film, it is necessary to create pattern film creation data, which is the basis of the pattern film, from a given circuit diagram.
In other words, in order to form the conductor circuits necessary for printed wiring boards, it is necessary to first create pattern film creation data from the circuit diagram, and then create a pattern film from this pattern film creation data. By using a pattern film, it is finally possible to form the necessary conductive circuits on a printed wiring board. These steps must be taken to
This is because it is difficult to form a conductor circuit directly on a printed wiring board using the circuit diagram as it is, and it is difficult to form a conductor circuit directly on a printed wiring board. This is because conductor circuit design must be performed. As a method for creating data for creating a pattern film from the given circuit diagram and further creating a pattern film from the data for creating the pattern film, the following method has generally been adopted. First, from a given circuit diagram, data for creating a pattern film is created using a CAD system (usually a system that includes a digitizer and automatic design), while taking into account the placement of parts and the layout of the pattern. The data for creating a pattern film corresponding to the vertical wiring pattern and the horizontal wiring pattern are created as data for creating a pattern film, and based on this data for creating a pattern film, two types of patterns are created: a vertical wiring layer pattern or a horizontal wiring layer pattern of the board. It creates a film. In recent years, printed wiring boards have been developed by dividing a large number of conductor circuits into vertical and horizontal sections, and by connecting the necessary conductor circuits using through holes, etc.
Compared to the previous method in which conductor circuit patterns were formed on a single layer with both vertical and horizontal patterns, it became possible to use a pair of wiring layers on the board more efficiently, but for this type of printed wiring board, However, the need for fine patterning is increasing, and the number of patterns used to construct conductive circuits is increasing. Moreover, it is necessary to connect the necessary parts of the conductor circuit with through holes, and as the patterns become more complex and intertwined, the number of through holes and conductor circuits becomes extremely large. It turns out. As this progresses, it is no longer possible to sufficiently meet the demand for fine pattern formation by simply dividing the conductor circuits into each layer of the board or connecting the conductor circuits in each layer with through holes. It's coming. The actual state of such conventional technology will be specifically explained with reference to the drawings as follows. Third
Figure 6 and Figure 6 schematically show a part of the pattern formed on each layer (in this case two layers) of the printed wiring board. A horizontal pattern 11 on the printed wiring board is represented by a solid line, and a vertical pattern 12 on a vertical layer of the printed wiring board is represented by a dotted line. The patterns 11 and 12 are electrically connected by through holes 13 indicated by circles as necessary. In other words, in this printed wiring board, when a single conductor circuit that should be electrically continuous is changed in direction, conduction is established with other layers of the board through a through hole at the point of displacement. In the case of the examples shown in FIGS. 3 and 6, two conductor circuits indicated by the symbol are shown as conductor circuits. However, the conductor circuit of , even if it does not pass through the route shown in Figure 3 with respect to the conductor circuit of ,
For example, it is easy to understand that the route shown in FIG. 6 may be used. The traditional pattern is the third
The reason why only the path shown in the figure could be taken is because both patterns 11 and 12 were completely divided into vertical and horizontal directions, and the through holes were not selected sufficiently. . What can be easily understood by comparing FIG. 3 and FIG. 6 is the difference in number of through holes in particular. If there are many through holes like the pattern in Figure 3,
Through-holes are drilled using a drill, but this increases the work time and wear of the drill during the drilling process, leading to an increase in the cost of manufacturing the board. Furthermore, the yield of printed wiring boards after completion is also extremely poor. Normally, through-holes are formed through many processes such as drilling holes in the board and through-hole plating, and the more through-holes that require these many steps, the more defective parts there will be. It is. This becomes noticeable when a fine pattern is formed on a printed wiring board with a large number of conductor circuits. In view of the above-mentioned circumstances, the inventors have newly discovered that the number of through holes can be greatly reduced by simply changing the route of the conductor circuit, and have completed the present invention. (Problems to be Solved by the Invention) The present invention has been made based on the above-mentioned circumstances, and the problems to be solved by the present invention are as follows: This is a waste of holes and the resulting inefficiency in fine patterning. The purpose of the present invention is to provide a method that eliminates such wasteful through holes and uses existing simple equipment to efficiently create a pattern film with no waste at a low cost. It is about providing. In particular, the present invention
The purpose of the present invention is to provide a method for creating a pattern film for printed wiring boards, which facilitates the checking of pattern film creation data, reduces checking time, and improves the reliability of the finished product. That is. (Means and effects for solving the problems) The means taken by the present invention to solve the above problems are as follows. When creating two types of pattern films, a vertical pattern and a horizontal pattern, for forming wiring that is formed as a pattern or a horizontal wiring pattern and is connected by a through hole formed through the substrate, Drawing line data, through-hole data, wiring target layer data, and coordinate data are each extracted from the data indicating the vertical wiring pattern and the horizontal wiring pattern, and among these four types of data,
Those forming one electrically conductive wiring pattern are recorded as first data together with the same net number, and are recorded in each of the wiring layers formed separately in the vertical wiring layer and horizontal wiring layer of the board. forming a corresponding matrix-like coordinate system, extracting data indicating the presence or absence of a pattern in the coordinate system from the first data, and storing this as second data corresponding to the first data; Searching the through-hole data for each of the net numbers from the first data, extracting a portion where through-hole data exists three times in a row, and deleting the second data corresponding to this portion, Starting from the coordinates corresponding to the first through-hole data in the second data, a search is started while avoiding data indicating presence in the second data that has not been deleted, and the search is started from the coordinates corresponding to the first through-hole data. During the time leading to the coordinates corresponding to the data, a wiring route indicating one continuous null is found through calculation processing, the first data is corrected, and the second data is again calculated from the corrected first data. A method for producing a high-density pattern film, characterized in that the first data is modified and used as pattern film production data, and a pattern film is produced from the pattern film production data. Next, the principle of the present invention will be schematically explained using the drawings. The principle used in this invention is as follows. The basic concept of this invention is that when the horizontal pattern 11 and the vertical pattern 12 formed on the horizontal wiring layer and vertical wiring layer sides of the board form one electrically continuous conductor circuit, it is not necessary to The reason is that it does not have to pass through the through hole 13. That is, for example, the conductor circuit shown in FIG. 3 is formed through three through holes 13, but this is done in such a way that it crosses other horizontal patterns 11 or vertical patterns 12 in the same plane. However, this crossing can be easily avoided without using the through hole 13 by using a conductor circuit as shown in FIG. The shape of the conductor circuit as shown in FIG. 6 was made possible because the direction was changed at an angle of 45 degrees with respect to the straight line direction.
In short, in the method of the present invention, the conductor circuit formed on the substrate is not formed entirely of vertical and horizontal straight lines such as the horizontal pattern 11 and the vertical pattern 12, but Its characteristic lies in the fact that it allows some diagonal lines to be included. In order to create such a diagonal line, specifically, since the coordinates of the first and third via holes are known from the first data, the first coordinate is the starting point, and the three A method is adopted in which a search is performed on the second data according to the type of a certain registered pattern (FIG. 11) using the coordinates of the eye as the arrival point, and the route of the wiring is determined. The method for producing a high-density pattern film for printed wiring boards according to the present invention based on the above principle will be described in detail below. The method according to the present invention mainly passes through steps (A) to (H) in the flowchart shown in FIG. This is a detailed description of each step of the flowchart shown in FIG. 2, particularly from step (d) to step (e). The flowchart shown in Figure 2 schematically shows each stage of creating the necessary pattern film from a given circuit diagram. A pattern design drawing is created taking into consideration the effective use of board space, the formation positions of through holes, connection terminals, etc. In step (c), data for creating a pattern film is formed from the pattern design drawing thus formed using a digitizer or the like. The pattern film creation data created in this way is inspected and corrected in steps (d) and (e). A final pattern film is created in step (F) based on the corrected pattern film creation data. Steps (d) to (e) in Figure 2 as described above.
The specific method is shown in Figure 1.
The steps (A) to (H) are explained below. In step (A), "line drawing data" which indicates where to draw a line (pattern) and "through hole data" which indicates how many through holes 13 are to be formed in which part are created from the data for creating the pattern film that has already been created. Naturally, it also extracts four types of data: ``wiring target layer data'' that indicates in which layer the wiring pattern is formed, and ``coordinate data'' that indicates the position of the wiring pattern. . The data for creating a pattern film in this case is as follows.

[Table] Here, drawn line is 0 = moves without drawing a line (pattern) drawn line is 1 = moves while drawing a line Via hole is 0 = no via hole is provided Via hole is 1 = via hole is provided each meaning. The wiring target layer is 1 = Lines are drawn in a straight line in one layer from the previous coordinates to the current coordinates.The wiring target layer is 2 = Lines are drawn in two layers in a straight line from the previous coordinates to the current coordinates. Do not draw lines on the layers. (Incidentally, if the number of via holes is 2 or more, it can be made to mean that a via hole with a diameter corresponding to that size is provided.) In step (B), step (A) The four types of data formed in the above are created and recorded as the first data with the same net number, which forms one electrically conductive wiring pattern. The same signal will pass along the wiring patterns with the same net number. The first data recorded is line drawing data,
This is a set of five types of data: through-hole data, wiring target layer data, and coordinate data. The above is step (B). Next, in step (C), a matrix-like coordinate system corresponding to each wiring layer formed separately in the horizontal wiring layer and vertical wiring layer of the board is formed, and whether or not there is a pattern in this coordinate system is formed. Data indicating nothing is calculated from the first data and is stored as second data corresponding to the first data. FIGS. 4 and 5 visually represent the second data formed in step (C). Further, in step (D), a portion where through-hole data of a certain net number exists three times in succession is extracted from the first data. Step (E) is to change the second data corresponding to the wiring from 1 to 0 based on the first data extracted in step (D). Next, in step (C), a matrix-like coordinate system corresponding to each wiring formed in each of the horizontal wiring layer and vertical wiring layer of the board is formed, and the presence or absence of a pattern is determined in this coordinate system. The data shown is calculated from the first data and corresponds to the first data. Stored as second data. This step
4 and 5 visually represent the second data formed in (C). Further, in step (D), a portion where through-hole data of a certain net number exists three times in succession is extracted from the first data. The step is to change the second data corresponding to the wiring from 1 to 0 based on the first data extracted in step (D).
(E). As a result, the second data that has been deleted is shown in FIGS. 12 and 13. This deleted second
On the data, the first via hole is the starting point 10
3, 115, the 0 part indicating no pattern is searched (1) route by route according to the pattern in FIG. 11, and the optimal route to the end points 108, 102 is determined. This is step (F). After reaching, the first data is corrected according to the adopted pattern of FIG. 11.

[Table] The first data corrected as described above takes the form as shown in FIGS. 7 and 8. Step (H) is to use the corrected first data as data for creating a pattern film, and to create a pattern film from this data for creating a pattern film. As a result, a pattern film as shown in FIG. 6 is formed, but in this pattern film, compared to the pattern film shown in FIG. 3, the number of through holes 13 is 1, which is 2. This means that the number of vertical patterns has been reduced from three to two. In other words, as a result of this modification, the pattern and through holes after the modification are simpler and fewer in number than those before the modification, which provides a greater degree of freedom in forming other wiring patterns. This has made it possible to efficiently form patterns on substrates that have limited space. Next, one embodiment of the method according to the present invention will be described in the fourteenth
A detailed explanation will be given with reference to the flowchart shown in the figure. (Example) First, a pattern design drawing is created from a given circuit diagram using a normal method, and data indicating a vertical pattern and a horizontal pattern are extracted from this pattern design drawing using a digitizer or the like. Extraction of this data is performed using a conventional method. From the data indicating the vertical pattern and horizontal pattern extracted in this way, drawn line data,
Each of the through-hole data, wiring target layer data, and coordinate data is extracted, and among these four types of data, the one that forms one electrically conductive wiring pattern is set as the first data with the same net number. Record. These data extraction and recording can be performed using conventional methods and equipment. The data thus prepared is searched and corrected according to the procedure of the flowchart shown in FIG. That is, in FIG. 14, each step from step (d) to step (e) in FIG. 2 is detailed. In FIG. 14, the net number is reset to 0, and the process moves to the step of adding 1 to this net number. In addition, in this step, it is determined whether this net number is the last one or not.
If it is the last net number, the process moves to step and the correction work is completed. In the step, if the net number is not the last one, the process moves to the step, and in this step, the first data corresponding to the net number is read. Via hole data (this data is 1 in this example) is included in the read first data.
) is repeated three times in a row. This search is performed according to the procedure described above. If the first data contains via hole data three times in a row, the through hole data 1 in the first data is corrected to 0 in step. Then, in step, a search for a path from the starting point (a) to the ending point (b) is performed from among the nine ways shown in FIG. 11, and the most suitable path is selected.
If there is no route, the process moves directly to the step. Based on the route searched in this way, the first data is corrected in step,
Move to step. In this step, the second data corresponding to the first data is corrected from 0 to 1, and the search and correction of the net number is completed. By following similar steps, all data corresponding to each net number is retrieved and corrected. (Effects of the Invention) As detailed above, in the present invention, as exemplified in the above embodiments, "vertical wiring patterns or When creating two types of pattern films, a vertical pattern and a horizontal pattern, for forming wiring that is formed as a horizontal wiring pattern and is connected by a through hole formed through the substrate, the vertical direction Drawing line data, through-hole data, wiring target layer data, and coordinate data are each extracted from data indicating wiring patterns and horizontal wiring patterns, and one wiring pattern with electrical conductivity is extracted from among these four types of data. are recorded as first data together with the same net number, and a matrix-like coordinate system corresponding to each of the wiring layers formed separately in the vertical wiring layer and the horizontal wiring layer of the board is formed. , extracting data indicating the presence or absence of a pattern in this coordinate system from the first data and storing this as second data corresponding to the first data; Search the through-hole data to extract a portion where through-hole data exists three times in a row, delete the second data corresponding to this portion, and then delete the second data in the second data. Starting from the coordinates corresponding to the through-hole data, the search is started while avoiding data indicating presence in the second data that has not been deleted, and while reaching the coordinates corresponding to the third through-hole data, Find a wiring route that shows one continuous blank through arithmetic processing, correct the first data, correct the second data again from the corrected first data, and create a pattern film from the first data. It is characterized by the fact that a pattern film is created from this data for creating a pattern film, and as a result, in the conventional method of forming a pattern film for forming a wiring pattern, there is no unnecessary Although parts corresponding to through holes and wiring patterns were formed, these extra parts can be reduced as much as possible, and high-density patterns can be efficiently formed on a board with limited space. Further, the reduction in the number of through holes that can be formed improves the yield in manufacturing the board, shortens the time for the hole-drilling process, and reduces drill wear, thereby reducing the manufacturing cost of high-density printed wiring boards. Further, according to the method of the present invention, a conventional device for creating pattern film creation data can be used as is.
In other words, the conventional device can be used to create pattern film data, and then the pattern film data can be modified to create a pattern film. Therefore, the conventional device can be used as is. It is. Therefore,
According to the method of the present invention, a high-density pattern can be efficiently formed on a substrate without having to prepare such a large amount of equipment. Furthermore, the method according to the present invention can be carried out by simply changing the data processing procedure, and moreover, it can be carried out by simply changing the part of the processing procedure that can be performed mechanically, so it is efficient. A high-density wiring pattern can be easily formed, and the manufacturing cost of this type of high-density printed wiring board can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing the steps of the method according to the present invention in accordance with the claims, and FIG. 2 is a flowchart showing the general steps from a circuit diagram to creating a pattern film. 3 is a partial plan view showing a part of the pattern before correction, FIGS. 4 and 5 are partial views showing the format of the second data corresponding to FIG. 3, and FIG. 4 is a partial plan view showing a part of the pattern before correction. FIG. 5 is a format diagram of the horizontal wiring layer of the substrate, and FIG. 5 is a format diagram of the vertical wiring layer of the board. On the other hand, FIG. 6 is a partial plan view showing a part of the pattern after correction, FIGS. 7 and 8 are partial views showing the format of the second data corresponding to FIG. 6, and FIG. 8 is a format diagram of the horizontal wiring layer of the board, and FIG. 8 is a format diagram of the vertical wiring layer of the board. 9 is a plan view of the board, FIG. 10 is a partially enlarged vertical cross-sectional view of the section XX in FIG. be. 12 and 13 are format diagrams in the middle of correcting data on the front side and back side of the board, respectively. Additionally, FIG. 14 is a flowchart illustrating the steps used to implement the method of the present invention. Explanation of symbols, 11, 12...Pattern, 13...
...Through hole.

Claims (1)

[Scope of Claims] 1. Each layer such as the front and back surfaces of a substrate constituting a printed wiring board is formed separately as a vertical wiring pattern or a horizontal wiring pattern, and is connected by a through hole formed through the substrate. When creating two types of pattern films, a vertical pattern and a horizontal pattern, for forming the wiring to be printed, line drawing data, through-hole data, and wiring target are extracted from the data indicating the vertical wiring pattern and the horizontal wiring pattern. After extracting each of the layer data and coordinate data, among these four types of data,
Those forming one electrically conductive wiring pattern are recorded as first data together with the same net number, and are recorded in each of the wiring layers formed separately in the vertical wiring layer and horizontal wiring layer of the board. forming a corresponding matrix-like coordinate system, extracting data indicating the presence or absence of a pattern in the coordinate system from the first data, and storing this as second data corresponding to the first data; Searching the through-hole data for each of the net numbers from the first data, extracting a portion where through-hole data exists three times in a row, and deleting the second data corresponding to this portion, Starting from the coordinates corresponding to the first through-hole data in the second data, a search is started while avoiding data indicating presence in the second data that has not been deleted, and the search is started from the coordinates corresponding to the first through-hole data. During the time leading to the coordinates corresponding to the data, a wiring route indicating one continuous null is found through calculation processing, the first data is corrected, and the second data is again calculated from the corrected first data. A method for producing a high-density pattern film, characterized in that the first data is modified and used as pattern film production data, and a pattern film is produced from the pattern film production data.